Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding

doi:10.3901/JME.2023.03.328

Abstract

Abstract: In order to avoid the grinding burns and grinding dust during dry mechanical chemical grinding (MCG), a new soft abrasive grinding wheel (SAGW) is developed for silicon wafer in wet MCG. The grinding performance of new SAGW and the corresponding material removal mechanism during silicon wafer grinding are systematically investigated. Based upon the machining principle of wet MCG, the new SAGW employs SiO₂ as wheel abrasives, and modified water resistant resin as wheel bond. The silicon wafer grinding experiments are conducted to analyze the grinding performance of newly developed SAGW performance, and compared with the traditional diamond grinding wheel and the previous SAGW of dry MCG in terms of surface and subsurface quality of ground silicon wafer. The surface component of silicon wafer in wet MCG process is examined using X-ray photoelectron spectrometer, and the corresponding chemical reactions are analyzed. The results show that the newly developed SAGW could be able to produce a silicon wafer surface with a surface roughness Raof 0.98 nm and subsurface damage layer is 15 nm thick, which is significantly better than that ground using the traditional diamond wheel and similar to that obtained from the previous SAGW of dry MCG process. Chemical reactions occur among monocrystalline silicon, SiO₂ abrasives and deionized water during wet MCG process, and the silicate is formed on the topmost ground surface of the silicon surface and easily removed by the mechanical abrasion involved in the MCG process, generating an ultra-smooth and low-damage surface by utilizing the mechanical friction and chemical reaction.

Key words: mechanical chemical grinding (MCG), silicon wafer, soft abrasive grinding wheel, surface roughness, subsurface damage

CLC Number:

TN305

ZHANG Yu, KANG Renke, GAO Shang, HUANG Jinxing, ZHU Xianglong. Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding[J]. Journal of Mechanical Engineering, 2023, 59(3): 328-336.

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