Study on Interfacial Bonding between Pressureless Sintered Silver with Electroless-plated Nickel（Phosphorus） and Electro-plated Nickel Metallization

doi:10.3901/JME.2022.02.159

Abstract

Abstract: There is lacking in reports about silver sintering on the two most widely used nickel metallizations, i.e. electroless-plated nickel (phosphorous) (Ni(P)) and electro-plated nickel (Ni). In this study, we proposed a new method by pressureless in-air silver sintering on Ni, and studied the effects of sintering temperature between 220-300℃ on the bonding strength between sintered-silver and electroless-plated Ni(P) and electro-plated Ni. Furthermore, we investigated the effects of surface morphology and roughness, chemistry, crystal structure of the two Ni metallizations on the bonding strength and microstructure of the sintered silver-nickel joints. The results showed that the bonding strength of both sintered silver-nickel joints first increased and then decreased with higher sintering temperature, but the highest bonding strength on the electroless-plated Ni(P) (42 MPa) is 17 MPa higher than that on the electro-plated Ni, due to faster diffusion from P-composition and less Ni oxidation from amorphous structure of the electroless-plated Ni(P).

Key words: pressureless silver sintering, electro-plated nickel, electroless-plated nickel (phosphorous), shear strength

CLC Number:

TG156

WANG Meiyu, MEI Yunhui, LI Xin. Study on Interfacial Bonding between Pressureless Sintered Silver with Electroless-plated Nickel（Phosphorus） and Electro-plated Nickel Metallization[J]. Journal of Mechanical Engineering, 2022, 58(2): 159-165.

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