超薄均热板的研究现状及发展趋势

doi:10.3901/JME.2022.12.197

机械工程学报 ›› 2022, Vol. 58 ›› Issue (12): 197-212.doi: 10.3901/JME.2022.12.197

• 可再生能源与工程热物理 • 上一篇下一篇

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超薄均热板的研究现状及发展趋势

陈恭^1,2, 汤勇^1,2, 张仕伟^1,2, 钟桂生^1,2, 孙亚隆^1,2, 李杰^1,2

1. 华南理工大学机械与汽车工程学院广州 510640;
2. 半导体显示与光通信器件国家地方联合工程研究中心广州 510640

收稿日期:2021-09-16 修回日期:2021-12-06 出版日期:2022-06-20 发布日期:2022-09-14
通讯作者: 张仕伟(通信作者),男,1988年出生,博士,教授,博士研究生导师。主要研究方向为两相传热技术、微纳制造。E-mail:swzhang@scut.edu.cn
作者简介:陈恭,男,1995年出生,博士,博士后。主要研究方向为两相传热技术、微纳制造。E-mail:megongchen@163.com;汤勇,男,1962年出生,博士,教授,博士研究生导师。主要研究方向为表面功能结构加工、两相传热技术、微纳制造等。E-mail:ytang@scut.edu.cn
基金资助:
国家自然科学基金（52105444，51735004）和广东省重点领域研发计划（2019B090910001）资助项目

Development Status and Perspective Trend of Ultrathin Vapor Chamber

CHEN Gong^1,2, TANG Yong^1,2, ZHANG Shiwei^1,2, ZHONG Guisheng^1,2, SUN Yalong^1,2, LI Jie^1,2

1. School of Mechanical & Automotive Engineering, South China University of Technology, Guangzhou 510640;
2. National and Local Joint Engineering Research Center of Semiconductor Display and Optical Communication Devices, Guangzhou 510640

Received:2021-09-16 Revised:2021-12-06 Online:2022-06-20 Published:2022-09-14

摘要/Abstract

摘要： 随着第五代移动通信技术(5G技术)的出现与快速发展，电子产品尤其是智能手机、平板电脑等产品，越发朝着高性能、高集成和微型化的方向发展。功耗成倍的增长将导致电子芯片在狭小空间内产生过高的热流密度和工作温度，进一步引发严峻的热失控难题。超薄均热板具有优异的导热性能，较大传热面积、较好的均温性能和高可靠性等优点，是解决电子设备散热问题的首要途径。为满足5G时代下现代微型化电子设备散热需求，均热板进一步超薄化是当前业界和学术界的研究热点。基于此，对超薄均热板传热原理进行概述，重点综述国内外超薄均热板结构设计研究现状，包括气液通道排布结构和吸液芯结构等，介绍目前超薄均热板封装制造工艺，并分析其实现极端超薄化中存在的问题，最后对其在高集成超轻薄电子设备等散热领域的研究趋势和发展前景进行了科学的展望。

关键词: 超薄均热板, 气液共面结构, 吸液芯结构, 封装制造方法, 散热

Abstract: With the emergence and rapid development of the fifth-generation mobile communication technology (5G technology), electronics, especially smart phones and tablet PC, are developing increasingly towards high performance, high integration and miniaturization. This will result in ultrahigh heat flux and operating temperature in narrow space, further lead to serious thermal problems. Ultrathin vapor chamber (UTVC) with the advantages of outstanding thermal conductivity, large heat transfer area, good temperature uniformity and high reliability, is the primary method to solve this problem. To meet the heat dissipation requirement of modern miniaturized electronics under 5G era, the further ultrathin development of UTVCs have been the focus in current industry and academia. Based on this, the heat transfer mechanism of UTVCs is firstly summarized. The research status of UTVC structures, including gas-liquid channel arrangement and wick, is reviewed. Then, the packaging and manufacturing methods of UTVCs are introduced. Additionally, the problems existed in the extremely ultrathin development in UTVCs are pointed out. Finally, the research trend and development of UTVCs in heat dissipation fields of high integration and ultrathin electronics are prospected.

Key words: ultrathin vapor chambers, gas-liquid coplanar structures, wick structures, packaging and manufacturing methods, heat dissipation

中图分类号:

TK124

陈恭, 汤勇, 张仕伟, 钟桂生, 孙亚隆, 李杰. 超薄均热板的研究现状及发展趋势[J]. 机械工程学报, 2022, 58(12): 197-212.

CHEN Gong, TANG Yong, ZHANG Shiwei, ZHONG Guisheng, SUN Yalong, LI Jie. Development Status and Perspective Trend of Ultrathin Vapor Chamber[J]. Journal of Mechanical Engineering, 2022, 58(12): 197-212.

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超薄均热板的研究现状及发展趋势

Development Status and Perspective Trend of Ultrathin Vapor Chamber

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