石英玻璃的单颗磨粒划擦应力场解析模型及损伤可控磨削机理研究

doi:10.3901/JME.2018.21.191

机械工程学报 ›› 2018, Vol. 54 ›› Issue (21): 191-204.doi: 10.3901/JME.2018.21.191

石英玻璃的单颗磨粒划擦应力场解析模型及损伤可控磨削机理研究

姚鹏^1,2, 王伟³, 黄传真^1,2, 朱洪涛^1,2

1. 山东大学机械工程学院济南 250061;
2. 山东大学高效洁净机械制造教育部重点实验室济南 250061;
3. 中国石油大学(华东)机电工程学院青岛 266580

收稿日期:2017-11-29 修回日期:2018-04-05 出版日期:2018-11-05 发布日期:2018-11-05
通讯作者: 姚鹏(通信作者),男,1979年出生,博士,副教授。主要研究领域为磨削与超精密加工技术。E-mail:yaopeng@sdu.edu.cn;王伟(通信作者),女,1988年出生,博士,讲师。主要研究方向为磨削与超精密加工技术。E-mail:wangwei88@upc.edu.cn
基金资助:
国家重点研发计划“智能机器人”专项（2017YFB1301903）、中科院光学系统先进制造技术重点实验室开放基金（Y6SY1FJ160-001）和中央高校基本科研业务费专项（18CX02156A）资助项目。

Analytical Model for the Elastic Stress Field during Scratching and Controllable Precision Grinding Mechanisms of Fused Silica

YAO Peng^1,2, WANG Wei³, HUANG Chuanzhen^1,2, ZHU Hongtao^1,2

1. School of Mechanical Engineering, Shandong University, Jinan 250061;
2. Key Laboratory of High Efficiency and Clean Mechanical Manufacture, Ministry of Education, Shandong University, Jinan 250061;
3. College of Electromechanical Engineering, China University of Petroleum, Qingdao 266580

Received:2017-11-29 Revised:2018-04-05 Online:2018-11-05 Published:2018-11-05

摘要/Abstract

摘要： 构建了单颗磨粒划擦各向同性硬脆材料的弹性应力场解析模型，并以此为基础提出单颗磨粒划擦各向同性硬脆材料表面的裂纹失稳扩展临界函数，临界函数包含原始表面应变速率、磨削液等因素对裂纹扩展造成的影响。将石英玻璃作为研究对象，深入分析了表面微裂纹损伤的可控磨削机理。在进行石英玻璃的磨削试验中，材料的磨削机理随单颗磨粒磨削深度的增加而变化，依次是塑性域去除、低载半脆性域去除、全脆性域去除和高载半脆性域去除。在1 mm/min的工件进给速度下，可以对石英玻璃进行塑性域磨削，从而获得无裂纹损伤的光滑磨削表面，然而其磨削效率较低，在实际生产中不能发挥理想的作用。对石英玻璃开展全脆性域磨削时，材料去除率较高、加工表面表面质量好、微裂纹损伤深度较小，砂轮自锐性良好，是一种优良的精密磨削工艺。

关键词: 脆塑转变, 各向同性硬脆材料, 精密磨削, 石英玻璃, 应力场解析模型

Abstract: An analytical model for the elastic stress field during scratching an isotropic hard brittle material is presented. A critical function for crack propagation for single grit scratching an isotropic hard brittle material is developed. The effects of original crack density on the surface, strain rate and grinding coolant are considered in the function. Controllable grinding mechanisms of surface micro cracks on fused silica are investigated based on the critical function for crack propagation. The grinding mechanisms variates from ductile mode to low-load semi brittle mode, full brittle mode and high-load semi brittle mode in sequence with the increasing single grit scratching depth. When the workpiece feed rate is low to 1 mm/min, fused silica is removed by crack-free ductile grinding, but the material removal efficiency is too low for practical fabricating of fused silica lens. While full-brittle grinding is a feasible precision process for its shallow subsurface damage, high efficiency and good self-sharpening of grinding wheel.

Key words: ductile-brittle transition, elastic stress field analytical model, fused silica, isotropic hard brittle material, precision grinding

中图分类号:

TG580

姚鹏, 王伟, 黄传真, 朱洪涛. 石英玻璃的单颗磨粒划擦应力场解析模型及损伤可控磨削机理研究[J]. 机械工程学报, 2018, 54(21): 191-204.

YAO Peng, WANG Wei, HUANG Chuanzhen, ZHU Hongtao. Analytical Model for the Elastic Stress Field during Scratching and Controllable Precision Grinding Mechanisms of Fused Silica[J]. Journal of Mechanical Engineering, 2018, 54(21): 191-204.

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石英玻璃的单颗磨粒划擦应力场解析模型及损伤可控磨削机理研究

Analytical Model for the Elastic Stress Field during Scratching and Controllable Precision Grinding Mechanisms of Fused Silica

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