• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2022, Vol. 58 ›› Issue (2): 17-25.doi: 10.3901/JME.2022.02.017

• 微纳连接新材料 • 上一篇    下一篇

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基于结构纳米薄膜的微纳连接技术研究进展

林路禅1, 刘磊2, 邹贵生2, 李铸国1   

  1. 1. 上海交通大学材料科学与工程学院 上海 200240;
    2. 清华大学机械工程系 北京 100084
  • 收稿日期:2021-05-14 修回日期:2021-10-04 出版日期:2022-01-20 发布日期:2022-03-19
  • 通讯作者: 林路禅(通信作者),男,1989年出生,博士,副教授。主要研究方向为超快激光微纳制造与微纳连接。E-mail:luchan.lin@sjtu.edu.cn
  • 基金资助:
    国家重点研发计划资助项目(2017YFB1104900)。

Research Progress of Structured Nano Thin-films Based Micro/Nanojoining Technologies

LIN Lushan1, LIU Lei2, ZOU Guisheng2, LI Zhuguo1   

  1. 1. School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240;
    2. Department of Mechanical Engineering, Tsinghua University, Beijing 100084
  • Received:2021-05-14 Revised:2021-10-04 Online:2022-01-20 Published:2022-03-19

摘要: 随着结构系统及功能器件的小型化,微小空间下的异质材料高效集成互连成为了精密仪器系统设计与器件开发的迫切需求。为满足高质量、批量化以及绿色环保的微纳制造工艺要求,结合先进纳米薄膜制备工艺得到的非稳态或亚稳态的纳米尺度薄膜材料由于其特殊的尺度效应以及表/界面结构特征,在高精度异质材料互连领域正得到广泛的研究与应用。对不同体系(金属、半导体、氧化物)的结构纳米薄膜中各组元的反应活性或各相的热稳定性进行分析与阐述,并针对所设计的纳米薄膜结构在不同领域如航天、微电子中的异质材料互连中的应用进行综述。此外,由于纳米材料自身极高的反应活性,作为辅助钎料,其在硬质材料及热敏感材料的局域互连中也展现出巨大的应用前景。

关键词: 结构纳米薄膜, 微纳连接, 表/界面结构, 热稳定性, 反应活性

Abstract: With the increasing demand for the miniaturization of structural system and functional devices, high performance heterogeneous integration at small scale is becoming an urgent need for the precise instruments design and device development. In order to meet the requirements for high quality, mass production and green manufacturing in micro/nano fabrication process, unstable and metastable nanostructured thin films have been widely studied and used in advanced materials joining, due to their excellent size effect and surface/interface structures. The reaction activity of each component and phase stability within the nanostructured thin films of different combinations (e.g. metal, semiconductor, oxide) have been illustrated. It has shown that these designed nanostructured thin films have been widely used in the heterogenous materials integration in microelectronics and astronautics. Meanwhile, with the high reaction activity of nanofilm, nanostructured nanolayers as the brazing fillers, have also shown great potential in joining of hard materials and heat-sensitive materials.

Key words: nanostructured films, micro/nanojoining, surface/interface structure, thermal stability, reaction activity

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