High Temperature Creep Behavior of Sn-Ag-Cu Solder Joints Reinforced by Graphene via Nanoindentation

doi:10.3901/JME.2022.02.050

Abstract

Abstract: Currently, in order to cope with the development trend of miniaturization and high density of electronic packaging industry and improve the reliability of solder joints, graphene reinforced Sn-based composite solder has become a research focus. However, most of the related studies focus on the effects of graphene on interfacial reaction and shear strength, and there are few studies on the high temperature creep behavior and constitutive equation of solder joints. In order to strengthen the conventional Sn-based solder, graphene reinforced Sn-Ag-Cu composite solder was prepared by mechanical mixing method. Then, the creep behavior of composite solder joints at high temperature is studied by nanoindentation technology, and compared with Sn-Ag-Cu joints. The experimental results showed that the creep stress relaxation occurs during the holding stage. At the same time, graphene can effectively slow down the creep strain rate of joints, inhibit grain boundary sliding, and improve the activation energy. The modified Dorn model considers the strengthening mechanisms such as dislocation strengthening, fine grain strengthening, Orowan strengthening, load transfer strengthening and the influence of temperature, which was in good agreement with the creep data obtained by nanoindentation, and verified the effectiveness of the modified model.

Key words: Sn-Ag-Cu, graphene, creep, nanoindentation, high temperature

CLC Number:

TG156

LI Yuan, XU Lianyong, GAO Yu, JING Hongyang, ZHAO Lei, HAN Yongdian. High Temperature Creep Behavior of Sn-Ag-Cu Solder Joints Reinforced by Graphene via Nanoindentation[J]. Journal of Mechanical Engineering, 2022, 58(2): 50-57.

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