Key Techniques of Micromanipulation Devices for MEMS Assembling and Packaging

Abstract

Abstract: The characteristics of micro electro mechanical system (MEMS) assembling and packaging process are analyzed, and the development status of machining devices is given. According to the characteristics of MEMS industry development, the key techniques of MEMS assembling and packaging devices are described, including database of technological parameters, fast precision positioning, modular working tools, fast micro-vision, flexible clamping and automatic material handling techniques. The composition structure and working principle of an anodized bonding device for MEMS pressure sensor and a wire bonding device are introduced, and some experimental results are given. At last, the development trend of MEMS assembling and packaging techniques and devices are discussed.

Key words: Fabrication, Micro electro mechanical system (MEMS), Micromanipulation devices, Packaging

CLC Number:

TP24

SUN Lining;CHEN Liguo;RONG Weibin;XIE Hui;LIU Yanjie. Key Techniques of Micromanipulation Devices for MEMS Assembling and Packaging[J]. , 2008, 44(11): 13-19.

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http://www.cjmenet.com.cn/EN/Y2008/V44/I11/13

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Key Techniques of Micromanipulation Devices for MEMS Assembling and Packaging

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