Effect of Trace Zn Addition on Interfacial Evolution and Mechanical Properties of Sn-58Bi/Cu Solder Joints during Aging

doi:10.3901/JME.2022.02.284

Abstract

Abstract: The effect of trace Zn addition on the growth of interfacial IMCs and the mechanical properties of Sn-58Bi solder joints under thermal aging were investigated. The results indicated that with minor Zn addition, the interfacial IMCs changed from Cu₆Sn₅ to Cu₆(Sn, Zn)₅. When the Zn content increased to 1.0 wt%, Cu₅Zn₈ phases were formed at the interface between Sn-58Bi-1.0Zn/Cu. The addition of Zn suppressed the growth of Cu₃Sn IMCs during thermal aging. The sandwich structure of Cu₆(Sn, Zn)₅/Cu₅Zn₈/Cu₆(Sn, Zn)₅ IMCs was formed at the Sn-58Bi-0.5Zn/Cu interface after aging for 20 days. The shearing force of the solder joints decreased with the addition of Zn. However, the shearing force of Sn-58Bi-xZn solder joints were higher than that of the Sn-58Bi joints after a long time aging. The fracture mode of the solder joints changed from the ductile fracture to the mixed ductile-brittle fracture. It indicated that the long-time reliability of the solder joints was benefited from Zn addition.

Key words: Sn-Bi solder, intermetallic compounds, aging, reliability, mechanical properties

CLC Number:

TG425

WANG Fengjiang, HE Qihang. Effect of Trace Zn Addition on Interfacial Evolution and Mechanical Properties of Sn-58Bi/Cu Solder Joints during Aging[J]. Journal of Mechanical Engineering, 2022, 58(2): 284-290.

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