基于电场驱动喷射微3D打印玻璃基板TGV金属化研究

doi:10.3901/JME.260294

摘要/Abstract

摘要： 玻璃通孔(Through-glass via，TGV)技术是集成电路三维异质异构集成的关键技术之一，为克服传统TGV通孔金属化工艺工序复杂、成本高，无法满足产品研发阶段低成本、快速制造的需求，尤其是难以实现同一基板不同孔径、高深宽比TGV金属化，提出一种基于电场驱动(EFD)喷射微3D打印的TGV金属化方法：以高固含量(质量分数90%)的纳米银浆为打印材料，从微孔底部开始连续喷射沉积银浆，结合不同喷头提升模式和填充、预固化工艺优化，实现了同一基板不同孔径以及高深宽比的TGV金属化。对TGV金属化通孔进行内部结构表征、导电性和可靠性测试，通孔内部组织致密、具有良好的导电性和可靠性。研究结果表明该方法可实现高性能TGV金属化，为玻璃基板研发设计、小批量生产提供了一种全新的低成本、快速解决方案。

关键词: 3D封装, 微3D打印, 增材制造, 玻璃通孔, 金属化

Abstract: Through-glass via (TGV) technology is an important approach for three-dimensional heterogeneous integration in the development of integrated circuit. However, the procedures are complex and the cost is high in the traditional TGV metallization processes, which cannot satisfy the low-cost and fast production in the new product design stage. Especially, when the via diameters on a substrate are varied or the depth-to-width ratio is high, it is difficult to realize TGV metallization. A new approach based on electric field-driven (EFD) jet micro-3D printing is proposed for the TGV metallization. Nano-silver paste with high-solid-content (90wt%) is used as printing material. The filling process is started from the bottom until the via is completely filled. The printing and pre-curing parameters are optimized combined with three nozzle lifting patterns. Finally, TGV metallization with varying diameters on a substrate and a high depth-to-width ratio is achieved. Microstructure, conductivity and reliability are studied. The filled vias exhibit dense microstructure, good conductivity and reliability. It is demonstrated that the new approach can realize TGV metallization with high performance, which provides a low-cost and rapid solution for the new product design and small-batch production of TGV substrates.

Key words: 3D packaging, micro-scale 3D printing, additive manufacturing, through-glass via, metallization

中图分类号:

TN405.97

黄君杰, 吴娜, 许权, 朱晓阳, 王勇强, 李红珂, 兰红波. 基于电场驱动喷射微3D打印玻璃基板TGV金属化研究[J]. 机械工程学报, 2026, 62(13): 418-433.

HUANG Junjie, WU Na, XU Quan, ZHU Xiaoyang, WANG Yongqiang, LI Hongke, LAN Hongbo. Through-glass Via Metallization Based on Electric-field-driven Jet Microscale 3D Printing Technology[J]. Journal of Mechanical Engineering, 2026, 62(13): 418-433.

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链接本文: http://www.cjmenet.com.cn/CN/10.3901/JME.260294

http://www.cjmenet.com.cn/CN/Y2026/V62/I13/418

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