Research Progress on Ultraviolet Activated Low-temperature Bonding

doi:10.3901/JME.2022.02.122

Abstract

Abstract: With the diversification of electronic devices and bio-components functions, the integration of multi-materials or structures has become an integral part of device manufacturing. Reliable bonding between materials or structures with different properties can be realized at low temperature after UV (ultraviolet) activation. This efficient and simple bonding method is promising in device manufacturing in microelectronics, MEMS, optoelectronics, microfluidics, etc. Recent researches on the UV-activated low- temperature bonding methods are reviewed. Firstly, the basic properties of UV and its activation impact on the surface of organic and inorganic materials are introduced. Additionally, the UV surface activated low-temperature wafer bonding methods are introduced in microelectronics, MEMS and optoelectronics manufacturing. Moreover, the critical joining technologies in the preparation of bio-chemical components such as microfluidics and implantable devices, flexible electronics, etc., are summarized. Finally, the review provides an outlook on challenges in the UV surface activated low-temperature bonding technologies.

Key words: ultraviolet, surface activation, low-temperature bonding, wafer bonding, bonding interface

CLC Number:

TG456

WANG Chenxi, QI Xiaoyun, FANG Hui, KANG Qiushi, ZHOU Shicheng, XU Jikai, TIAN Yanhong. Research Progress on Ultraviolet Activated Low-temperature Bonding[J]. Journal of Mechanical Engineering, 2022, 58(2): 122-135.

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