• CN:11-2187/TH
  • ISSN:0577-6686

›› 2008, Vol. 44 ›› Issue (4): 222-227.

• 论文 • 上一篇    下一篇

基于时间应力及隐马尔可夫模型的焊点故障预测技术

吕克洪; 邱静;刘冠军   

  1. 国防科技大学机电工程与自动化学院
  • 发布日期:2008-04-15

Fault Prognosis Technology for Solder Joints Based onTime Stress and Hidden Markov Models

LÜ Kehong;QIU Jing;LIU Guanjun   

  1. College of Mechatronics Engineering & Automatization, National University of Defense Technology
  • Published:2008-04-15

摘要: 焊点所承受的各种环境应力和工作应力的时间历程(时间应力)是其疲劳失效的直接外因。从时间应力导致焊点故障的机理入手,以焊点的三维有限元模型为基础,对焊点实时损伤的评估方法进行研究。通过建立焊点损伤及故障演化的隐马尔可夫模型,以实时损伤评估信息为基础,结合基于寿命消耗的故障预测方法,研究从时间应力测量的角度对焊点进行故障预测的详细技术流程和相关算法。最后以塑料四方扁平封装器件焊点为研究对象,对提出的焊点故障预测技术的有效性进行了试验验证和分析。

关键词: 故障预测, 焊点, 时间应力, 隐马尔可夫模型, 合金粉末, 路径规划 , 三维扫描 , 钢轨磨损 , 激光熔覆

Abstract: The main external factor of solder joints degradation or deviation from an expected normal condition is the time stress such as work and environment stresses. A damage assessment method for solder joints based on time stress monitoring and three-dimensional finite element model is introduced. A damage-fault evolution model of solder joints based on hidden Markov models (HMM) is put forward. And then, the fault prognosis technology of the solder joints is researched based on the HMM model, real-time damage information and life consumption prognosis method. The detailed process and algorithm of the fault prognosis technology are studied based on time stress monitoring. Finally, the validity of the technology is proved by an experimental study of plastic quad flat package (PQFP) solder joints.

Key words: Fault prognosis, Hidden Markov models (HMM), Solder joints, Time stress, alloy powder, laser cladding , path planning , 3D scanning , rail abrasion

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