电子封装可靠性：过去、现在及未来

doi:10.3901/JME.2021.16.248

机械工程学报 ›› 2021, Vol. 57 ›› Issue (16): 248-268.doi: 10.3901/JME.2021.16.248

• 特邀专刊：先进设计制造技术前沿：重要装备的可靠性保障 • 上一篇下一篇

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电子封装可靠性：过去、现在及未来

陈志文¹, 梅云辉², 刘胜^1,3, 李辉¹, 刘俐⁴, 雷翔³, 周颖³, 高翔³

1. 武汉大学工业科学研究院武汉 430072;
2. 天津大学材料科学与工程学院天津 300072;
3. 华中科技大学机械科学与工程学院武汉 430074;
4. 武汉理工大学材料科学与工程学院武汉 430070

收稿日期:2020-08-31 修回日期:2021-02-05 出版日期:2021-08-20 发布日期:2021-11-16
通讯作者: 刘胜(通信作者),男,1963年出生,博士,教授,博士研究生导师。主要研究方向为电子制造及系统封装,可靠性及多场多尺度问题。E-mail:shengliu@whu.edu.cn
作者简介:陈志文,男,1987年出生,博士研究生。主要研究方向为电子封装材料力学及仿真。E-mail:zhiwen.chen@whu.edu.cn
基金资助:
国家自然科学基金（61904127，62004144）、广东省基础与应用基础研究基金（2021A1515010651）、湖北省自然科学基金创新群体（2020CFA032）、国家自然科学基金优青（51922075）和国家重点研发计划（2018YFB0104502）资助项目。

Reliability in Electronic Packaging: Past, Now and Future

CHEN Zhiwen¹, MEI Yunhui², LIU Sheng^1,3, LI Hui¹, LIU Li⁴, LEI Xiang³, ZHOU Ying³, GAO Xiang³

1. Institute of Technological Sciences, Wuhan University, Wuhan 430072;
2. School of Materials Science and Engineering, Tianjin University, Tianjin 300072;
3. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074;
4. School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070

Received:2020-08-31 Revised:2021-02-05 Online:2021-08-20 Published:2021-11-16

摘要/Abstract

摘要： 电子封装是芯片成为器件的重要步骤，涉及的材料种类繁多，大量材料呈现显著的温度相关、率相关的非线性力学行为。相关工艺过程中外界载荷与器件的相互作用呈现典型的多尺度、多物理场特点，对电子封装的建模仿真方法也提出了相应的要求。在可靠性验证方面，封装的失效主要包括热-力致耦合失效、电-热-力致耦合失效等。随着新型封装材料、技术的涌现，电子封装可靠性的试验方法、基于建模仿真的协同设计方法均亟待新的突破与发展。

关键词: 电子封装, 可靠性, 封装材料, 建模仿真, 失效机理, LED, 功率电子, 集成电路

Abstract: Electronic packaging is the key step that make chips become functional devices. Many different types of materials are involved in this step, majority of which show non-linear mechanical behaviors with significant temperature dependency and strain rate dependency. During the processes, the interactions between loads from the environment and devices are multi-scale and multi-physics in nature. This also poses new requirements on modeling and simulation techniques in electronic packaging. As for reliability validation, typical failure modes in electronic packaging include thermal-mechanical coupling failure and electrical-thermal-mechanical coupling failure and so on. With the development of new packaging materials and technologies, new approaches are in demand in experimental methodology and modeling and co-design techniques.

Key words: electronic packaging, reliability, packaging materials, modeling, failure mechanisms, LED, power devices, integrated circuit

中图分类号:

TG156

陈志文, 梅云辉, 刘胜, 李辉, 刘俐, 雷翔, 周颖, 高翔. 电子封装可靠性：过去、现在及未来[J]. 机械工程学报, 2021, 57(16): 248-268.

CHEN Zhiwen, MEI Yunhui, LIU Sheng, LI Hui, LIU Li, LEI Xiang, ZHOU Ying, GAO Xiang. Reliability in Electronic Packaging: Past, Now and Future[J]. Journal of Mechanical Engineering, 2021, 57(16): 248-268.

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电子封装可靠性：过去、现在及未来

Reliability in Electronic Packaging: Past, Now and Future

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