• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2022, Vol. 58 ›› Issue (2): 2-16.doi: 10.3901/JME.2022.02.002

• 微纳连接新材料 • 上一篇    下一篇

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纳米颗粒材料作中间层的烧结连接及其封装应用研究进展

贾强1, 邹贵生1, 张宏强2, 王文淦1, 邓钟炀1, 任辉1, 刘磊1, 彭鹏2, 郭伟2   

  1. 1. 清华大学机械工程系 北京 100084;
    2. 北京航空航天大学机械工程及自动化学院 北京 100191
  • 收稿日期:2021-04-21 修回日期:2021-07-02 出版日期:2022-01-20 发布日期:2022-03-19
  • 通讯作者: 邹贵生(通信作者),男,1966年出生,博士,长聘教授,博士研究生导师。主要研究方向为超快激光微纳制造、微纳连接、焊接与连接。E-mail:zougsh@tsinghua.edu.cn
  • 作者简介:贾强,男,1991年出生,博士研究生。主要研究方向为高性能封装材料与技术。E-mail:jiaqiang0510@vip.163.com
  • 基金资助:
    国家重点研发计划(2017YFB1104900)和国家自然科学基金(51775299,52075287,51520105007)资助项目。

Research Progress in Sintering-bonding with Nanoparticle Materials as Interlayer and Its Packaging Application

JIA Qiang1, ZOU Guisheng1, ZHANG Hongqiang2, WANG Wengan1, DENG Zhongyang1, REN Hui1, LIU Lei1, PENG Peng2, GUO Wei2   

  1. 1. Department of Mechanical Engineering, Tsinghua University, Beijing 100084;
    2. School of Mechanical Engineering and Automation, Beihang University, Beijing 100191
  • Received:2021-04-21 Revised:2021-07-02 Online:2022-01-20 Published:2022-03-19

摘要: 随着第三代功率半导体器件的发展,以SiC为代表的宽禁带半导体芯片在大功率电力电子器件中扮演了越来越重要的角色。然而与传统Si芯片匹配的封装材料难以满足其高温服役的要求,成为功率电子器件应用的短板。纳米颗粒材料作中间层用于电子封装能够实现低温连接、高温服役,是目前封装材料的研究热点。本文综述了当前纳米颗粒材料作中间层的存在形式,重点分析单质纳米颗粒烧结连接的优势、影响因素以及局限性,系统阐述了复合纳米颗粒烧结连接的最新进展以及发展趋势,旨在促进纳米颗粒材料作中间层在电子封装中的应用。

关键词: 纳米颗粒, 中间层, 微纳连接, 低温烧结, 电子封装

Abstract: With the development of third-generation power semiconductor devices, the wide bandgap semiconductor chips represented by SiC are playing an increasingly important role in high-power power electronic devices. However, the packaging materials matched with traditional Si chips cannot meet their high-temperature service requirements and become a shortcoming in the application of power electronic devices. Nanoparticle materials used as an interlayer for electronic packaging can achieve low-temperature bonding and high-temperature service, which is a current research hotspot of packaging materials. This paper reviews the types of nanoparticle materials as the interlayer, focusing on the analysis of the advantages, influencing factors and limitations of nanoparticle of elementary substance for sintering-bonding, and systematically expounds the latest progress and development trend of composite nanoparticle for sintering-bonding, aiming to promote the application of nanoparticle material as an interlayer for electronic packaging.

Key words: nanoparticle, interlayer, micro-nano joining, low-temperature sintering, electronic packaging

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