Zn含量对Cu/Sn/Cu-xZn微焊点界面反应的影响

doi:10.3901/JME.2022.02.269

机械工程学报 ›› 2022, Vol. 58 ›› Issue (2): 269-275.doi: 10.3901/JME.2022.02.269

• 微纳连接界面与可靠性 • 上一篇下一篇

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Zn含量对Cu/Sn/Cu-xZn微焊点界面反应的影响

刘志斌, 乔媛媛, 赵宁

大连理工大学材料科学与工程学院大连 116024

收稿日期:2021-02-06 修回日期:2021-06-17 出版日期:2022-01-20 发布日期:2022-03-19
通讯作者: 赵宁(通信作者),男,1980年出生,博士,教授,博士研究生导师。主要研究方向为无铅焊料、微电子封装互连材料性能与表征、微电子封装互连界面问题与可靠性测试分析以及三维系统级封装技术。E-mail:zhaoning@dlut.edu.cn
作者简介:刘志斌,男,1995年出生。主要研究方向为微互连界面反应行为。E-mail:1172364490@qq.com
基金资助:
国家自然科学基金（52075072）和中央高校基本科研业务费专项资金（DUT20JC46）资助项目。

Effect of Zn Content on Interfacial Reactions of Cu/Sn/Cu-xZn Micro Solder Joints

LIU Zhibin, QIAO Yuanyuan, ZHAO Ning

School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024

Received:2021-02-06 Revised:2021-06-17 Online:2022-01-20 Published:2022-03-19

摘要/Abstract

摘要： 本文以Cu/Sn/Cu-xZn（x=0，5，20 wt.%）微焊点为研究对象，探究Zn含量对其在等温和温度梯度下回流时液-固界面反应的影响。等温回流时，微焊点两端界面金属间化合物（Intermetallic compound，IMC）呈对称性生长，且随着Zn含量增加，两端界面IMC厚度略有减小，表明在Cu基体中添加Zn对等温回流时界面IMC生长的抑制作用不明显。温度梯度下回流时，冷、热两端界面IMC呈非对称性生长，且随着Zn含量增加，冷端界面IMC厚度明显减小，表明添加Zn对冷端界面IMC生长有显著抑制作用。这是因为，添加Zn降低了由热迁移引起的用于冷端界面反应的原子通量。此外发现，由于界面处生成Cu（Sn，Zn）层，更加有效地阻挡了热端基体溶解，使得Cu/Sn/Cu-20Zn微焊点中冷端界面IMC生长速率急剧减小。基于界面IMC随回流时间的生长规律，分别获得了等温回流和温度梯度下回流时Cu/Sn/Cu-xZn微焊点两侧IMC的生长动力学。

关键词: 电子封装, Cu-Zn基板, 界面反应, 热迁移, IMC生长

Abstract: The Cu/Sn/Cu-xZn (x=0,5,20 wt.%) solder joints were chosen as research object to study the effect of Zn content on the liquid-solid interfacial reactions during isothermal reflow and reflow under temperature gradient (TG). During isothermal reflow, the intermetallic compounds (IMCs) at the two ends of the micro solder joints grow symmetrically. With the increase of Zn content, the thickness of the IMCs at the two ends of the micro solder joints decreased slightly, indicating that the addition of Zn to the Cu substrate had no significant effect on the growth of the interfacial IMCs during isothermal reflow. During reflow under TG, the IMCs at the cold and hot ends grew asymmetrically. As the Zn content increased, the thickness of the IMCs at the cold end decreased significantly, indicating that the addition of Zn had a significant inhibiting effect on the growth of IMCs at the cold end interface. This is due to the fact that the addition of Zn reduced the thermomigration induced atomic flux for the IMC growth at the cold end. In addition, it was found that the formation of a Cu(Sn,Zn) layer at the interface more effectively suppressed the dissolution of the hot end substrate, resulting in a sharp decrease in the growth rate of the cold end IMCs of the Cu/Sn/Cu-20Zn micro solder joints. Based on the interfacial IMC growth behavior with reflow time, the growth kinetics of the IMCs at the two ends of the Cu/Sn/Cu-xZn micro solder joints during isothermal reflow and reflow under TG was obtained.

Key words: electronic packaging, Cu-Zn substrates, interfacial reactions, thermonigration, IMCs growth

中图分类号:

TG115

刘志斌, 乔媛媛, 赵宁. Zn含量对Cu/Sn/Cu-xZn微焊点界面反应的影响[J]. 机械工程学报, 2022, 58(2): 269-275.

LIU Zhibin, QIAO Yuanyuan, ZHAO Ning. Effect of Zn Content on Interfacial Reactions of Cu/Sn/Cu-xZn Micro Solder Joints[J]. Journal of Mechanical Engineering, 2022, 58(2): 269-275.

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Zn含量对Cu/Sn/Cu-xZn微焊点界面反应的影响

Effect of Zn Content on Interfacial Reactions of Cu/Sn/Cu-xZn Micro Solder Joints

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