超薄柔性热管蒸汽通道微压印成形及传热性能研究

doi:10.3901/JME.2024.14.329

机械工程学报 ›› 2024, Vol. 60 ›› Issue (14): 329-337.doi: 10.3901/JME.2024.14.329

• 可再生能源与工程热物理 • 上一篇下一篇

扫码分享

超薄柔性热管蒸汽通道微压印成形及传热性能研究

孙亚隆¹, 汤勇^2,3, 梁富业², 张仕伟², 伍春霞², 帅茂², 唐恒³

1. 郑州大学机械与动力工程学院郑州 450001;
2. 华南理工大学机械与汽车工程学院广州 510640;
3. 深圳大学机电与控制工程学院深圳 518000

收稿日期:2023-08-11 修回日期:2024-02-23 出版日期:2024-07-20 发布日期:2024-08-29
作者简介:孙亚隆,男,1995年出生,博士。主要研究方向为微纳结构制造、柔性热管设计制造。E-mail:sunyalong@zzu.edu.cn;汤勇,男,1962年出生,博士,教授,博士研究生导师。主要研究方向为表面功能结构制造、两相传热技术。E-mail:ytang@scut.edu.cn;唐恒(通信作者),男,1989年出生,博士,副教授,硕士研究生导师。主要研究方向为微制造,表面功能结构制造。E-mail:tangheng@szu.edu.cn
基金资助:
国家自然科学基金资助项目(52105444,51905352)。

Heat Transfer Performance Evaluation of Ultrathin Flexible Heat Pipes with Vapor Channels Formed by Micro-imprint

SUN Yalong¹, TANG Yong^2,3, LIANG Fuye², ZHANG Shiwei², WU Chunxia², SHUAI Mao², TANG Heng³

1. School of Mechanical and Power Engineering, Zhengzhou University, Zhengzhou 450001;
2. School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640;
3. College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen 518000

Received:2023-08-11 Revised:2024-02-23 Online:2024-07-20 Published:2024-08-29

摘要/Abstract

摘要： 介绍PMMA壳体超薄柔性热管的制造设备与加工过程。分别采用分离式微压印模具加工的微柱子阵列和高温烧结多层铜丝网作为蒸汽通道和吸液芯，制造厚度0.67 mm的超薄柔性热管。研究微压印温度、压力和压印时间对微柱子成形的影响。介绍超薄柔性热管传热性能试验台设计与试验方法，试验结果表明最佳充液量为350～400 μL，最高热导率达到924.1 W/(m·K)；当超薄柔性热管弯曲90°时，其热导率仍为铜热导率的1.16倍。综上所述，利用微压印成形制作的PMMA壳体超薄柔性热管具有结构灵活、成本低廉以及低蒸汽阻力的优点，是解决柔性可穿戴式电子设备散热难题的理想方案。

关键词: 柔性热管, 超薄, 微压印, 蒸汽通道, 聚合物

Abstract: The manufacturing equipment and fabrication process of ultrathin flexible heat pipe(UFHP) with PMMA casings are introduced in this study. A micro-column array fabricated by a separate micro-imprint mold and a high-temperature sintered multilayer copper mesh are used as vapor channel and wick, respectively, and UFHPs with a thickness of 0.67mm is fabricated. The effects of micro-imprint temperature, pressure, and dwell time on the forming of micro-pillars were studied. The test devices and the experimental methods of the heat transfer performance of UFHPs are introduced. The experimental results showed that the optimal liquid filling amount is 350-400 μL and the highest thermal conductivity reached 924.1 W/(m•K). The thermal conductivity of the UFHP is still 1.16 times that of copper with a bending angle of 90°. In summary, the UFHPs with PMMA casings fabricated by micro-imprint have the advantages of flexible structure, low cost, and low vapor flow resistance, and are an ideal solution to the heat dissipation problem of flexible wearable electronic devices.

Key words: flexible heat pipe, ultrathin, micro-imprint, vapor channel, polymer

中图分类号:

TK124

孙亚隆, 汤勇, 梁富业, 张仕伟, 伍春霞, 帅茂, 唐恒. 超薄柔性热管蒸汽通道微压印成形及传热性能研究[J]. 机械工程学报, 2024, 60(14): 329-337.

SUN Yalong, TANG Yong, LIANG Fuye, ZHANG Shiwei, WU Chunxia, SHUAI Mao, TANG Heng. Heat Transfer Performance Evaluation of Ultrathin Flexible Heat Pipes with Vapor Channels Formed by Micro-imprint[J]. Journal of Mechanical Engineering, 2024, 60(14): 329-337.

导出引用管理器 EndNote|Reference Manager|ProCite|BibTeX|RefWorks

链接本文: http://www.cjmenet.com.cn/CN/10.3901/JME.2024.14.329

http://www.cjmenet.com.cn/CN/Y2024/V60/I14/329

参考文献

[1] GIBBONS M J，MARENGO M，PERSOONS T. A review of heat pipe technology for foldable electronic devices[J]. Applied Thermal Engineering，2021，194：117087.
[2] 汤勇，唐恒，万珍平，等. 超薄微热管的研究现状及发展趋势[J]. 机械工程学报，2017，53(20)：131-144. TANG Yong，TANG Heng，WAN Zhenping，et al. Development status and perspective trend of ultra-thin micro heat pipe[J]. Journal of Mechanical Engineering，2017，53(20)：131-144.
[3] 汤勇，孙亚隆，唐恒，等. 柔性热管的研究现状与发展趋势[J]. 机械工程学报，2022，58(10)：265-279. TANG Yong，SUN Yalong，TANG Heng，et al. Development status and perspective trend of flexible heat pipe[J]. Journal of Mechanical Engineering，2022，58(10)：265-279.
[4] JUNG C，LIM J，KIM S J. Fabrication and evaluation of a high-performance flexible pulsating heat pipe hermetically sealed with metal[J]. International Journal of Heat and Mass Transfer，2020，149：119180.
[5] SUGIMOTO K，ALASLI A，UENO A，et al. Design and fabrication of flexible two-phase heat transport device for wearable interfaces[C]// IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)，2021，10(2)：95-98.
[6] PHAN N，NAGANO H. Fabrication and testing of a miniature flat evaporator loop heat pipe with polydimethylsiloxane and molding[J]. Applied Thermal Engineering，2020，175(2)：115377.
[7] SUN Y，ZHANG S，CHEN G，et al. Experimental and numerical investigation on a novel heat pipe based cooling strategy for permanent magnet synchronous motors[J]. Applied Thermal Engineering，2020，170(3)：114970.
[8] 汤勇，孙亚隆，郭志军，等. 电机散热系统的研究现状与发展趋势[J]. 中国机械工程，2021，32(10)：1135-1150. TANG Yong，SUN Yalong，GUO Zhijun，et al. Development status and perspective trend of motor cooling systems[J]. China Mechanical Engineering，2021，32(10)：1135-1150.
[9] GEBRAEL T，LI J，GAMBOA A R，et al. High-efficiency cooling via the monolithic integration of copper on electronic devices[J]. Nature Electronics，2022，12(5)：1-9.
[10] HUANG Q，DENG J，LI X，et al. Experimental investigation on thermally induced aluminum nitride based flexible composite phase change material for battery thermal management[J]. Journal of Energy Storage，2020，32(5)：101755.
[11] OSHAMN C，LI Q，LIEW L A，et al. Flat flexible polymer heat pipes[J]. Journal of Micromechanics and Microengineering，2013，23(1)：015001.
[12] LIU C，LI Q，FAN D. Fabrication and performance evaluation of flexible flat heat pipes for the thermal control of deployable structure[J]. International Journal of Heat and Mass Transfer，2019，144(2)：118661.
[13] 许乐. 超薄柔性平板热管的制备及其传热性能研究[D]. 南京：南京航空航天大学，2020. XU Le. Perparation and thermal performance study of ultra-thin flexible flat heat pipe[D]. Nanjing：Nanjing University of Aeronautics and Astronautics，2020.
[14] LEWIS R，XU S，LIEW L，et al. Thin flexible thermal ground planes：Fabrication and scaling characterization[J]. Journal of Microelectromechanical Systems，2015，24(6)：2040-2048.
[15] LEWIS R，LIEW L A，XU S，et al. Microfabricated ultra-thin all-polymer thermal ground planes[J]. Science Bulletin，2015，60(7)：701-706.
[16] WANG Z，LV J，LI J，et al. Fabrication and evaluation of micro-channel array for flexible on-chip PEMFC by new evaluation method and self-made hot embossing system[J]. The International Journal of Advanced Manufacturing Technology，2020，108(5-6)：1381-1387.
[17] DUMOND J J，LOW H Y. Recent developments and design challenges in continuous roller micro-and nanoimprinting[J]. Journal of Vacuum Science & Technology B，Nanotechnology and Microelectronics： Materials，Processing，Measurement，and Phenomena，2012，30(1)：010801.
[18] GONG D，LONG J，FAN P，et al. Thermal stability of micro-nano structures and superhydrophobicity of polytetrafluoroethylene films formed by hot embossing via a picosecond laser ablated template[J]. Applied Surface Science，2015，331(5)：437-443.
[19] PENG L，DENG Y，YI P，et al. Micro hot embossing of thermoplastic polymers：A review[J]. Journal of Micromechanics and Microengineering，2014，24(1)：013001.
[20] KRICKA L，FORTINA P，PANARO N，et al. Fabrication of plastic microchips by hot embossing[J]. Lab. on a Chip，2002，2(1)：1-4.
[21] LEE M，OH J，LIM H，et al. Enhanced liquid transport on a highly scalable，cost‐effective，and flexible 3D topological liquid capillary diode[J]. Advanced Functional Materials，2021，31(21)：2011208.
[22] 王丽，朱忠猛，蒋晗. 聚甲基丙烯酸甲酯材料(PMMA)纳米压/划痕变形热恢复的实验研究[J]. 实验力学，2022，37(2)：161-174. WANG Li，ZHU Zhongmeng，JIANG Han. Experimental study on thermal recovery of nano-indentation/scratch deformation of poly(methylmethacrylate)[J]. Journal of Experimental Mechanics，2022，37(2)：161-174.
[23] YANG Y，LI J，WANG H，et al. Microstructured wettability pattern for enhancing thermal performance in an ultrathin vapor chamber[J]. Case Studies in Thermal Engineering，2021，25(6)：100906.
[24] WILKE K L，ANTAO D S，CRUZ S，et al. Polymer infused porous surfaces for robust，thermally conductive，self-healing coatings for dropwise condensation[J]. ACS Nano，2020，14(11)：14878-14886.
[25] 聂聪. 超薄均热板二次除气/封口焊接机理及性能研究[D]. 广州：华南理工大学，2021. NIE Cong. Study on the mechanism and performance of secondary degassing/seal welding of ultra-thin vapor chamber[D]. Guangzhou：Southe China University of Technology，2021.
[26] 郭浩，纪献兵，周儒鸿，等. 超亲水毛细芯环路热管启动及热性能分析[J]. 化工进展，2020，39(4)：1227-1234. GUO Hao，JI Xianbing，ZHOU Ruhong，et al. Analysis of start-up and thermal performance of super-hydrophilic porous wick loop heat pipe[J]. Chemical Industry and Engineering Progress，2020，39(4)：1227-1234.
[27] TANG Y，HONG S，WANG S，et al. Experimental study on thermal performances of ultra-thin flattened heat pipes[J]. International Journal of Heat and Mass Transfer，2019，134(5)：884-894.
[28] TANG H，WENG C，TANG Y，et al. Thermal performance enhancement of an ultra-thin flattened heat pipe with multiple wick structure[J]. Applied Thermal Engineering，2021，183(8)：116203.
[29] 舒阳，周志雄，黄向明，等. 精密热压成型机关键技术研究与实现[J]. 机械工程学报，2018，54(17)：200-207. SHU Yang，ZHOU Zhixiong，HUANG Xiangming，et al. Research and implementation on critical technology of precision compression molding tool[J]. Journal of Mechanical Engineering，2018，54(17)：200-207.
[30] LI D，HUANG Z，ZHAO J，et al. Analysis of heat transfer performance and vapor-liquid meniscus shape of ultra-thin vapor chamber with supporting columns[J]. Applied Thermal Engineering，2021，193(5)：117001.
[31] LIN M C，YEH J P，CHEN S C，et al. Study on the replication accuracy of polymer hot embossed microchannels[J]. International Communications in Heat and Mass Transfer，2013，42(6)：55-61.
[32] FENG W，QIN M，FENG Y. Toward highly thermally conductive all-carbon composites：Structure control[J]. Carbon，2016，109：575-597.
[33] DOMICIANO K G，KRAMBECK L，FLOREZ J，et al. Thin diffusion bonded flat loop heat pipes for electronics：Fabrication，modelling and testing[J]. Energy Conversion and Management，2022，255：115329.

超薄柔性热管蒸汽通道微压印成形及传热性能研究

Heat Transfer Performance Evaluation of Ultrathin Flexible Heat Pipes with Vapor Channels Formed by Micro-imprint

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 15

编辑推荐

Metrics

本文评价

[1]	刘佩儒, 魏发南, 姚立纲, 刘晓敏. 基于导电聚合物水凝胶改性的3D打印柔性电感器研究[J]. 机械工程学报, 2026, 62(5): 347-356.
[2]	高一聪, 吴栋, 段东新, 曾思远, 郑浩, 密尚华, 邱皓, 谭建荣. 4D打印形状记忆聚合物功能构件正向设计的进展、挑战与展望[J]. 机械工程学报, 2026, 62(1): 310-328.
[3]	汤勇, 赵威, 尹树彬, 袁雪鹏, 袁伟, 张仕伟. 基于相变传热的动力电池高效复合热控技术研究综述[J]. 机械工程学报, 2025, 61(4): 176-194.
[4]	唐恒, 黄强, 伍春霞, 孙亚隆, 汤勇. 聚合物阵列微沟槽吸液芯结构热压成形及机理研究[J]. 机械工程学报, 2025, 61(22): 80-87.
[5]	凡晓波, 杨光, 邬方兴, 关阳. 铝合金深腔超薄箱底超低温净成形及性能调控[J]. 机械工程学报, 2025, 61(14): 36-44.
[6]	贺炜林, 孟宝, 万敏. GH4169合金超薄带材U形弯曲回弹行为研究[J]. 机械工程学报, 2024, 60(14): 174-184.
[7]	张嘉昆, 王敏杰, 李红霞, 于同敏. 聚合物熔体微尺度流动过程黏度与黏性耗散的耦合作用[J]. 机械工程学报, 2022, 58(6): 52-61.
[8]	郝雨飞, 李长胜. 可测量法向力和剪切力的带屏蔽软体电容传感器[J]. 机械工程学报, 2022, 58(23): 106-113.
[9]	李捍平, 丛贇, 李小炳, 张振鹏, 刘勇. 基于非线性电导绝缘的随桥敷设高压直流电缆接头电-热场分布及优化设计^*[J]. 电气工程学报, 2022, 17(2): 226-234.
[10]	陈恭, 汤勇, 张仕伟, 钟桂生, 孙亚隆, 李杰. 超薄均热板的研究现状及发展趋势[J]. 机械工程学报, 2022, 58(12): 197-212.
[11]	左名玉, 王优强, 菅光霄, 胡宇, 莫君, 房玉鑫. 换向工况下非对称聚合物齿轮瞬态弹流润滑分析[J]. 机械工程学报, 2022, 58(11): 241-248.
[12]	汤勇, 孙亚隆, 唐恒, 万珍平, 袁伟. 柔性热管的研究现状与发展趋势[J]. 机械工程学报, 2022, 58(10): 265-279.
[13]	刘军鹏, 张嘉毓, 周雷, 段梦兰. 柔性立管内衬层的非线性力学行为分析[J]. 机械工程学报, 2021, 57(20): 89-97.
[14]	李志坚, 邢继文, 杜伯学, 肖萌, 孔晓晓, 李进. 高储能聚合物材料复配体系研究进展 ^*[J]. 电气工程学报, 2021, 16(1): 134-140.
[15]	杨昆, 张广明, 李晓强, 杨建军, 彭子龙, 兰红波. 基于电场驱动熔融喷射聚合物基复合材料高分辨率3D打印[J]. 机械工程学报, 2020, 56(23): 193-202.