• CN：11-2187/TH
  • ISSN：0577-6686
机械工程学报

›› 2008, Vol. 44 ›› Issue (11): 13-19.

• 论文 • 上一篇    下一篇

扫码分享

面向微机电系统组装与封装的微操作装备关键技术

孙立宁;陈立国;荣伟彬;谢晖;刘延杰   

  1. 哈尔滨工业大学机器人技术与系统国家重点实验室;哈尔滨工业大学机器人研究所
  • 发布日期:2008-11-15

Key Techniques of Micromanipulation Devices for MEMS Assembling and Packaging

SUN Lining;CHEN Liguo;RONG Weibin;XIE Hui;LIU Yanjie   

  1. State Key Laboratory of Robotics and System, Harbin Institute of Technology Robotics Institute, Harbin Institute of Technology
  • Published:2008-11-15

PDF

176

摘要： 对微机电系统(Micro electro mechanical systems, MEMS)组装与封装工艺的特点进行了总结分析，给出了MEMS组装与封装设备的研究现状。针对MEMS产业发展的特点，分析了面向MEMS组装与封装的微操作设备中的工艺参数优化数据库、快速精密定位、模块化作业工具、快速显微视觉、柔性装夹和自动化物流等关键技术。在此基础上，详细介绍了研制的MEMS传感器阳极化键合设备和引线键合设备的组成结构、工作原理，并给出了组装和封装试验结果。最后，指出了MEMS组装与封装技术及设备研制的发展趋势。

关键词: 封装, 微操作, 微机电系统, 组装

Abstract: The characteristics of micro electro mechanical system (MEMS) assembling and packaging process are analyzed, and the development status of machining devices is given. According to the characteristics of MEMS industry development, the key techniques of MEMS assembling and packaging devices are described, including database of technological parameters, fast precision positioning, modular working tools, fast micro-vision, flexible clamping and automatic material handling techniques. The composition structure and working principle of an anodized bonding device for MEMS pressure sensor and a wire bonding device are introduced, and some experimental results are given. At last, the development trend of MEMS assembling and packaging techniques and devices are discussed.

Key words: Fabrication, Micro electro mechanical system (MEMS), Micromanipulation devices, Packaging

中图分类号: 

版权所有 © 2019 《机械工程学报》编辑部 | 京ICP备05055788号-30