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JME College
中文
Journal of Mechanical Engineering
2022, Volume 58 Issue 2 Publication:20 January 2022
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Research Progress in Sintering-bonding with Nanoparticle Materials as Interlayer and Its Packaging Application
JIA Qiang, ZOU Guisheng, ZHANG Hongqiang, WANG Wengan, DENG Zhongyang, REN Hui, LIU Lei, PENG Peng, GUO Wei
Journal of Mechanical Engineering. 2022, 58 (2): 2-16. doi:
10.3901/JME.2022.02.002
Abstract
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1645
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(4185KB) (
989
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Research Progress of Structured Nano Thin-films Based Micro/Nanojoining Technologies
LIN Lushan, LIU Lei, ZOU Guisheng, LI Zhuguo
Journal of Mechanical Engineering. 2022, 58 (2): 17-25. doi:
10.3901/JME.2022.02.017
Abstract
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1004
)
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(3572KB) (
409
)
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Fabrication of Micron-Cu@Ag and Nano-Ag Particle Connection Material and Study of High Frequency Induction Rapid Sintering Method
WU Zhuohuan, LIU Wei, WEN Zhicheng, WANG Yiping, TIAN Yanhong, WANG Chunqing
Journal of Mechanical Engineering. 2022, 58 (2): 26-33. doi:
10.3901/JME.2022.02.026
Abstract
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924
)
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(2608KB) (
328
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Research on Low-temperature Bonding Technology Using Metal Nanoparticles Prepared by Magnetron Sputtering
FANG Junpeng, WANG Qian, CAI Jian, WAN Hanlin, SONG Changming, ZHENG Kai, ZHOU Yikang
Journal of Mechanical Engineering. 2022, 58 (2): 34-42. doi:
10.3901/JME.2022.02.034
Abstract
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927
)
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(3697KB) (
456
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Effect of Cu
5
Zn
8
and Sn/Ag
3
Sn/Ag Diffusion Barrier on Interface Reaction of Sn/Cu Soldering
YAO Jinye, CHEN Xiangxu, LI Hua, MA Haitao, WANG Yunpeng, MA Haoran
Journal of Mechanical Engineering. 2022, 58 (2): 43-49. doi:
10.3901/JME.2022.02.043
Abstract
(
762
)
PDF
(3174KB) (
270
)
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High Temperature Creep Behavior of Sn-Ag-Cu Solder Joints Reinforced by Graphene via Nanoindentation
LI Yuan, XU Lianyong, GAO Yu, JING Hongyang, ZHAO Lei, HAN Yongdian
Journal of Mechanical Engineering. 2022, 58 (2): 50-57. doi:
10.3901/JME.2022.02.050
Abstract
(
752
)
PDF
(724KB) (
333
)
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Nano-joining Mechanisms and Joint Reliability of Die Attachment Using Bimodal-sized Cu Nanoparticle Paste Capable of Low-temperature Pressureless Sintering
HUANG Haijun, ZHOU Minbo, WU Xue, ZHANG Xinping
Journal of Mechanical Engineering. 2022, 58 (2): 58-65. doi:
10.3901/JME.2022.02.058
Abstract
(
810
)
PDF
(3678KB) (
335
)
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Effects of Additives and Heat Treatment on the Electrical Properties of Cobalt Interconnect Plating
CHEN Shuhui, ZHANG Mengyun, TAN Lingyue, LI Ming, HANG Tao
Journal of Mechanical Engineering. 2022, 58 (2): 66-75. doi:
10.3901/JME.2022.02.066
Abstract
(
317
)
PDF
(1674KB) (
412
)
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Recent Progress of Metal/Nonmetal Nanowire Joining Technology and Its Applications
ZHANG He, WANG Shang, FENG Jiayun, MA Jingxuan, HU Xuanyi, FENG Yan, TIAN Yanhong
Journal of Mechanical Engineering. 2022, 58 (2): 76-87. doi:
10.3901/JME.2022.02.076
Abstract
(
302
)
PDF
(3347KB) (
364
)
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Research Advances of Laser-induced Micro-nano Joining Technology
WANG Lianfu, DING Ye, WANG Genwang, GUAN Yanchao, WANG Yang, YANG Lijun
Journal of Mechanical Engineering. 2022, 58 (2): 88-99. doi:
10.3901/JME.2022.02.088
Abstract
(
358
)
PDF
(2579KB) (
472
)
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Review of Power Ultrasonic Micro-nano Joining Technology for Electronic Manufacturing
ZHANG Wenwu, PAN Hao, MA Qiuchen, LI Mingyu, JI Hongjun
Journal of Mechanical Engineering. 2022, 58 (2): 100-121. doi:
10.3901/JME.2022.02.100
Abstract
(
316
)
PDF
(9484KB) (
437
)
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Research Progress on Ultraviolet Activated Low-temperature Bonding
WANG Chenxi, QI Xiaoyun, FANG Hui, KANG Qiushi, ZHOU Shicheng, XU Jikai, TIAN Yanhong
Journal of Mechanical Engineering. 2022, 58 (2): 122-135. doi:
10.3901/JME.2022.02.122
Abstract
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295
)
PDF
(5116KB) (
395
)
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Research Progress of Surface Activated Bonding at Room Temperature
ZHANG Hongze, TIAN Ye, MENG Ying, MU Fengwen, WANG Xinhua, LIU Xinyu
Journal of Mechanical Engineering. 2022, 58 (2): 136-146. doi:
10.3901/JME.2022.02.136
Abstract
(
524
)
PDF
(4115KB) (
766
)
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Research Progress of Material Removal Mechanism in Chemical Mechanical Planarization for Metal Interconnection Layer of Chips
HANG Tao, CHANG Pengfei, LI Ming
Journal of Mechanical Engineering. 2022, 58 (2): 147-158. doi:
10.3901/JME.2022.02.147
Abstract
(
321
)
PDF
(1149KB) (
501
)
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Study on Interfacial Bonding between Pressureless Sintered Silver with Electroless-plated Nickel（Phosphorus） and Electro-plated Nickel Metallization
WANG Meiyu, MEI Yunhui, LI Xin
Journal of Mechanical Engineering. 2022, 58 (2): 159-165. doi:
10.3901/JME.2022.02.159
Abstract
(
360
)
PDF
(3835KB) (
403
)
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Patterning Deposition of Nano-sliver Micro Bumps Array by Ultrafast Laser and Its Chip Packaging Research
WU Yongchao, WANG Shuaiqi, GUO Wei, LIU Lei, ZOU Guisheng, PENG Peng
Journal of Mechanical Engineering. 2022, 58 (2): 166-175. doi:
10.3901/JME.2022.02.166
Abstract
(
255
)
PDF
(5492KB) (
319
)
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Arc-fused Coating Process and Micro-joining Mechanism of NiTi Shape Memory Alloys
KE Wenchao, CONG Baoqiang, QI Zewu, AO Sansan, PANG Bowen, GUO Wei, PENG Bei, CENG Zhi
Journal of Mechanical Engineering. 2022, 58 (2): 176-184. doi:
10.3901/JME.2022.02.176
Abstract
(
291
)
PDF
(2996KB) (
257
)
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Research Progress on the Reliability of Solder Joint for Advanced Microelectronic Packaging
GAO Liyin, LI Caifu, LIU Zhiquan, SUN Rong
Journal of Mechanical Engineering. 2022, 58 (2): 185-202. doi:
10.3901/JME.2022.02.185
Abstract
(
758
)
PDF
(6489KB) (
1297
)
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Research Progress on the Influence Mechanisms of βSn Structure and Grain Orientation on the Reliabilities of Solder Joints
LI Ce, WANG Bingguang, CHANG Xufeng, MA Zhaolong, CHENG Xingwang
Journal of Mechanical Engineering. 2022, 58 (2): 203-222. doi:
10.3901/JME.2022.02.203
Abstract
(
270
)
PDF
(8061KB) (
278
)
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Advances in Metallurgical Behavior of Micro/nano-scale Cu-Sn Interface
CHEN Jieshi, WANG Jianing, ZHANG Zhiyuan, ZHANG Peilei, YU Zhishui, YU Chun, LU Hao
Journal of Mechanical Engineering. 2022, 58 (2): 223-235. doi:
10.3901/JME.2022.02.223
Abstract
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265
)
PDF
(3221KB) (
324
)
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Research Progresses on Reliability of Sn-based Solder Joints in Extreme Temperature Environment
LI Shengli, NIU Piao, HANG Chunjin, TIAN Yanhong, CUI Ning, JIANG Qian
Journal of Mechanical Engineering. 2022, 58 (2): 236-245. doi:
10.3901/JME.2022.02.236
Abstract
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262
)
PDF
(1479KB) (
309
)
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Stress Issues in 3D Interconnect Technology Using Through Glass Vias
ZHAO Jin, LI Wei, ZHONG Yi, YU Daquan, QIN Fei
Journal of Mechanical Engineering. 2022, 58 (2): 246-258. doi:
10.3901/JME.2022.02.246
Abstract
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389
)
PDF
(3063KB) (
761
)
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Size Effects of Growth and Evolution of Interfacial Intermetallic Compound and the Mechanical Behavior of Bump Structure Sn3.0Ag0.5Cu/Cu Cross-scale Joints in Electronic Packages
ZHOU Minbo, ZHAO Xingfei, CHEN Mingqiang, KE Changbo, ZHANG Xinping
Journal of Mechanical Engineering. 2022, 58 (2): 259-268. doi:
10.3901/JME.2022.02.259
Abstract
(
266
)
PDF
(2984KB) (
372
)
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Effect of Zn Content on Interfacial Reactions of Cu/Sn/Cu-xZn Micro Solder Joints
LIU Zhibin, QIAO Yuanyuan, ZHAO Ning
Journal of Mechanical Engineering. 2022, 58 (2): 269-275. doi:
10.3901/JME.2022.02.269
Abstract
(
208
)
PDF
(1728KB) (
227
)
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Simulation of SiP Solder Joint Geometry and Random Vibration Reliability Prediction
SA Zicheng, WANG Shang, FENG Jiayun, MA Jingxuan, ZHANG Ning, YU Guangliang, LIANG Jiemei, TIAN Yanhong
Journal of Mechanical Engineering. 2022, 58 (2): 276-283. doi:
10.3901/JME.2022.02.276
Abstract
(
339
)
PDF
(3263KB) (
428
)
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Effect of Trace Zn Addition on Interfacial Evolution and Mechanical Properties of Sn-58Bi/Cu Solder Joints during Aging
WANG Fengjiang, HE Qihang
Journal of Mechanical Engineering. 2022, 58 (2): 284-290. doi:
10.3901/JME.2022.02.284
Abstract
(
181
)
PDF
(2174KB) (
241
)
References
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Microstructure Evolution of Sn-3.0Ag-0.5Cu Solder Joints under Extreme Temperature Changes and Current Stressing
LI Shengli, REN Chunxiong, HANG Chunjin, TIAN Yanhong, WANG Chenxi, CUI Ning, JIANG Qian
Journal of Mechanical Engineering. 2022, 58 (2): 291-299. doi:
10.3901/JME.2022.02.291
Abstract
(
202
)
PDF
(3570KB) (
240
)
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Experiment and Numerical Simulation of Shear Creep of Cu/SAC305/Cu Microscale Solder Joints
YIN Limeng, SU Zilong, ZUO Cunguo, ZHANG Zhongwen, YAO Zongxiang, WANG Gang, WANG Shanlin, CHEN Yuhua
Journal of Mechanical Engineering. 2022, 58 (2): 300-306. doi:
10.3901/JME.2022.02.300
Abstract
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267
)
PDF
(2146KB) (
260
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Tensile Performance of Inhomogeneous Microscale Cu/Sn-58Bi/Cu Solder Joints under Electro-thermo-mechanical Coupled Loads
LI Wangyun, LI Xingmin, WANG Jian, LIANG Jingyang, QIN Hongbo
Journal of Mechanical Engineering. 2022, 58 (2): 307-320. doi:
10.3901/JME.2022.02.307
Abstract
(
257
)
PDF
(7367KB) (
257
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