| [1] |
ZHAO Wei, CHANG Jiajun, WEI Qingsong, WU Jiamin, YE Chunsheng, HUANG Shuangjun.
Influence of Silicon Nitride Combined with Silica Sol Infiltration on the Properties of Alumina Ceramic Cores via Binder Jetting
[J]. Journal of Mechanical Engineering, 2026, 62(5): 287-296.
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| [2] |
XU Jiahui, KANG Renke, ZHU Xianglong, DONG Zhigang, LI Meng.
Research on Dynamic Characteristics of Air Static Pressure Spindle for Silicon Wafer Grinding Machine
[J]. Journal of Mechanical Engineering, 2025, 61(5): 108-116.
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| [3] |
FANG Zhiqiang, ZHANG Yangze, WU Jiamin, MAO Chen, CHEN Ying.
Effect of Ferrocene Content on the Properties of SLS-CVR Formed SiCnw/SiC Absorbing Ceramics
[J]. Journal of Mechanical Engineering, 2025, 61(23): 321-330.
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| [4] |
YANG Jia, ZHANG Shouzhuang, LU Xuan, XU Xin, WANG Ce, LIN Panpan, MEI Han, LIU Yue, HE Peng, LIN Tiesong.
Study of Copper-based Composite Brazing Process of SiCf/SiC Composites with Cobalt-based High Temperature Alloys
[J]. Journal of Mechanical Engineering, 2025, 61(21): 437-445.
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| [5] |
LU Yanjun, DU Jiaxuan, WANG Qiang, GUAN Weifeng, WU Yongbo.
Ultrasonic Assisted Mechanical-chemical Truing Mechanism of Coarse Diamond Grinding Wheel and Applications of Mirror Grinding
[J]. Journal of Mechanical Engineering, 2025, 61(17): 381-392.
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| [6] |
ZHOU Jiechen, LIU Jianhua, XIA Huanxiong, ZHANG Xiumin, ZHAO Yuxi, MENG Junfeng.
Modeling and Surface-figure Analysis of Bonding Assembly of a Spatial Reflector
[J]. Journal of Mechanical Engineering, 2025, 61(13): 255-264.
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| [7] |
LIANG Fengshuang, WU Mingyang, LIU Lifei.
Research on Mechanism and Subsurface Damage Characteristics of SiC Ultrasonic Grinding Based on Material Impact Characteristics
[J]. Journal of Mechanical Engineering, 2024, 60(9): 75-85.
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| [8] |
DENG Shiwei, SHEN Wenjie, CHEN Yuhong, BAI Tian, MEI Deqing, WANG Yancheng.
Numerical Modeling and Experimental Study of the Reaction Process in Silicon Epitaxial Growth Reaction Chamber
[J]. Journal of Mechanical Engineering, 2024, 60(5): 209-218.
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| [9] |
HUA Dongpeng, ZHOU Qing, WANG Wan, LI Shuo, WANG Zhijun, WANG Haifeng.
A Molecular Dynamics Simulation on the Subsurface Damage Mechanism in the Nano-polishing Process of Silicon Carbide
[J]. Journal of Mechanical Engineering, 2024, 60(5): 231-240.
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| [10] |
WANG Songli, FANG Xudong, GAO Bonan, ZHAO Libo, TIAN Bian, LIN Qijing, ZHANG Zhongkai, RAO Hao, LI Yu, JIANG Zhuangde.
Study on Automatic Gain Control and Phase Compensation Control for MEMS Resonant Pressure Sensors
[J]. Journal of Mechanical Engineering, 2024, 60(4): 82-91.
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| [11] |
WANG Meiyu, ZHANG Haobo, HU Weibo, MEI Yunhui.
Review on the through Silicon Via Technology in the 3D-system in Package (3D-SiP)
[J]. Journal of Mechanical Engineering, 2024, 60(19): 261-276.
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| [12] |
LIU Wei, HU Lifang, ZHENG Zhi, GAO Wei, CHOU Zhao, CHENG Xiao, WANG Yong.
Study on the Anodic Bonding Mechanism and Mechanical Properties of Glass and Silicon Carbide
[J]. Journal of Mechanical Engineering, 2024, 60(16): 151-159.
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| [13] |
WANG Xing-dong, WANG Zi-yang, TANG Wei, LI Jun, LIU Bei, BAI Hao-ke.
Study on Heart Shaped Buckling Mechanism and Prevention Method of Thin Silicon Steel
[J]. Journal of Mechanical Engineering, 2023, 59(8): 121-131.
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| [14] |
WU Zhipeng, GAO Dedong, WANG Shan, WEI Xiaoxu, SHAO Mingxi, XIN Yuanqing.
A Review on Recycling Technology of End-of-life Crystalline Silicon Photovoltaic Modules
[J]. Journal of Mechanical Engineering, 2023, 59(7): 307-329.
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| [15] |
ZHANG Yu, KANG Renke, GAO Shang, HUANG Jinxing, ZHU Xianglong.
Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding
[J]. Journal of Mechanical Engineering, 2023, 59(3): 328-336.
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