纳米颗粒材料作中间层的烧结连接及其封装应用研究进展
贾强, 邹贵生, 张宏强, 王文淦, 邓钟炀, 任辉, 刘磊, 彭鹏, 郭伟
Research Progress in Sintering-bonding with Nanoparticle Materials as Interlayer and Its Packaging Application
JIA Qiang, ZOU Guisheng, ZHANG Hongqiang, WANG Wengan, DENG Zhongyang, REN Hui, LIU Lei, PENG Peng, GUO Wei
机械工程学报
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2022, (2): 2
-16
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DOI: 10.3901/JME.2022.02.002
