单晶硅放电成形切割-电解组合加工建模分析与实验研究

doi:10.3901/JME.260032

摘要/Abstract

摘要： 针对电火花线切割加工(Wire electrical discharge machining, WEDM)过程中，工件表面易产生大量的放电凹坑和重铸层，从而造成工件表面粗糙度高的问题。提出一种单晶硅的放电成形切割-电解组合加工(Discharge forming cutting -electrochemical machining, DFCEM)方法。在同一台加工设备上，首先通过放电成形切割完成单晶硅的切割，其次采用电化学阳极反应技术实现单晶硅表面放电凹坑和重熔层的溶解。在分析该加工过程的加工机理的基础上，引入法拉第定律和双电层模型，建立了电化学阳极溶解过程中紫铜箔电极运动速度的物理模型，设计了相关实验对理论模型进行了验证。实验验证结果表明，放电成形切割-电解组合加工可以有效的消除放电切割后单晶硅表面的放电凹坑和重铸层，进而降低工件的表面粗糙度。

关键词: 放电加工, 放电切割, 电解加工, 阳极溶解, 建模

Abstract: During the wire electrical discharge machining (WEDM) process, a large number of discharge pits and recast layers are easily generated on the surface of the workpiece, resulting in high surface roughness of the workpiece. To solve this problem, a discharge forming cutting-electrochemical combined machining (DFCEM) method of single crystalline silicon is proposed. On the same processing equipment, first, single crystal silicon is cut by using discharge forming cutting method. Second, the electrochemical anode reaction technology is used to dissolve the discharge pits and the recast layer on the single crystalline silicon surface. On the basis of analyzing the machining mechanism of the machining process, the Faraday’s law and the electric double layer model are introduced to establish a physical model of the motion velocity speed of the copper foil electrode in the electrochemical anode dissolution process, and related experiments are designed to verify the theoretical model. The experimental results show that DFCEM can effectively eliminate the electric discharge pits and recast layer on the surface of the single crystalline silicon caused by electric discharge cutting, thereby reducing the surface roughness of the workpiece.

Key words: electric discharge machining, discharge cutting machining, electrochemical machining, anodic reaction, modeling

中图分类号:

TG661

辛彬, 冀佳木, 张隽铖. 单晶硅放电成形切割-电解组合加工建模分析与实验研究[J]. 机械工程学报, 2026, 62(1): 436-447.

XIN Bin, JI Jiamu, ZHANG Juancheng. Modeling Analysis and Experimental Research on Discharge Forming Cutting-electrochemical Combined Machining of Single Crystalline Silicon[J]. Journal of Mechanical Engineering, 2026, 62(1): 436-447.

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