机械工程学报 ›› 2022, Vol. 58 ›› Issue (2): 2-16.doi: 10.3901/JME.2022.02.002
贾强1, 邹贵生1, 张宏强2, 王文淦1, 邓钟炀1, 任辉1, 刘磊1, 彭鹏2, 郭伟2
收稿日期:
2021-04-21
修回日期:
2021-07-02
出版日期:
2022-01-20
发布日期:
2022-03-19
通讯作者:
邹贵生(通信作者),男,1966年出生,博士,长聘教授,博士研究生导师。主要研究方向为超快激光微纳制造、微纳连接、焊接与连接。E-mail:zougsh@tsinghua.edu.cn
作者简介:
贾强,男,1991年出生,博士研究生。主要研究方向为高性能封装材料与技术。E-mail:jiaqiang0510@vip.163.com
基金资助:
JIA Qiang1, ZOU Guisheng1, ZHANG Hongqiang2, WANG Wengan1, DENG Zhongyang1, REN Hui1, LIU Lei1, PENG Peng2, GUO Wei2
Received:
2021-04-21
Revised:
2021-07-02
Online:
2022-01-20
Published:
2022-03-19
摘要: 随着第三代功率半导体器件的发展,以SiC为代表的宽禁带半导体芯片在大功率电力电子器件中扮演了越来越重要的角色。然而与传统Si芯片匹配的封装材料难以满足其高温服役的要求,成为功率电子器件应用的短板。纳米颗粒材料作中间层用于电子封装能够实现低温连接、高温服役,是目前封装材料的研究热点。本文综述了当前纳米颗粒材料作中间层的存在形式,重点分析单质纳米颗粒烧结连接的优势、影响因素以及局限性,系统阐述了复合纳米颗粒烧结连接的最新进展以及发展趋势,旨在促进纳米颗粒材料作中间层在电子封装中的应用。
中图分类号:
贾强, 邹贵生, 张宏强, 王文淦, 邓钟炀, 任辉, 刘磊, 彭鹏, 郭伟. 纳米颗粒材料作中间层的烧结连接及其封装应用研究进展[J]. 机械工程学报, 2022, 58(2): 2-16.
JIA Qiang, ZOU Guisheng, ZHANG Hongqiang, WANG Wengan, DENG Zhongyang, REN Hui, LIU Lei, PENG Peng, GUO Wei. Research Progress in Sintering-bonding with Nanoparticle Materials as Interlayer and Its Packaging Application[J]. Journal of Mechanical Engineering, 2022, 58(2): 2-16.
[1] 盛况,董泽政,吴新科. 碳化硅功率器件封装关键技术综述及展望[J]. 中国电机工程学报,2019,9(39):5576-5584. SHENG Kuang,DONG Zezheng,WU Xinke. Review and prospect of key packaging technologies for silicon carbide power devices[J]. Proceeding of the CSEE,2019,39(19):5576-5584. [2] 李春,邓君楷. 第三代半导体产业概况剖析[J]. 集成电路应用,2017(2):87-90. LI Chun,DENG Junkai. Analysis of the third generation semiconductor industry[J]. Applications of IC,2017(2):87-90. [3] 袁凤坡,白欣娇,李帅,等. 封装工艺对SiC功率模块热电性能的影响[J]. 半导体技术,2019,44(9):712-716. YUAN Fengpo,BAI Xinjiao,LI Shuai,et al. Influence of packaging process on thermoelectric properties of SiC power modules[J]. Semiconductor Technology,2019,44(9):712-716. [4] 范吉磊. 纳米银/铜的可控制备、低温烧结及其在微电子封装中的互连应用[D]. 北京:中国科学院大学,2020. FAN Jilei. Controllable preparation and low temperature sintering of nano silver/copper and its interconnection application in microelectronic packaging[D]. Beijing:University of Chinese Academy of Sciences,2020. [5] Paknejad S A,Mannan S H. Review of silver nanoparticle based die attach materials for high power/temperature applications[J]. Microelectronics Reliability,2017,70:1-11. [6] 邹贵生,闫剑锋,刘磊,等. 纳米金属颗粒膏合成及其低温烧结连接的电子封装应用研究进展[J]. 机械制造文摘:焊接分册,2013,34(1):12-16. ZOU Guisheng,YAN Jianfeng,LIU Lei,et al. Development of the synthesis of metal nanoparticle paste for electronic packaging[J]. Abstract of Mechanical Manufacture:Welding Section,2013,34(1):12-16. [7] Chen C,Zhang Z,Wang Q,et al. Robust bonding and thermal-stable Ag-Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less[J]. Journal of Alloys and Compounds,2020,828:154397. [8] 杨雪. 低温烧结纳米银膏的制备及其性能研究[D]. 哈尔滨:哈尔滨工业大学,2016. YANG Xue. Study on preparation and performance of low temperature sintered silver nanoparticle paste[D]. Harbin:Harbin Institute of Technology,2016. [9] 易盼,董超芳,肖葵,等. 电化学迁移研究进展[J]. 科技导报,2018,36(7):64-73. YI Pan,DONG Chaofang,XIAO Kui,et al. Current status and prospects of electrochemical migration research[J]. Science & Technology Review,2018,36(7):64-73. [10] Zhang H,BAI H,JIA Q,et al. Stabilizing the sintered nanopore bondline by residual organics for high temperature electronics[J]. Microelectronics Reliability,2020,111:113727. [11] Paknejad S A,DUMAS G,WEST G,et al. Microstructure evolution during 300℃ storage of sintered Ag nanoparticles on Ag and Au substrates[J]. Journal of Alloys and Compounds,2014,617:994-1001. [12] Del C L,ZINN A A,RUCH P,et al. Oxide-free copper pastes for the attachment of large-area power devices[J]. Journal of Electronic Materials,2019,48(10):6823-6834. [13] Mou Y,LIU J,CHENG H,et al. Facile preparation of self-reducible Cu nanoparticle paste for low temperature Cu-Cu bonding[J]. JOM,2019,71(9):3076-3083. [14] Tu Y,ZHU P L,LI G,et al. Multiscale characterization of the joint bonded by Cu@Ag core@shell nanoparticles[J]. Applied Physics Letters,2020,116(21):213101. [15] Dai X,XU W,ZHANG T,et al. Room temperature sintering of Cu-Ag core-shell nanoparticles conductive inks for printed electronics[J]. Chemical Engineering Journal,2019,364:310-319. [16] Ji H,ZHOU J,LIANG M,et al. Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging[J]. Ultrasonics Sonochemistry,2018,41:375-381. [17] Schwarzbauer H,KUHNERT R. Novel large area joining technique for improved power device performance[J]. IEEE Transactions on Industry Applications,1991,27(1):93-95. [18] Schwarzbauer H. Method of securing electronic components to a substrate[P]. US4810672. 1989-03-07. [19] Li Y,WONG C P. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging:Materials,processing,reliability and applications[J]. Materials Science and Engineering:R:Reports,2006,51(1-3):1-35. [20] Bai J G,ZHANG Z Z,CALATA J N,et al. Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material[J]. IEEE Transactions on Components and Packaging Technologies,2006,29(3):589-593. [21] Lei T G,CALATA J,LUO S F,et al. Low-temperature sintering of nanoscale silver paste for large-area joints in power electronics modules[J]. Key Engineering Materials,2007,353:2948-2953. [22] Bai J G,CALATA J N,LEI G,et al. Thermomechanical reliability of low-temperature sintered silver die-attachment[J]. IEEE Transactions on Device and Materials Reliability,2006,6(3):436-441. [23] Lu G,WANG M,MEI Y,et al. Advanced die-attach by metal-powder sintering:The science and practice[C]//10th International Conference on Integrated Power Electronics Systems,VDE,2018. [24] 梅云辉. 低温烧结纳米银焊膏电迁移和粘接热弯曲性能研究[D]. 天津:天津大学,2010. MEI Yunhui. The investigation of low temperature sintered nanosilver paste on migration and thermal bending in die-attachment[D]. Tianjin:Tianjin University,2010. [25] 张宏强. 纳米银焊膏优化及其SiC功率芯片互连高温可靠性研究[D]. 北京:清华大学,2018. ZHANG Hongqiang. A study on the SiC die attach sintered by the nano-Ag paste and its high temperature reliability[D]. Beijing:Tsinghua University,2018. [26] Chen Y,PALMER R E,WILCOXON J P. Sintering of passivated gold nanoparticles under the electron beam[J]. Langmuir,2006,22(6):2851-2855. [27] Asoro M A,KOVAR D,FERREIRA P J. Effect of surface carbon coating on sintering of silver nanoparticles:In situ TEM observations[J]. Chemical Communications. 2014,50(37):4835-4838. [28] Kim M,OSONE S,KIM T,et al. Synthesis of nanoparticles by laser ablation:A review[J]. KONA Powder and Particle Journal,2017,34:80-90. [29] Lu T W,FENG C S,WANG Z,et al. Microstructures and mechanical properties of CoCrFeNiAl 0.3 high-entropy alloy thin films by pulsed laser deposition[J]. Applied Surface Science,2019,494:72-79. [30] Yu J,XIAO T,WANG X,et al. A controllability investigation of magnetic properties for FePt alloy nanocomposite thin films[J]. Nanomaterials,2019,9(1):53-62. [31] Liu Z,CAI J,WANG Q,et al. Thermal-stable void-free interface morphology and bonding mechanism of low-temperature Cu-Cu bonding using Ag nanostructure as intermediate[J]. Journal of Alloys and Compounds. 2018,767:575-582. [32] Wang W,ZOU G,JIA Q,et al. Mechanical properties and microstructure of low temperature sintered joints using organic-free silver nanostructured film for die attachment of SiC power electronics[J]. Materials Science and Engineering:A,2020,793:139894. [33] Feng B,SHEN D,WANG W,et al. Cooperative bilayer of lattice-disordered nanoparticles as room-temperature sinterable nanoarchitecture for device integrations[J]. ACS Applied Materials & Interfaces,2019,11(18):16972-16980. [34] Siow K S. Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study[J]. Journal of Electronic Packaging,2016,138(2):161006. [35] 陈旭,李凤琴,蔺永诚,等. 高温功率半导体器件连接的低温烧结技术[J]. 电子元件与材料,2006(8):4-6. CHEN Xu,LI Fengqin,LIN Yongcheng,et al. Low-temperature sintering technique for high-temperature power semiconductor devices packaging[J]. Electronic Components & Materials,2006(8):4-6. [36] Li M,XIAO Y,ZHANG Z,et al. Bimodal sintered silver nanoparticle paste with ultrahigh thermal conductivity and shear strength for high temperature thermal interface material applications[J]. ACS Applied Materials & Interfaces,2015,7(17):9157-9168. [37] Kiełbasiński K,SZAŁAPAK J,JAKUBOWSKA M,et al. Influence of nanoparticles content in silver paste on mechanical and electrical properties of LTJT joints[J]. Advanced Powder Technology,2015,26(3):907-913. [38] Wang M,MEI Y,LI X,et al. Die-attach on nickel substrate by pressureless sintering a trimodal silver paste[J]. Materials Letters,2019,253:131-135. [39] Schaal M,KLINGLER M,WUNDERLE B. Silver sintering in power electronics:The state of the art in material characterization and reliability testing[C]//7th Electronic System-Integration Technology Conference (ESTC),IEEE,2018. [40] Felba J. Technological aspects of silver particle sintering for electronic packaging[J]. Circuit World,2018,44(1):2-15. [41] Liu W,AN R,WANG C,et al. Recent progress in rapid sintering of nanosilver for electronics applications[J]. Micromachines,2018,9(7):346. [42] Zhang Z,CHEN C,YANG Y,et al. Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air[J]. Journal of Alloys and Compounds,2019,780:435-442. [43] Wang M,MEI Y,LI X,et al. Pressureless silver sintering on nickel for power module packaging[J]. IEEE Transactions on Power Electronics,2019,34(8):7121-7125. [44] Zhang H,BAI H,PENG P,et al. SiC chip attachment sintered by nanosilver paste and their shear strength evaluation[J]. Welding in the World,2019,63(3):1055-1063. [45] 杨金龙,董长城,骆健. 新型功率模块封装中纳米银低温烧结技术的研究进展[J]. 材料导报,2019,33(增刊2):360-364. YANG Jinlong,DONG Changcheng,LUO Jian. Development of low-temperature sintered nanoscale silver for new power device packaging[J]. Materials Reports,2019,33(Suppl.2):360-364. [46] Hanss A,SCHMID M,BHOGARAJU S K,et al. Process development and reliability of sintered high power chip size packages and flip chip LEDs[C]//International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC),Japan Institute of Electronics Packaging,2018. [47] Zubir N S M,ZHANG H,ZOU G,et al. Large-area die-attachment sintered by organic-free Ag sintering material at low temperature[J]. Journal of Electronic Materials,2019,48(11):7562-7572. [48] Iwashige T,SUGIURA K,ENDO T,et al. Metallization technology of SiC power module in high temperature operation[C]//International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC),IEEE,2018. [49] CHEW L M,SCHMITT W,Nachreiner J,et al. Silver sinter paste optimized for pressure sintering under air atmosphere on precious and non-precious metal surfaces with high reliable sintered[C]//10th International Conference on Integrated Power Electronics Systems,2018. [50] Mei Y,LU G,CHEN X,et al. Effect of oxygen partial pressure on silver migration of low-temperature sintered nanosilver die-attach material[J]. IEEE Transactions on Device and Materials Reliability,2011,11(2):312-315. [51] Chua S T,SIOW K S. Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver,direct bond copper (DBC) and copper substrates aged at 300 C[J]. Journal of Alloys and Compounds,2016,687:486-498. [52] Gao Y,ZHANG H,LI W,et al. Die bonding performance using bimodal Cu particle paste under different sintering atmospheres[J]. Journal of Electronic Materials,2017,46(7):4575-4581. [53] Gao Y,LI W,CHEN C,et al. Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere[J]. Materials & Design,2018,160:1265-1272. [54] 闫剑锋. 纳米金属颗粒焊膏合成及其低温烧结连接研究[D]. 北京:清华大学,2013. YAN Jianfeng. A Study on the synthesis of metal nanoparticle joining paste and its low temperature bonding through sintering[D]. Beijing:Tsinghua University,2013. [55] Jeong S,LEE S H,JO Y,et al. Air-stable,surface-oxide free Cu nanoparticles for highly conductive Cu ink and their application to printed graphene transistors[J]. Journal of Materials Chemistry C,2013,1(15):2704-2710. [56] Haque M M,CHO D,LEE C S. Investigation of sintering behavior of octanethiol-coated copper nano ink under various atmospheres[J]. Thin Solid Films,2013,536:32-38. [57] Nishikawa H,HIRANO T,TAKEMOTO T,et al. Effects of joining conditions on joint strength of Cu/Cu joint using Cu nanoparticle paste[J]. Open Surface Science Journal,2011,3(3):92-100. [58] Ren H,MU F,SHIN S,et al. Low temperature Cu bonding with large tolerance of surface oxidation[J]. AIP Advances,2019,9(5):55127. [59] Tan K S,CHEONG K Y. Mechanical properties of sintered Ag-Cu die-attach nanopaste for application on SiC device[J]. Materials & Design,2014,64:166-176. [60] Wang D,MEI Y,XIE H,et al. Roles of palladium particles in enhancing the electrochemical migration resistance of sintered nano-silver paste as a bonding material[J]. Materials Letters,2017,206:1-4. [61] Yang C A,WU J,LEE C C,et al. Analyses and design for electrochemical migration suppression by alloying indium into silver[J]. Journal of Materials Science:Materials in Electronics,2018,29(16):13878-13888. [62] Ito T,OGURA T,HIROSE A. Effects of Au and Pd additions on joint strength,electrical resistivity,and Ion-migration tolerance in low-temperature sintering bonding using Ag2O paste[J]. Journal of Electronic Materials,2012,41(9):2573-2579. [63] Li D,MEI Y,XIN Y,et al. Reducing migration of sintered Ag for power devices operating at high temperature[J]. IEEE Transactions on Power Electronics,2020,35(12):12646-12650. [64] SCHMITT W,CHEW L M. Silver sinter paste for SiC bonding with improved mechanical properties[C]//IEEE 67th Electronic Components and Technology Conference (ECTC),2017. [65] Zhang H,NAGAO S,SUGANUMA K. Addition of SiC particles to Ag die-attach paste to improve high-temperature stability; grain growth kinetics of sintered porous Ag[J]. Journal of Electronic Materials,2015,44(10):3896-3903. [66] Sugiura K,IWASHIGE T,TSURUTA K,et al. Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles[J]. Applied Physics Letters,2019,114(16):161903. [67] LIU J,mou y,PENG Y,et al. Facile preparation of Cu-Ag micro-nano composite paste for high power device packaging[C]//IEE 70th Electronic Components and Technology Conference(ECTC). 2020:755-761. [68] Yan J,ZOU G,ZHANG Y,et al. Metal-metal bonding process using Cu+Ag mixed nanoparticles[J]. Materials Transactions,2013,54(6):879-883. [69] Kim K,JUNG K,PARK B,et al. Characterization of Ag-Pd nanocomposite paste for electrochemical migration resistance[J]. Journal of Nanoscience and Nanotechnology,2013,13(11):7620-7624. [70] Naguib H,MACLAURIN B. Silver migration and the reliability of Pd/Ag conductors in thick-film dielectric crossover structures[J]. IEEE Transactions on Components,Hybrids,and Manufacturing Technology,1979,2(2):196-207. [71] Lin J C,CHAN J Y. On the resistance of silver migration in Ag-Pd conductive thick films under humid environment and applied d.c. field[J]. Materials Chemistry & Physics,1996,43(3):256-265. [72] 王迪. 高温环境下纳米Ag-Pd焊膏的抗电化学迁移老化行为研究[D]. 天津:天津大学,2018. WANG Di. On resistance of nano-Ag-Pd paste to electrochemical migration behavior at high temperatures[D]. Tianjin:Tianjin University,2018. [73] Lin J C,WU W. On the sintering of mixed and alloyed silver-palladium powders from chemical coprecipitation[J]. Materials Chemistry and Physics,1995,40(2):110-118. [74] Plimpton S. Fast parallel algorithms for short-range molecular dynamics[J]. Journal of Computational Physics,1995,117(1):1-19. [75] Kim M I,CHOI E B,LEE J. Improved sinter-bonding properties of silver-coated copper flake paste in air by the addition of sub-micrometer silver-coated copper particles[J]. Journal of Materials Research and Technology,2020,9(6):16006-16017. [76] Tian Y,JIANG Z,WANG C,et al. Sintering mechanism of the Cu-Ag core-shell nanoparticle paste at low temperature in ambient air[J]. RSC Advances,2016,6(94):91783-91790. [77] Ferrando R,JELLINEK J,JOHNSTON R L. Nanoalloys:From theory to applications of alloy clusters and nanoparticles[J]. Chem. Rev.,2008,108(3):845-910. [78] Fang H,YANG J,WEN M,et al. Nanoalloy materials for chemical catalysis[J]. Advanced Materials,2018,30(17):1705698. [79] Jabbareh M A,MONJI F. Thermodynamic modeling of Ag-Cu nanoalloy phase diagram[J]. Calphad,2018,60:208-213. [80] Garzel G,JANCZAK-RUSCH J,ZABDYR L. Reassessment of the Ag-Cu phase diagram for nanosystems including particle size and shape effect[J]. Calphad,2012,36:52-56. [81] 刘晓剑. Ag-Cu超饱和固溶体纳米颗粒纳米冶金及抗电化学迁移机理[D]. 哈尔滨:哈尔滨工业大学,2017. LIU Xiaojian. Nanoalloying and anti-electrochemical migration mechanisms of Ag-Cu supersaturated solid solution nanoparticles[D]. Harbin:Harbin Institute of Technology,2017. [82] Yan J,ZHANG D,ZOU G,et al. Preparation of oxidation-resistant Ag-Cu alloy nanoparticles by polyol method for electronic packaging[J]. Journal of Electronic Materials,2019,48(2):1286-1293. [83] Kim D,KIM H,RYU J,et al. Phase diagram of Ag-Pd bimetallic nanoclusters by molecular dynamics simulations:Solid-to-liquid transition and size-dependent behavior[J]. Physical Chemistry Chemical Physics:PCCP,2009,11:5079-5085. [84] Karakaya I,THOMPSON W T. The Ag-Pd (silver-palladium) system[J]. Bulletin of Alloy Phase Diagrams,1988,9(3):237-243. [85] Yamamoto M,KAKIUCHI H,KASHIWAGI Y,et al. Synthesis of Ag-Pd alloy nanoparticles suitable as precursors for Ionic migration-resistant conductive film[J]. Bulletin of the Chemical Society of Japan,2010,83(11):1386-1391. [86] Jia Q,ZOU G,WANG W,et al. Sintering mechanism of a supersaturated Ag-Cu nanoalloy film for power electronic packaging[J]. ACS Applied Materials & Interfaces,2020,12(14):16743-16752. [87] Jia Q,ZOU G,ZHANG H,et al. Sintering mechanism of Ag-Pd nanoalloy film for power electronic packaging[J]. Applied Surface Science,2021,554:149579. [88] 贾强,王文淦,阿占文,等. Ag-Pd纳米合金低温连接及其抗电化学迁移性能[J]. 中国激光,2021,48(8):0802014. JIA Qiang,WANG Wengan,A Zhanwen,et al. Low temperature bonding of Ag-Pd nanoalloy and its resistance to electrochemical-migration[J]. Chinese Journal of Lasers,2021,48(8):0802014. |
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[9] | 陈新, 姜永军, 谭宇韬, 高健, 杨志军, 刘冠峰, 贺云波, 王晗, 李泽湘. 面向电子封装装备制造的若干关键技术研究及应用*[J]. 机械工程学报, 2017, 53(5): 181-189. |
[10] | 杨伏良;易丹青. 粉末球磨预处理对高硅铝合金材料组织与物理性能的影响[J]. , 2009, 45(1): 253-257. |
[11] | 徐进;雒建斌. 计算机硬磁盘基片表面纳米粒子冲蚀磨损[J]. , 2007, 43(6): 137-141. |
[12] | 杨伏良;甘卫平;陈招科. 挤压温度对高硅铝合金材料物理性能的影响[J]. , 2006, 42(6): 7-10. |
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