电子封装可靠性：过去、现在及未来
陈志文, 梅云辉, 刘胜, 李辉, 刘俐, 雷翔, 周颖, 高翔
Reliability in Electronic Packaging: Past, Now and Future
CHEN Zhiwen, MEI Yunhui, LIU Sheng, LI Hui, LIU Li, LEI Xiang, ZHOU Ying, GAO Xiang
机械工程学报
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2021, (16): 248
-268
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DOI: 10.3901/JME.2021.16.248
