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机械工程学报

机械工程学报 ›› 2017, Vol. 53 ›› Issue (9): 193-200.doi: 10.3901/JME.2017.09.193

• 制造工艺与装备 • 上一篇    下一篇

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Si3N4陶瓷的剪切增稠抛光*

李敏1,2,3, 袁巨龙2,3, 吕冰海3, 赵萍3, 钟美鹏3   

  1. 1. 湖南科技大学难加工材料高效精密加工湖南省重点实验室 湘潭 411201；
    2. 湖南大学国家高效磨削工程技术研究中心 长沙 410082；
    3. 浙江工业大学超精密加工研究中心 杭州 310014
  • 出版日期:2017-05-05 发布日期:2017-05-05
  • 作者简介:李敏，男，1983年出生，博士，副教授，硕士研究生导师。主要研究方向为精密与超精密加工技术及装备。E-mail：li-min-wax@163.com
  • 基金资助:
    * 国家自然科学基金(51605163，51175166)、浙江省自然科学基金杰出青年基金(LR17E0500002)和湖南科技大学博士科研启动基金(E56121)资助项目; 20160924收到初稿，20161228收到修改稿;

Shear-thickening Polishing of Si3N4 Ceramics

LI Min1,2,3, YUAN Julong2,3, Lü Binghai3, ZHAO Ping3, ZHONG Meipeng3   

  1. 1. Hunan Provincial Key Laboratory of High Efficiency and Precision Machining for Difficult-to-Cut Material， Hunan University of Science and Technology， Xiangtan 411201;
    2. National Engineering Research Center for High Efficiency Grinding， Hunan University， Changsha 410082;
    3. Ultraprecision Machining Center， Zhejiang University of Technology， Hangzhou 310014
  • Online:2017-05-05 Published:2017-05-05

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摘要：

利用剪切增稠抛光技术(Shear-thickening polishing，STP)对Si3N4陶瓷圆柱工件进行的超精密加工，考察所制备的含有金刚石磨粒的抛光液流变行为，分析Si3N4陶瓷的金刚石基剪切增稠抛光液的STP特性，研究Si3N4陶瓷圆柱工件的加工效率、表面质量及圆度误差精度。结果表明：含有金刚石磨粒的抛光液具有非牛顿幂律流体的剪切增稠性质，当剪切速率()不断提高时，储能模量(G′)、耗能模量(G″)均呈现出一定的增长趋势，耗散因子(n′)不断降低;Si3N4陶瓷的STP加工为持续微切屑“柔性抛光”过程;抛光液中的金刚石磨粒粒径为0.2 μm时，工件抛光的材料去除率相对较大，且MRR理论值与试验值的平均误差约为11.7%，表明在抛光区域内STP材料去除模型具有一定的有效性;工件经60 min的STP后，材料去除率由初期4.20 μm/h下降到4.00 μm/h，表面粗糙度Ra由107.2 nm降至26.5 nm;抛光120 min后，材料去除率会减小至3.85 μm/h，表面粗糙度可降至Ra 6.5 nm;由初始圆度误差RONt 1.418 μm下降至RONt 0.360 μm，实现了Si3N4圆柱高效超精密抛光。

关键词: 表面粗糙度, 氮化硅陶瓷, 高效加工, 剪切增稠抛光, 金刚石磨粒, 流变行为, 圆度误差, 抛光

Abstract:

：Shear-thickening polishing (STP) technology is used on ultraprecision machining of Si3N4 ceramics cylindrical workpiece. The STP slurry with diamond abrasives is prepared for STP process and its rheological property is studied. The polishing performance of Si3N4 ceramics with STP is analyzed. The machining efficiency, surface quality and roundness error of Si3N4 ceramic cylindrical workpiece are studied. Results show that STP slurry with diamond abrasives exhibits non-Newtonian power-law fluid characteristics with shear-thickening effect. When the shear rate () increases, the storage modulus (G′) and loss modulus (G″) show a growth trend. In addition, the dissipation factor (n′) decreases continuously. The STP removal characteristic of Si3N4 ceramics is a continuous micro cutting process of “flexible polishing”. As using STP slurry with abrasive particle size of 0.2 μm, the difference of material removal rate (MRR) between theoretical and experimental results is 6.12%, and the validation of MRR model is verified. The MRR decreases from 4.20 μm/h to 4.00 μm/h after 60 mins′ polishing and the average surface roughnessRa reduces from 107.2 nm to 26.5 nm; and after 120 mins′ polishing, the MRR decreases to 3.85 μm/h andRa can be reduced to 6.5 nm; under the same conditions, the STP with diamond abrasives slurry can obtain the Si3N4 ceramics cylindrical workpiece with roundness error reduced from RONt 1.418 μm to RONt 0.360 μm, which indicates that STP process achieves the ultraprecision polishing of Si3N4 ceramics cylindrical workpiece.

Key words: diamond abrasive, high-efficiency machining, rheology, roundness error, shear-thickening polishing(STP), silicon nitride, surface roughness, polishing

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