• CN:11-2187/TH
  • ISSN:0577-6686

›› 2009, Vol. 45 ›› Issue (2): 247-250.

• 论文 • 上一篇    下一篇

扫码分享

蓝宝石衬底研磨加工中研磨盘材质的影响

文东辉;鲁聪达;周兆忠   

  1. 浙江工业大学机械制造及自动化教育部重点实验室
  • 发布日期:2009-02-15

Effect of Plate Materials on Sapphire Wafer Lapping Process

WEN Donghui;LU Congda;ZHOU Zhaozhong   

  1. Key Laboratory of Mechanical Manufacture and Automation, Ministry of Education, Zhejiang University of Technology
  • Published:2009-02-15

摘要: 采用W14、W3.5的B4C磨粒对蓝宝石衬底进行粗研磨和精密研磨的试验研究。对比分析铸铁、合成铜和合成锡盘粗研磨蓝宝石衬底的表面粗糙度和研磨表面均匀性,试验结果表明,铸铁研磨盘获得的蓝宝石衬底宏观表面均匀性和平面度均优于合成铜盘和合成锡盘,经铸铁研磨盘加工后的蓝宝石衬底面型峰谷值误差小于5 µm、中心线平均表面粗糙度Ra<0.82 µm。精密研磨试验结果表明,采用合成铜盘和W3.5B4C磨粒有效地改善了蓝宝石衬底表面的均匀性,获得了Ra<20 nm、面型峰谷值误差小于1.6 µm的均匀表面,为蓝宝石的超精密研磨奠定了良好的基础。

关键词: 表面粗糙度, 表面均匀性, 蓝宝石衬底, 研磨盘

Abstract: In order to investigate the effect of lapping plate materials on surface roughness and uniformity, experimental research is performed with W14 and W3.5 boron carbide abrasives for lapping sapphire wafer. In rough lapping process, cast iron, synthetic copper and synthetic tin lapping plate are used to machine sapphire wafer with W14 boron carbide abrasive, experimental results show that the best macro-uniformity and flatness are achieved by cast iron lapping plate. Sapphire wafer surface with surface error of peak-valley value less than 5 µm, standard deviation of roughness less than 0.82 µm are achieved. In precision lapping process, synthetic copper lapping plate is used to conduct the experiment with W3.5 boron carbide abrasive, both roughness and uniformity are greatly improved, a better surface quality with average deviation of roughness less than 20 nm, surface error of peak-valley value less than 1.6 µm is gotten by precision lapping process, which meet the demands of ultra-precision lapping process.

Key words: Lapping plate, Sapphire wafer, Surface roughness, Surface uniformity

中图分类号: