Abstract: Micro-nano joining process is a key technique in the manufacturing, packaging, assembly and functionalization of electronic products. Because of its unique optical, electrical and thermal properties, nanowires are playing an increasingly important role in miniaturized and multifunctional micro-nano electronic devices. Therefore, the research on nanowire joining technology has become a common focus of both academia and industry. Compared with the macroscopic interconnection, the interconnection between nanowires has certain particularity in size, structure and requirements, which also gives rise to the birth and development of a variety of nanowire interconnection methods. This paper reviews the current metal/nonmetal nanowires research progress of homogeneous and heterogeneous connection, sums up the common methods of nanowires interconnection, such as thermal joining, light irradiation, electric auxiliary joining and high energy beam joining method and their mechanism, such as in flexible electronics and other applications in the field of micro-nano device packaging. The existing problems and development trend of metal/nonmetal nanowire joining technology are also discussed.

Key words: nanowires joining, homogeneous joining, heterogeneous joining, flexible electronics, micro-nano devices