2.5D-Cf/SiC复合材料超声椭圆振动辅助螺旋磨削运动学模型及材料去除机理研究

doi:10.3901/JME.2025.07.229

摘要/Abstract

摘要： 将超声椭圆振动辅助加工方法与螺旋磨削工艺相结合并将其应用到2.5D-C_f/SiC复合材料制孔上，建立了超声椭圆振动辅助螺旋磨削运动学模型和最大未变形切屑厚度模型，分析了工艺参数(主轴转速、公转转速、螺距和超声振幅)对磨粒运动轨迹的影响规律，基于SPH (光滑粒子流体动力学)方法对单颗磨粒超声振动磨削不同纤维方向的复合材料进行仿真模拟，并开展了超声椭圆振动辅助螺旋磨削制孔试验，结合数值仿真和试验结果分析了超声椭圆振动辅助螺旋磨削材料去除机理，得出材料去除过程中主要发生基体脆性断裂、界面脱粘、纤维断裂、纤维拔出，纤维对裂纹扩展具有阻碍作用，亚表面损伤裂纹倾向于沿着基体-纤维界面扩展。增大主轴转速和超声振幅可减小未变形切屑厚度，增大螺距和公转转速可提升加工效率，本研究对碳纤维陶瓷基复合材料高效、低损伤螺旋磨削提供了一定的理论与实践参考。

关键词: 超声振动磨削, 螺旋磨削加工, 去除机理, SPH磨削仿真

Abstract: The ultrasonic elliptical vibration assisted machining method was combined with helical grinding technology and applied to the hole making of 2.5D-C_f/SiC composite material. The kinematics model of ultrasonic elliptical vibration assisted helical grinding and the maximum undeformed chip thickness model were established. The influence of process parameters (spindle speed, revolution speed, pitch and ultrasonic amplitude) on the trajectory of the abrasive particles is analyzed. Based on SPH (smooth particle hydrodynamics) method, the ultrasonic vibration grinding of composite materials with different fiber directions was simulated, and the ultrasonic elliptical vibration assisted helical grinding hole making experiment is carried out. Based on the numerical simulation and experimental results, the mechanism of material removal assisted by ultrasonic elliptical vibration is analyzed. It is concluded that matrix brittle fracture, interface debonding, fiber fracture and fiber pull-out occur in the process of material removal. The fiber has an obstacle effect on the crack propagation, and the subsurface damage crack tends to propagate along the matrix-fiber interface. Increasing the spindle speed and ultrasonic amplitude can reduce the undeformed chip thickness, and increasing the pitch and revolution speed can improve the machining efficiency. This study provides a certain theoretical and practical reference for efficient and low-damage helical grinding of carbon fiber ceramic matrix composite.

Key words: ultrasonic vibration grinding, helical grinding machining, removal mechanism, SPH grinding simulation

中图分类号:

TG156

周云光, 陈晗, 邹忌, 马文敏, 马廉洁, 李明, 尹国强, 巩亚东. 2.5D-C_f/SiC复合材料超声椭圆振动辅助螺旋磨削运动学模型及材料去除机理研究[J]. 机械工程学报, 2025, 61(7): 229-244.

ZHOU Yunguang, CHEN Han, ZOU Ji, MA Wenmin, MA Lianjie, LI Ming, YIN Guoqiang, GONG Yadong. Study on Ultrasonic Elliptical Vibration Assisted Helical Grinding Kinematic Model and Material Removal Mechanism of 2.5D-C_f/SiC Composites[J]. Journal of Mechanical Engineering, 2025, 61(7): 229-244.

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