Simulation of SiP Solder Joint Geometry and Random Vibration Reliability Prediction

doi:10.3901/JME.2022.02.276

Abstract

Abstract: On the issue of the reliability of System in Package (SiP) devices under vibration, ANSYS is used to simulate the process of random vibration. The material parameters of the model are corrected to obtain the random vibration fatigue life of the device. Firstly, the solder joint geometry of the gull wing lead is simulated by Surface Evolver, and the calculation result is imported into ANSYS. Sinusoidal vibration experiments are carried out under different load levels to correct material parameter. The stress at dangerous points is calculated by vibration simulation. The S-N curve is obtained by fitting the sinusoidal vibration experimental data and the simulation data. Finally, the weak points of the device are obtained through random vibration simulation. The S-N curve obtained above is utilized in the random vibration fatigue life prediction model to get the fatigue life of the SiP device. The random vibration reliability experiment and simulation results for SiP devices are introduced. A general method for fatigue life prediction is established, which provides reference for the whole machine fatigue life prediction.

Key words: solder joint geometry prediction, random vibration, reliability, finite element analysis

CLC Number:

TG156

SA Zicheng, WANG Shang, FENG Jiayun, MA Jingxuan, ZHANG Ning, YU Guangliang, LIANG Jiemei, TIAN Yanhong. Simulation of SiP Solder Joint Geometry and Random Vibration Reliability Prediction[J]. Journal of Mechanical Engineering, 2022, 58(2): 276-283.

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