磁控溅射磁场及放电参数对氩离子输运的调控

doi:10.3901/JME.260749

摘要/Abstract

摘要： 磁控溅射在薄膜制备中应用广泛，但仍存在靶材刻蚀不均及效率偏低的问题。本研究旨在阐明磁结构、腔体形状与放电参数对氩离子输运的影响机制，为提升溅射均匀性与效率提供依据。基于耦合磁场与等离子场的有限元模型，评估磁极高度配置(内高外低、等高、外高内低)、腔体高径比(0.5～1.5)及放电条件(阳极电压50～200 V、气压6.67～126.66 Pa)对氩离子分布与溅射行为的影响。结果显示，“外高内低”结构强化磁场约束，使离子分布集中、半峰宽降低23%，刻蚀效率提高但靶材利用率下降；高径比由0.5增至1.5时，离子数密度方差下降94.8%，积分强度提高47.3%，靶材利用率与刻蚀效率分别提升约20倍和1.5倍；随阳极电压升高，氩离子产额呈数量级增长，而气压升高使其衰减至约28%。研究明确了磁场梯度、几何约束与放电条件对离子输运的耦合规律，为磁控溅射设备与工艺优化提供理论支撑。

关键词: 磁控溅射, 氩离子分布, 磁场结构, 放电参数, 等离子体输运, 刻蚀均匀性

Abstract: Magnetron sputtering is widely employed in thin-film fabrication, yet issues such as non-uniform target erosion and limited efficiency remain. This study aims to elucidate the influence mechanisms of magnetic configuration, chamber shape, and discharge parameters on argon ion transport, thereby providing a basis for improving sputtering uniformity and efficiency. A finite-element model coupling the magnetic field and plasma field was developed to evaluate the effects of magnetic pole height configurations (inner-magnet-elevated configuration, equal-elevation configuration, and outer-magnet-elevated configuration), chamber height-to-diameter ratios (0.5-1.5), and discharge conditions (anode voltages of 50-200 V and pressures of 6.67-126.66 Pa) on ion distribution and sputtering behavior. The results show that the outer-magnet-elevated configuration enhances magnetic confinement, leading to a more concentrated ion distribution and a 23% reduction in full-width at half-maximum, thereby increasing erosion efficiency while reducing target utilization. As the height-to-diameter ratio increases from 0.5 to 1.5, the variance of ion density decreases by 94.8%, the integral intensity increases by 47.3%, and target utilization and erosion efficiency increase by approximately 20-fold and 1.5-fold, respectively. Increasing the anode voltage yields orders-of-magnitude growth in argon ion production, whereas increasing pressure suppresses it to 28% of the initial level. These findings clarify the coupled regulatory effects of magnetic-field gradients, geometric constraints, and discharge conditions on ion transport, providing theoretical support for the optimization of magnetron sputtering equipment and process design.

Key words: magnetron sputtering, argon ion distribution, magnetic field configuration, discharge parameters, plasma transport, etching uniformity

中图分类号:

TP311

田庆旭, 周啸, 龚鸣宇, 张鹤霖, 陈淑英, 孟范超. 磁控溅射磁场及放电参数对氩离子输运的调控[J]. 机械工程学报, 2026, 62(14): 207-219.

Tian Qingxu, Zhou Xiao, Gong Mingyu, Zhang Helin, Chen Shuying, Meng Fanchao. Magnetic and Discharge Parameter Effects on Argon Ion Transport in Magnetron Sputtering[J]. Journal of Mechanical Engineering, 2026, 62(14): 207-219.

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链接本文: http://www.cjmenet.com.cn/CN/10.3901/JME.260749

http://www.cjmenet.com.cn/CN/Y2026/V62/I14/207

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