大尺寸单晶金刚石衬底抛光技术研究现状与展望

doi:10.3901/JME.2021.22.157

摘要/Abstract

摘要： 近些年来，化学气相沉积（Chemical vapor deposition，CVD）单晶金刚石在电子学领域的应用令人瞩目，这得益于CVD单晶金刚石在生长技术和半导体掺杂技术上的进展。一直以来，成熟的衬底加工技术是半导体材料得以应用的基础，其中超精密抛光作为晶圆衬底加工的最后一道工序，直接决定了晶圆表面粗糙度和亚表面损伤程度。可以预见，超精密抛光技术将会在制备大尺寸高质量金刚石衬底中发挥重要作用。对目前国内外现有的单晶金刚石抛光方法进行综述，以制备大尺寸高质量单晶金刚石衬底为目标，从加工设备、工艺参数、加工精度、加工效率和材料去除机理等方面进行分析，总结各种抛光方法的优势和缺点，展望未来大尺寸单晶金刚石衬底抛光技术的发展趋势。目前鲜有针对大尺寸单晶金刚石抛光技术的综述，本文为国内学者展开单晶金刚石抛光相关工作的研究提供综述资料。

关键词: 单晶金刚石, 抛光, 半导体衬底, 表面粗糙度, 去除机理

Abstract: Non-metallic inclusions in the matrix of metal parts are inevitable and have a serious impact on the mechanical properties of the matrix. Forging deformation is a main way to make non-metallic inclusions break and disperse in the metal matrix. Taking the common hard Al₂O₃ inclusions in steel as the research object, metal samples containing Al₂O₃ inclusions with different porosities are prepared by powder metallurgy technology combined with 3D printing cladding forming technology. The forging experiments of metal samples containing Al₂O₃ inclusions under a series of deformation conditions are carried out. The effects of porosity of inclusions and forging process parameters (deformation temperature, deformation speed and deformation path) on the crushing and dispersion behavior of Al₂O₃ inclusions are studied by observing the morphology of Al₂O₃ inclusions after deformation. The results show that the higher the porosity of inclusions, the more likely to be broken. Lowering the deformation temperature or increasing the deformation speed can promote the crushing and dispersion of Al₂O₃ inclusions with higher porosity; for Al₂O₃ inclusions with lower porosity, increasing the deformation temperature is the main way to aggravate the degree of crushing. At the same time, the complexity of the deformation path can significantly increase the crushing and promote the further dispersion of Al₂O₃ inclusions in the metal matrix.

Key words: single crystal diamond, polishing, material removal rate, surface roughness, removal mechanism

中图分类号:

TN305

温海浪, 肖平, 陆静. 大尺寸单晶金刚石衬底抛光技术研究现状与展望[J]. 机械工程学报, 2021, 57(22): 157-171.

WEN Hailang, XIAO Ping, LU Jing. Research Status and Prospect on Polishing Technology of Large Size Single Crystal Diamond Substrate[J]. Journal of Mechanical Engineering, 2021, 57(22): 157-171.

参考文献

[1] 林佳, 黄浩生. 第三代半导体带来的机遇与挑战[J]. 集成电路应用, 2017(12):85-88. LIN Jia, HUANG Haosheng. Opportunities and challenges brought by the third-generation semiconductor[J]. Integrated Circuit Application, 2017(12):85-88.
[2] 陈秀芳, 杨祥龙, 徐现刚, 等. 第3代半导体材料在5G通讯领域的发展与机遇[J]. 新材料产业, 2018, 209(1):43-46. CHEN Xiufang, YANG Xianglong, XU Xiangang, et al. Development and opportunities of the 3rd generation semiconductor materials in the 5G communication field[J]. New Materials Industry, 2018, 209(1):43-46.
[3] RAYNAUD C, TOURNIER D, HERVÉM, et al. Comparison of high voltage and high temperature performances of wide bandgap semiconductors for vertical power devices[J]. Diamond and Related Materials, 2010, 19(1):1-6.
[4] 付方彬, 金鹏, 刘雅丽, 等. MPCVD生长半导体金刚石材料的研究现状[J]. 微纳电子技术, 2016, 53(9):571-581. FU Fangbin, JIN Peng, LIU Yali, et al. Current study of MPCVD growth semiconductor diamond materials[J]. Micro Electronics, 2016, 53(9):571-581.
[5] 陈亚男, 张烨, 郁万成, 等. 金刚石半导体材料和器件的研究现状[J]. 微纳电子技术, 2017, 54(4):217-228. CHEN Yanan, ZHANG Ye, YU Wancheng, et al. Current study of diamond semiconductor materials and devices[J]. Micro Electronics, 2017, 54(4):217-228.
[6] SILVA F, ACHARD J, BRINZA O, et al. High quality, large surface area, homoepitaxial MPACVD diamond growth[J]. Diamond and Related Materials, 2009, 18(5):683-697.
[7] SCHRECK M, ASMUSSEN J, SHIKATA S, et al. Large-area high-quality single crystal diamond[J]. MRSBulletin, 2014, 39(6):504-510.
[8] UMEZAWA H, NAGASE M, KATO Y, et al. High temperature application of diamond power device[J]. Diamond and Related Materials, 2012, 24:201-205.
[9] CHICOT G, EON D, ROUGER N. Optimal drift region for diamond power devices[J]. Diamond and Related Materials, 2016, 69:68-73.
[10] LI F N, ZHANG J W, WANG X L, et al. Deep-ultraviolet detectors based on oxygen-/fluorine-terminated (100)diamond[J]. Superlattices and Microstructures, 2016, 100:258-265.
[11] SHIKATA, SHINICHI. Single crystal diamond wafers for high power electronics[J]. Diamond and Related Materials, 2016, 65:168-175.
[12] YAMADA H, CHAYAHARA A, MOKUNO Y, et al. Uniform growth and repeatable fabrication of inch-sized wafers of a single-crystal diamond[J]. Diamond and Related Materials, 2013, 33:27-31.
[13] YAMADA H, CHAYHARA A, MOKUNO Y, et al. A 2-in. mosaic wafer made of a single-crystal diamond[J]. Applied Physics Letters, 2014, 104(10):102110.
[14] YAMADA H, CHAYHARA A, UMEZAWA H, et al. Fabrication and fundamental characterizations of tiled clones of single-crystal diamond with 1-inch size[J]. Diamond and Related Materials, 2012, 24:29-33.
[15] SCHRECK M, GSELL S, BRESCIA R, et al. Ion bombardment induced buried lateral growth:The key mechanism for the synthesis of single crystal diamond wafers[J]. Scientific Reports, 2017, 7:44462.
[16] FRIEL I, CLEWES S L, DHILLON H K, et al. Control of surface and bulk crystalline quality in single crystal diamond grown by chemical vapour deposition[J]. Diamond and Related Materials, 2009, 18(5-8):808-815.
[17] 刘晓晨, 郭辉, 安晓明, 等. CVD法制备高质量金刚石单晶研究进展[J]. 人工晶体学报, 2017, 46(10):1897-1901. LIU Xiaochen, GUO Hui, AN Xiaoming, et al. Progress in the preparation of high-quality diamond single crystal by CVD method[J]. Journal of Artificial Crystallography, 2017, 46(10):1897-1901.
[18] YAMADA M, TERAJI T, ITO T. Improvement in the crystalline quality of homoepitaxial diamond films by oxygen plasma etching of mirror-polished diamond substrates[J]. Journal of Crystal Growth, 2005, 285(1-2):130-136.
[19] TALLAIRE A, KASU M, UEDA K, et al. Origin of growth defects in CVD diamond epitaxial films[J]. Diamond and Related Materials, 2008, 17(1):60-65.
[20] HIRD J R, FIELD J E. Diamond polishing[J]. Proceedings of the Royal Society A, 2004, 460(2052):3547-3568.
[21] MICHAEL M, LARS P, JONATHAN H. Taming the untamable-the art and science of diamond polishing[J]. Comprehensive Hard Materials, 2014(3):81-98.
[22] ZONG W J, LI D, CHENG K, et al. The material removal mechanism in mechanical lapping of diamond cutting tools[J]. International Journal of Machine Tools and Manufacture, 2005, 45(7-8):783-788.
[23] BUNDY F, HALL H, STRONG H, et al. Man-made diamonds[J]. Nature, 1995, 176(9):51-55.
[24] EVRESOLE W G. Synthesis of diamond:US, US3030188[P]. 1962-04-17.
[25] GLOOR S, LÜTHY W, WEBER H P, et al. UV laser polishing of thick diamond films for IR windows[J]. Applied Surface Science, 1999, 138-139(1):135-139.
[26] MACLEAN A J, BIRCH R B, ROTH P W, et al. Limits on efficiency and power scaling in semiconductor disk lasers with diamond heatspreaders[J]. Journal of the Optical Society of America B, 2009, 26(12):2228-2236.
[27] SCHUELKE T, GROTJOHN T A. Diamond polishing[J]. Diamond and Related Materials, 2013, 32(2):17-26.
[28] MALSHE A P, PARK B S, BROWN W D, et al. A review of techniques for polishing and planarizing chemically vapor-deposited (CVD) diamond films and substrates[J]. Diamond and Related Materials, 1999, 8(7):1198-1213.
[29] HANSON R, AWSCHALOM D D. Coherent manipulation of single spins in semiconductors[J]. Nature, 2008, 453(7198):1043-1049.
[30] NEBEL C E, REZEK B, SHIN D, et al. Diamond for bio-sensor applications[J]. Journal of Physics D Applied Physics, 2007, 40(20):6443-6466.
[31] ALMAVIVA S, MARINELLI M, MILANI E, et al. Thermal and fast neutron detection in chemical vapor deposition single-crystal diamond detectors[J]. Journal of Applied Physics, 2008, 103(5):570-575.
[32] MAY P W. Diamond thin films:A 21st-century material[J]. Philosophical Transactions of the Royal Society A:Mathematical, Physical and Engineering Sciences, 2000, 358(1766):473-495.
[33] HITCHINER M P, WILKS E M, WILKS J. The polishing of diamond and diamond composite materials[J]. Wear, 1984, 94(1):103-120.
[34] TOLKOWSKY. Research on the abrading, grinding or polishing of diamonds[J]. Rhode Island Medical Journal, 1920, 60(9):417-418, 454.
[35] CHEN Y, ZHANG L. Polishing of diamond materials[M]. London:Springer, 2013.
[36] COUTO M, ENEKEVORT W, WICHMAN B, et al. Scanning tunneling microscopy of polished diamond surfaces[J]. Applied Surface Science, 1992, 62(4):263-268.
[37] GRILLO S E, FIELD J E. The polishing of diamond[J]. Journal of Physics D Applied Physics, 1997, 30(2):202-209.
[38] GRILLO S E, FIELD J E, BOUWELEN F M. Diamond polishing:The dependency of friction and wear on load and crystal orientation[J]. Journal of Physics D Applied Physics, 2000, 33(8):985-990.
[39] GOGOTSI Y G, KAILER A, NICKEL K G. Pressure-induced phase transformations in diamond[J]. Journal of Applied Physics, 1998, 84(3):1299-1304.
[40] GOGOTSI Y G, KAILER A, NICKEL K G. Materials:Transformation of diamond to graphite[J]. Nature, 1999, 401(6754):663-664.
[41] PASTEWKA L, MOSER S, GUMBSCH P, et al. Anisotropic mechanical amorphization drives wear in diamond.[J]. Nature Materials, 2011, 10(1):34-38.
[42] ZONG W J, CHENG X, ZHANG J J. Atomistic origins of material removal rate anisotropy in mechanical polishing of diamond crystal[J]. Carbon, 2016, 99:186-194.
[43] DORONIN M A, POLYAKOY S N, KRAVCHUK K S, et al. Limits of single crystal diamond surface mechanical polishing[J]. Diamond and Related Materials, 2018, 87:149-155.
[44] KUBOTA A, NAGAE S, MOTOYAMA S. High-precision mechanical polishing method for diamond substrate using micron-sized diamond abrasive grains[J]. Diamond and Related Materials, 2020, 101:107644.
[45] TATSUMI N, HARANO K, ITO T, et al. Polishing mechanism and surface damage analysis of type IIa single crystal diamond processed by mechanical and chemical polishing methods[J]. Diamond and Related Materials, 2016, 63:80-85.
[46] WANG C Y, ZHANG F L, KUANG T C, et al. Chemical/mechanical polishing of diamond films assisted by molten mixture of Li NO₃ and KNO₃[J]. Thin Solid Films, 2006, 496(2):698-702.
[47] CHEN C Y, TSAI H Y, Wu C H, et al. An oxidation enhanced mechanical polishing technique for CVDdiamond films[J]. Diamond and Related Materials, 2005, 14(3-7):622-625.
[48] KÜHNLE J, WEIS O. Mechanochemical superpolishing of diamond using Na NO₃, or KNO₃, as oxidizing agents[J]. Surface Science, 1995, 340(1):16-22.
[49] KUBOTA A, FUKUYAMA S, ICHIMORI Y, et al. Surface smoothing of single-crystal diamond (100)substrate by polishing technique[J]. Diamond and Related Materials, 2012, 24:59-62.
[50] KUBOTA A, NAGAE S, TOUGE M. Improvement of material removal rate of single-crystal diamond by polishing using H₂O₂, solution[J]. Diamond and Related Materials, 2016, 70:39-45.
[51] YUAN S, HUANG J, Lu M, et al. Sub-nanoscale polishing of single crystal diamond (100) and the chemical behavior of nanoparticles during the polishing process[J]. Diamond and Related Materials, 2019, 100:107528.
[52] HAISMA J, FRANK J H M, SPIERINGS B, et al. Damage-free tribochemical polishing of diamond at room temperature:A finishing technology[J]. Precision Engineering, 1992, 14(1):20-27.
[53] THOMAS E L H, MANDAL S, BROUSSEAU E B, et al. Silica based polishing of{100}and{111}single crystal diamond[J]. Science and Technology of Advanced Materials, 2014, 15(3):035013.
[54] THOMAS E, NWLSON G W, MANDAL S, et al. Chemical mechanical polishing of thin film diamond[J]. Carbon, 2014, 68:473-479.
[55] KATO Y, UMEZAWA H, SHIKATA S, et al. Effect of an ultraflat substrate on the epitaxial growth of chemical-vapor-deposited diamond[J]. Applied Physics Express, 2013, 6(2):025506.
[56] WATANABE J, TOUGE M, SAKAMOTO T. Ultraviolet-irradiated precision polishing of diamond and its related materials[J]. Diamond and Related Materials, 2013, 39(10):14-19.
[57] AKIHISA K, TAKAHIRO T. Novel planarization method of single-crystal diamond using 172□nm vacuumultraviolet light[J]. Precision Engineering, 2018, 54:269-275.
[58] YAMAMURA K, EMORI K, SUN R, et al. Damage-free highly efficient polishing of single-crystal diamond wafer by plasma-assisted polishing[J]. CIRP Annals, 2018, 67:353-356.
[59] DENG H, ENDO K, YAMAMURA K. Plasma-assisted polishing of gallium nitride to obtain a pit-free and atomically flat surface[J]. CIRP Annals Manufacturing Technology, 2015, 64(1):531-534.
[60] DENG H, MONNA K, TABATA T, et al. Optimization of the plasma oxidation and abrasive polishing processes in plasma-assisted polishing for highly effective planarization of 4H-Si C[J]. CIRP Annals-Manufacturing Technology, 2014, 63(1):529-532.
[61] CHEN Y, ZHANG L C, TANG F. Surface integrity of PCD composites generated by dynamic friction polishing:Effect of processing conditions[J]. Diamond and Related Materials, 2012, 26:25-31.
[62] HUANG S T, ZHOU L, XU L F, et al. A super-high speed polishing technique for CVD diamond films[J]. Diamond and Related Materials, 2010, 19(10):1316-1323.
[63] FENG H B, CHEN Y Q, ZHANG L C. Polishing of CVDdiamond wafers and films[J]. Key Engineering Materials, 2013, 531-532:373-376.
[64] YUAN Z, JIN Z, KANG R, et al. Tribochemical polishing CVD diamond film with Fe Ni Cr alloy polishing plate prepared by MA-HPS technique[J]. Diamond and Related Materials, 2012, 21:50-57.
[65] 郭晓光, 刘涛, 翟昌恒, 等. 过渡金属作用下的金刚石石墨化机理研究[J]. 机械工程学报, 2016, 52(20):23-29. GUO Xiaoguang, LIU Tao, ZHAI Changheng, et al. Mechanism of diamond graphitization under transition metals[J]. Journal of Mechanical Engineering, 2016, 52(20):23-29.
[66] SUZUKI K, IWAI M, UEMATSU T, et al. Material removal mechanism in dynamic friction polishing of diamond[J]. Key Engineering Materials, 2003, 238-239:235-240.
[67] CHEN Y Q, ZHANG L C. Fast polishing of single crystal diamond[J]. Advanced Materials Research, 2010, 97-101:4096-4099.
[68] CUI Z, LI G, ZONG W. A polishing method for single crystal diamond (100) plane based on nano silica and nano nickel powder[J]. Diamond and Related Materials, 2019, 95:141-153.
[69] ZHENG Y T, YE H, THORNTON R, et al. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing[J]. Diamond and Related Materials, 2020, 101:107600.
[70] NAGASE T, KATO H, PAHLOVY S A, et al. Nanosmoothing of single crystal diamond chips by 1 ke VAr[sup+]ion bombardment[J]. Journal of Vacuum Science and Technology, 2010, 28(2):263.
[71] WEI Q, LI K D, LIAN J, et al. Angular dependence of sputtering yield of amorphous and polycrystalline materials[J]. Journal of Physics D Applied Physics, 2008, 41(17):2329-2342.
[72] MI S, TOROS A, GRAZIOSI T, et al. Non-contact polishing of single crystal diamond by ion beam etching[J]. Diamond and Related Materials, 2019, 92:248-252.
[73] LI Y, LU J, XU X P. Phase transformation of monocrystalline silicon induced by polishing with diamond abrasives[J]. IEEE Transactions on Semiconductor Manufacturing, 2015, 28:153-159.
[74] LUO Q F, LU J, XU X P. Study on the processing characteristics of Si C and sapphire substrates polished by semi-fixed and fixed abrasive tools[J]. Tribology International, 2016, 104:191-203.
[75] LU J, LUO Q F, XU X P, et al. Removal mechanism of4H-and 6H-Si C substrates (0001 and 0001-) in mechanical planarization machining[J]. Proceedings of the Institution of Mechanical Engineers, 2019, 233(1):69-76.
[76] LU J, XIAO P, TONG R L, et al. Precision polishing of single crystal diamond (111) substrates using a sol-gel (sg)polishing pad[J]. IEEE Transactions on Semiconductor Manufacturing, 2019, 32(3):341-345.
[77] LIN Y, LU J, TONG R, et al. Surface damage of single-crystal diamond (100) processed based on a sol-gel polishing tool[J]. Diamond and Related Materials, 2018, 83:46-53.
[78] 肖平. CVD单晶金刚石凝胶抛光工具的制备及应用[D]. 厦门:华侨大学, 2020. XIAO Ping. Preparation and application of gel polishing tool for CVD single crystal diamond[D]. Xiamen:Huaqiao University, 2020.
[79] OZKAN A M, MALSHE A P, BROWN W D. Sequential multiple-laser-assisted polishing of free-standing CVDdiamond substrates[J]. Diamond and Related Materials, 1997, 6(12):1789-1798.
[80] PRIESKE M, VOLLERTSEN F. Picosecond-laser polishing of CVD-diamond coatings without graphite formation[J]. Materials Today:Proceedings, 2021, 40:1-4.
[81] ZHENG X, MA Z, ZHANG L, et al. Investigation on the etching of thick diamond film and etching as a pretreatment for mechanical polishing[J]. Diamond and Related Materials, 2007, 16(8):1500-1509.
[82] 王成勇, 郭钟宁, 陈君. 旋转电极电火花抛光金刚石膜[J]. 机械工程学报, 2002(38):168-171. WANG Chengyong, GUO Zhongning, CHEN Jun. Electrospark polished diamond film[J]. Journal of Mechanical Engineering, 2002(38):168-171.
[83] CHU X Q, ZUO D W. Polishing of B doped diamond films by electrical discharge machining[J]. Chinese Journal of Vacuum Science and Technology, 2011, 31(3):287-291.
[84] DUBEY A K, YADAVA V. Laser beam machining-Areview[J]. International Journal of Machine Tools and Manufacture, 2008, 48(6):609-628.
[85] SATO Y, KAWAMURA J, NAGASE T, et al. Sharpening of CVD diamond coated tools by 0. 5-10 ke V Ar⁺ion beam[J]. Diamond and Related Materials, 2011, 20(7):954-959.
[86] MAHMUD S F, FUKABORI T, PAHLOVY S A, et al. Low energy ion beam smoothening of artificially synthesized single crystal diamond chips with initial surface roughness of 0. 08-0. 4 nm RMS[J]. Diamond and Related Materials, 2012, 24(2):116-120.