Abstract: New materials and processes are the key to promote the development of advanced electronics packaging, especially for the interconnection problem of high integration, high temperature service, and high reliability. It is particularly urgent to explore materials and processes for the key "neck" technology. Power ultrasonic has the characteristics of surface cleaning, cavitation and sound flow, which can significantly improve the interface metallurgical connection ability, overcome the difficulties of the traditional transient liquid phase (TLP) connection, solve the pain point problem of easy oxidation in the interconnection process of Cu, Al, and the problems of difficult wetting of SiC, Al₂O₃, and AlN ceramic substrates and insufficient driving force of low temperature sintering of nanoparticles were also solved. Combined with the accumulation of our team in this field for many years, focusing on the application of power ultrasonic in micro/nano connection direction, the principle, method, characteristics and practical application of power ultrasonic micro/nano connection technology were summarized:ultrasonic solid phase bonding, ultrasonic composite brazing and ultrasonic nano-sintering interconnection. A new interconnection technology is proposed in the solid phase connection fields of wire bonding, room temperature ultrasonic metal connection, and ultrasonic additive manufacturing, in the brazing fields of ultrasonic medium and high temperature, and in the soldering fields of ultrasonic TLP. Finally, the ultrasonic nano-sintering connection is raised to meet the urgent needs of high-power device interconnection in the 3th generation semiconductor, the corresponding interconnection material is developed, and its joint of mechanics, thermal, electrical, and reliability are comprehensively evaluated. The research progress and trend of power ultrasonic micro-nano connection technology are also summarized.

Key words: electronic packaging, high power devices packaging, ultrasonic assisted solid-state bonding, ultrasonic assisted soldering, ultrasonic nano-sintering connection