[1] |
LIANG Fengshuang, WU Mingyang, LIU Lifei.
Research on Mechanism and Subsurface Damage Characteristics of SiC Ultrasonic Grinding Based on Material Impact Characteristics
[J]. Journal of Mechanical Engineering, 2024, 60(9): 75-85.
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[2] |
DENG Shiwei, SHEN Wenjie, CHEN Yuhong, BAI Tian, MEI Deqing, WANG Yancheng.
Numerical Modeling and Experimental Study of the Reaction Process in Silicon Epitaxial Growth Reaction Chamber
[J]. Journal of Mechanical Engineering, 2024, 60(5): 209-218.
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[3] |
HUA Dongpeng, ZHOU Qing, WANG Wan, LI Shuo, WANG Zhijun, WANG Haifeng.
A Molecular Dynamics Simulation on the Subsurface Damage Mechanism in the Nano-polishing Process of Silicon Carbide
[J]. Journal of Mechanical Engineering, 2024, 60(5): 231-240.
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[4] |
WANG Songli, FANG Xudong, GAO Bonan, ZHAO Libo, TIAN Bian, LIN Qijing, ZHANG Zhongkai, RAO Hao, LI Yu, JIANG Zhuangde.
Study on Automatic Gain Control and Phase Compensation Control for MEMS Resonant Pressure Sensors
[J]. Journal of Mechanical Engineering, 2024, 60(4): 82-91.
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[5] |
WANG Meiyu, ZHANG Haobo, HU Weibo, MEI Yunhui.
Review on the through Silicon Via Technology in the 3D-system in Package (3D-SiP)
[J]. Journal of Mechanical Engineering, 2024, 60(19): 261-276.
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[6] |
LIU Wei, HU Lifang, ZHENG Zhi, GAO Wei, CHOU Zhao, CHENG Xiao, WANG Yong.
Study on the Anodic Bonding Mechanism and Mechanical Properties of Glass and Silicon Carbide
[J]. Journal of Mechanical Engineering, 2024, 60(16): 151-159.
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[7] |
WANG Xing-dong, WANG Zi-yang, TANG Wei, LI Jun, LIU Bei, BAI Hao-ke.
Study on Heart Shaped Buckling Mechanism and Prevention Method of Thin Silicon Steel
[J]. Journal of Mechanical Engineering, 2023, 59(8): 121-131.
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[8] |
WU Zhipeng, GAO Dedong, WANG Shan, WEI Xiaoxu, SHAO Mingxi, XIN Yuanqing.
A Review on Recycling Technology of End-of-life Crystalline Silicon Photovoltaic Modules
[J]. Journal of Mechanical Engineering, 2023, 59(7): 307-329.
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[9] |
ZHANG Yu, KANG Renke, GAO Shang, HUANG Jinxing, ZHU Xianglong.
Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding
[J]. Journal of Mechanical Engineering, 2023, 59(3): 328-336.
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[10] |
HUANG Tao, WANG Jiachou, LI Xinxin.
High-performance p+ Si/Au Thermopile-based Gas Flow Sensor in (111) Silicon and Its Packaging Technology
[J]. Journal of Mechanical Engineering, 2023, 59(2): 30-38.
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[11] |
ZHANG Xiufeng, SHAO Guodong, LIU Chuancheng, SHI Zhenyu, ZOU Bin, WANG Jilai, ZHANG Chengpeng.
Special Processing Techniques Commonly Used For Silicon Carbide Ceramic-Based Composites: Review
[J]. Journal of Mechanical Engineering, 2023, 59(1): 199-218.
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[12] |
HAO Yufei, LI Changsheng.
Shielded Soft Capacitive Sensor for the Measuring of Normal Force and Shear Force
[J]. Journal of Mechanical Engineering, 2022, 58(23): 106-113.
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[13] |
DAI Jianbo, SU Honghua, FU Yucan, DING Wenfeng, SI Lei, CHEN Jiajia.
Effect of Grinding Speed on Mechining Damage of Silicon Carbide Ceramics
[J]. Journal of Mechanical Engineering, 2022, 58(21): 316-330.
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[14] |
HU Tengjiang, REN Wei, ZHAO Yulong, WANG Kexin.
Research on High Structural Strength MEMS S & A Device for Micro Initiator
[J]. Journal of Mechanical Engineering, 2022, 58(17): 206-214.
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[15] |
ZHENG Dihao, QIAN Wei, WU Chongjun, GUO Weicheng.
Mechanism and Quality Analysis of Laser Assisted Grinding of Silicon Nitride Ceramics Influenced by Regular Patterns
[J]. Journal of Mechanical Engineering, 2022, 58(15): 152-165.
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