Mechanism and Quality Analysis of Laser Assisted Grinding of Silicon Nitride Ceramics Influenced by Regular Patterns

doi:10.3901/JME.2022.15.152

Abstract

Abstract: In order to solve the problem of difficult machining of silicon nitride ceramics, the laser induced micro-groove assisted grinding is studied.According to the mechanism of laser-assisted grinding, an experimental system of laser-assisted grinding is built, and three kinds of regular pattern surface microstructures, such as ring, checkerboard and arc, are designed.Through the grinding mechanics and geometry analysis of the influence of three kinds of regular patterns micro-grooves, and then combined with the grinding process cutter design, the grinding force and surface roughness of silicon nitride ceramics are measured.The results show that the laser induced micro-groove assisted grinding can reduce the grinding force and surface roughness of engineering ceramics, so as to improve the grinding efficiency and quality of engineering ceramics.The grinding force of the surface with laser induced micro-texture at 40 μm grinding depth is similar to that of the surface without laser assisted grinding at 10 μm grinding depth, and the machining quality can be improved up to 6%.Meanwhile, comparison of grinding force and machining quality shows that the ring regular pattern is the best laser induced micro-groove trajectory.

Key words: silicon nitride, laser induced micro-groove, grinding mechanism, grinding force, surface roughness

CLC Number:

TG580

ZHENG Dihao, QIAN Wei, WU Chongjun, GUO Weicheng. Mechanism and Quality Analysis of Laser Assisted Grinding of Silicon Nitride Ceramics Influenced by Regular Patterns[J]. Journal of Mechanical Engineering, 2022, 58(15): 152-165.

References

[1] 王涛, 王盛, 乔伟林, 等.单向C/SiC复合材料平面磨削的磨削力模型研究[J].中国机械工程, 2019, 30(17):2017-2021.WANG Tao, WANG Sheng, QIAO Weilin, et al. Research on grinding force model of plane grinding for unidirectional C/SiC composites[J]. China Mechanical Engineering, 2019, 30(17):2017-2021.
[2] 姚燕生, 袁珠珠, 王园园, 等.氮化硅陶瓷水下激光与超声复合加工方法及其机理研究[J].机械工程学报, 2017, 53(27):207-216.YAO Yansheng, YUAN Zhuzhu, WANG Yuanyuan, et al.Research on ultrasonic-laser machining underwater and its mechanism for silicon nitride ceramics[J]. Journal of Mechanical Engineering, 2017, 53(27):207-216.
[3] CHEN J, HUANG H, XU X. An experimental study on the grinding of alumina with a monolayer brazed diamond wheel[J]. The International Journal of Advanced Manufacturing Technology, 2009, 41(1-2):16-23.
[4] 王向伟, 王海龙, 王扬.基于微波热裂法的陶瓷切割技术[J].中国机械工程, 2019, 30(23):2820-2828.WANG Xiangwei, WANG Hailong, WANG Yang.Technology of cutting ceramic sheetswith microwave based on thermal controlled fracture method[J]. China Mechanical Engineering, 2019, 30(23):2820-2828.
[5] 曹建国, 张勤俭.碳化硅陶瓷超声振动辅助磨削材料去除特性研究[J].机械工程学报, 2019, 55(13):205-211.CAO Jianguo, ZHANG Qinjian. Material removal behavior in ultrasonic assisted grinding of SiC ceramics[J].Journal of Mechanical Engineering, 2019, 55(13):205-211.
[6] CAO J, WU Y, LU D, et al. Material removal behavior in ultrasonic-assisted scratching of SiC ceramics with a single diamond tool[J]. International Journal of Machine Tools and Manufacture, 2014, 79:49-61.
[7] ZHANG X, CHEN G, AN W, et al.Experimentalinvestigations of machining chara-cteristics of laser-induced thermal cracking in alumina ceramic wet grinding[J]. The International Journal of Advanced Manufacturing Technology, 2014, 72(9-12):1325-1331.
[8] 刘伟, 邓朝晖, 万林林, 等.单颗金刚石磨粒切削氮化硅陶瓷仿真与试验研究[J].机械工程学报, 2015, 51(21):191-198.LIU Wei, DENG Zhaohui, WAN Linlin, et al. Simulation and experiment study for silicon nitride cutting with single diamond grain[J]. Journal of Mechanical Engineering, 2015, 51(21):191-198.
[9] 邓家云, 潘继生, 张棋翔, 等.单晶Si C基片的化学机械抛光技术研究进展[J].金刚石与磨料磨具工程, 2020, 40(1):79-91.DENG Jiayun, PAN Jisheng, ZHANG Qixiang, et al.Research progress in chemical mechanical polishing of single crystal SiC substrates[J]. Diamond&Abrasives Engineering, 2020, 40(1):79-91.
[10] 贾晓凤, 赵波.超声振动辅助ELID复合内圆磨削系统中大负载变幅器的设计及应用[J].金刚石与磨料磨具工程, 2020, 40(1):15-23.JIA Xiaofeng, ZHAO Bo. Design and application of large load amplitude transformer in ELID compound internal grinding system assisted by ultrasonic vibration[J].Diamond&Abrasives Engineering, 2020, 40(1):15-23.
[11] 王秋燕, 梁志强, 白硕玮, 等.超声振动螺线磨削砂轮表面的功率谱密度分析[J].金刚石与磨料磨具工程, 2021, 41(1):58-64.WANG Qiuyan, LIANG Zhiqiang, BAI Shuowei, et al.Power spectrum density characterization of grinding wheel surface in ultrasonic vibration spiral grinding[J].Diamond&Abrasives Engineering, 2021, 41(1):58-64.
[12] 丁凯, 李奇林, 苏宏华, 等.硬脆材料超声辅助磨削技术研究现状及展望[J].金刚石与磨料磨具工程, 2020, 40(1):5-14.DING Kai, LI Qilin, SU Honghua, et al. Study status and future prospects on ultrasonic assisted grinding of hard and brittle materials[J]. Diamond&Abrasives Engineering, 2020, 40(1):5-14.
[13] 李博, 郑文光, 黄军, 等.面向再制造的高能束射流清洗技术综述[J].金刚石与磨料磨具工程, 2021, 41(4):19-24.LI Bo, ZHENG Wenguang, HUANG Jun, et al. Reviews on high energy fluid jet cleaning technologies with emphasis on applications in remanufacturing[J]. Diamond&Abrasive Engineering, 2021, 41(4):19-24.
[14] SONG H W, DAN J Q, LI J L, et al.Experimental study on the cutting force during laser-assisted machining of used silica based on the Taguchi method and response surface methodology[J]. Journal of Manufacturing Processes, 2019, 38:9-20.
[15] 高延峰, 肖建华. Ti-6Al-4V合金激光辅助铣削的刀具磨损特性[J].中国机械工程, 2016, 27(21):2877-2883.GAO Yanfeng, XIAO Jianhua. Characteristics of cutting tool wear during LAM processes for Ti-6Al-4V alloy[J].China Mechanical Engineering, 2016, 27(21):2877-2883.
[16] 周雯雯, 王建青, 赵晶, 等.单颗磨粒划擦SiC_f/SiC陶瓷基复合材料的试验研究[J].金刚石与磨料磨具工程, 2021, 41(1):51-57.ZHOU Wenwen, WANG Jianqing, ZHAO Jing, et al.Experimental research on single abrasive grain scratch Si C_f/SiC ceramic matrix composite[J]. Diamond&Abrasives Engineering, 2021, 41(1):51-57.
[17] KIZAKI T, TIO Y, TANABE S, et al. Laser-assisted machining of zirconia ceramics using a diamond bur[J].Procedia CIRP, 2016, 42:497-502.
[18] GUERRINI G, LUTEY A H A, MELKOTE SN, et al.High throughput hybrid laser assisted machining of sintered reaction bonded silicon nitride[J]. Journal of Mechanical Working Technology, 2018, 252:628-635.
[19] 马哲伦, 于奎东, 董金龙. Al₂O₃陶瓷的激光辅助磨削机理[J].东北大学学报, 2020, 41(4):541-546.MA Zhelun, YU Kuidong, DONG Jinlong. Laser-assisted grinding mechanism of Al₂O₃ceramics[J]. Journal of Northeastern University, 2020, 41(4):541-546.
[20] 于天彪, 刘传蒙, 于奎东, 等.激光热辅助磨削石英玻璃的实验研究[J].东北大学学报, 2019, 40(10):1467-1473.YU Tianbiao, LIU Chuanmeng, YU Kuidong, et al.Experimental study on laser heat-assisted grindi-ng quartz glass[J]. Journal of Northeastern University, 2019, 40(10):1467-1473.
[21] 李锶, 熊学峰, 温东东, 等.激光结构磨削在氮化硅陶瓷中的磨削行为[J].金刚石与磨料磨具工程, 2019, 39(6):69-74.LI Si, XIONG Xuefeng, WEN Dongdong. Study on grinding behavior of laser-structured grinding in silicon nitride ceramic[J]. Diamond&Abrasives Engineering, 2019, 39(6):69-74.
[22] AGARWAL S, RAO P V. Predictive modeling of force and power based on a new analytical unreformed chip thickness model in ceramic grinding[J].International Journal of Machine Tools&Manufacture, 2013, 65(2):68-78.
[23] 李伯民, 赵波.现代磨削技术[M].北京:机械工业出版社, 2003.LI Bomin, ZHAO Bo. Modern grinding technology[M].Beijing:China Machine Press, 2003.
[24] 王龙, 汪刘应, 唐修检, 等.硬脆材料磨削加工机理研究进展[J].制造技术与机床, 2021, (10):26-31.WANG Long, WANG Liuying, TANG Xiujian, et al.Research progress on grinding mechanism of hard and brittle materials[J]. Manufacturing Technology&Machine Tool, 2021, (10):26-31.
[25] AZARHOUSHANG B, SOLTANI B, DANESHI A. Study of the effects of laser micro structuring on grinding of silicon nitride ceramics[J]. CIRP Annals, 2018, 67:329-332.
[26] 许胜.氧化锆陶瓷激光辅助磨削的辐照效应与材料去除机理研究[D].上海:上海交通大学, 2017.XU Sheng. Laser irradiation effect and material removal mechanism in hybrid grinding of zirconia ceramics[D].Shanghai:Shanghai Jiao Tong University, 2017.
[27] 于腾飞, 苏宏华, 戴剑博, 等.单颗磨粒磨削碳化硅陶瓷磨削力与比能研究[J].南京航空航天大学学报, 2018, 50(1):120-125.YU Tengfei, SU Honghua, DAI Jianbo, et al. Grinding force and specific grinding energy in process of grinding SiC with single grit[J]. Journal of Nanjing University of Aeronautics&Astronautics, 2018, 50(1):120-125.
[28] XU S, YAO Z, CAI H Y, et al. An experimental investigation of grinding force and energy in laser thermal shock-assisted grinding of zirconia ceramics[J].International Journal of Advanced Manufacturing Technology, 2017, 91(9-12):3299-3306.
[29] MALKIN S.磨削技术理论与应用[M].蔡光起, 巩亚东, 宋贵亮译.沈阳:东北大学出版社, 2002.Malkin S. Grinding Technology theory and applications of mcahining with abrasibes[M]. Translated by CAI Guangqi, GONG Yadong, SONG Guiliang. Shengyang:Northeastern University Press, 2002.
[30] MA L J, GONG Y D, CHEN X H. Study on surface roughness model and surface forming mechanism of ceramics in quick point grinding[J]. International Journal of Machine Tools and Manufacture, 2014, 77:82-92.
[31] BIFANO T G, DOW T A, SCATTERGOOD R O.Ductile regime grinding:A new technology for maching brittle materials[J]. Journal of Engineering for Industry, 1991, 113(2):184-189