• CN:11-2187/TH
  • ISSN:0577-6686

›› 2006, Vol. 42 ›› Issue (2): 187-191.

• 论文 • 上一篇    下一篇

光纤端面研磨加工的表面质量

刘德福;段吉安;钟掘   

  1. 中南大学机电工程学院
  • 发布日期:2006-02-15

SURFACE QUALITY IN END-FACE LAPPING OF OPTICAL FIBER

LIU Defu;DUAN Ji’an;ZHONG Jue   

  1. College of Mechanical & Electronic Engineering, Central South University
  • Published:2006-02-15

摘要: 研究光纤端面研磨时高质量表面的形成机理已成为提高光纤连接器质量和制造效率的重要课题。选用粒度为0.5~6.0 mm金刚石磨料砂纸,在KE-OFP-12型光纤连接器研磨机上对光纤端面进行研磨,发现光纤研磨加工存在脆性断裂、半脆性半延性和延性等三种材料去除模式,且材料去除模式主要由磨料粒度控制,磨料粒度为3 mm时,为其脆延转换的临界点,并从理论上对其进行了分析。试验证明以延性去除得到的光纤表面粗糙度远低于以脆性断裂去除得到的表面粗糙度,是提高光纤研磨表面质量的有效途径。光纤以延性模式研磨加工时,光纤表面粗糙度可达到5 nm,其表面看不到任何划痕,可使光纤连接器的插入损耗及回波损耗等光学性能满足高速、宽带光纤通信的要求。

关键词: 表面粗糙度, 表面形貌, 材料去除模式, 光纤研磨

Abstract: The study on high quality surface formation mechanism in lapping of optical fiber end-face has become an important topic about improving performances of optical fiber connectors. With diamond abrasive lapping-films whose grain sizes are from 0.5 mm to 6 mm used, the optical fiber end-face lapping experiments are processed on optical fiber connector lapping machine, whose style is KE-OFP-12. The experimental results show that there are three material removal modes during lapping optical fiber, namely, brittle fracture mode, semi-brittle & semi-ductile mode, and ductile mode. These modes are mainly controlled by abrasive grain size. Brittle-ductile transition’s critical point appears when the lapping-films whose abrasive grain size is 3 mm are used to lap optical fiber; and they are analyzed theoretically. The surface roughness from ductile lapping mode is much less than that from brittle fracture lapping mode, and the ductile lapping mode is an effective method that improves surface quality of fiber end-faces. The surface roughness Ra 5 nm can be obtained and there are not any scratches and cracks on the fiber end-face when fiber material is removed by ductile mode; it makes insertion loss and return loss of optical fiber connectors meet the requirements of high-speed and broad-brand optical fiber communication.

Key words: Material removal mode, Optical fiber lapping, Surface roughness, Surface topography

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