无压烧结银与化学镀镍(磷)和电镀镍基板的界面互连研究

doi:10.3901/JME.2022.02.159

机械工程学报 ›› 2022, Vol. 58 ›› Issue (2): 159-165.doi: 10.3901/JME.2022.02.159

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无压烧结银与化学镀镍(磷)和电镀镍基板的界面互连研究

王美玉¹, 梅云辉², 李欣³

1. 南开大学电子信息与光学工程学院天津 300350;
2. 天津工业大学电气工程学院天津 300387;
3. 天津大学材料科学与工程学院天津 300350

收稿日期:2021-02-04 修回日期:2021-05-27 出版日期:2022-01-20 发布日期:2022-03-19
通讯作者: 梅云辉(通信作者),男,1985年出生,博士,教授,博士研究生导师。主要研究方向为电子封装结构设计、工艺、材料及可靠性。E-mail:meiyunhui@163.com
作者简介:王美玉,女,1990年出生,博士,副研究员。主要研究方向为芯片封装工艺及可靠性。E-mail:meiyuwang@nankai.edu.cn
基金资助:
国家自然科学基金（51922075，51877147）和天津市科技计划（20JCYBJC00970）资助项目。

Study on Interfacial Bonding between Pressureless Sintered Silver with Electroless-plated Nickel（Phosphorus） and Electro-plated Nickel Metallization

WANG Meiyu¹, MEI Yunhui², LI Xin³

1. College of Electronic Information and Optical Engineering, Nankai University, Tianjin 300350;
2. School of Electrical Engineering, Tiangong University, Tianjin 300387;
3. School of Materials Science and Engineering, Tianjin University, Tianjin 300350

Received:2021-02-04 Revised:2021-05-27 Online:2022-01-20 Published:2022-03-19

摘要/Abstract

摘要： 化学镀镍（磷）和电镀镍是最常用的两种基板镀镍工艺，但是目前关于烧结银与这两种镀镍界面互连的对比研究鲜见报道。提出一种在空气中无压烧结银-镍界面互连的工艺方法，研究烧结温度220~300℃对烧结银与化学镀镍（磷）和电镀镍基板互连强度的影响，并且对比分析化学镀镍（磷）和电镀镍基板的表面形貌与粗糙度、化学成分、晶体结构，以及对烧结银-镍界面互连的连接强度和微观形貌的影响等。研究发现，随着烧结温度的升高，烧结银与化学镀镍（磷）和电镀镍的连接强度都先增大后降低，但是化学镀镍（磷）的富磷成分和非晶结构可以加速银-镍扩散和减缓镍的氧化，烧结银与化学镀镍（磷）的最大连接强度（42 MPa）比电镀镍基板高17 MPa左右。

关键词: 无压烧结银, 电镀镍, 化学镀镍(磷), 剪切强度

Abstract: There is lacking in reports about silver sintering on the two most widely used nickel metallizations, i.e. electroless-plated nickel (phosphorous) (Ni(P)) and electro-plated nickel (Ni). In this study, we proposed a new method by pressureless in-air silver sintering on Ni, and studied the effects of sintering temperature between 220-300℃ on the bonding strength between sintered-silver and electroless-plated Ni(P) and electro-plated Ni. Furthermore, we investigated the effects of surface morphology and roughness, chemistry, crystal structure of the two Ni metallizations on the bonding strength and microstructure of the sintered silver-nickel joints. The results showed that the bonding strength of both sintered silver-nickel joints first increased and then decreased with higher sintering temperature, but the highest bonding strength on the electroless-plated Ni(P) (42 MPa) is 17 MPa higher than that on the electro-plated Ni, due to faster diffusion from P-composition and less Ni oxidation from amorphous structure of the electroless-plated Ni(P).

Key words: pressureless silver sintering, electro-plated nickel, electroless-plated nickel (phosphorous), shear strength

中图分类号:

TG156

王美玉, 梅云辉, 李欣. 无压烧结银与化学镀镍(磷)和电镀镍基板的界面互连研究[J]. 机械工程学报, 2022, 58(2): 159-165.

WANG Meiyu, MEI Yunhui, LI Xin. Study on Interfacial Bonding between Pressureless Sintered Silver with Electroless-plated Nickel（Phosphorus） and Electro-plated Nickel Metallization[J]. Journal of Mechanical Engineering, 2022, 58(2): 159-165.

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无压烧结银与化学镀镍(磷)和电镀镍基板的界面互连研究

Study on Interfacial Bonding between Pressureless Sintered Silver with Electroless-plated Nickel（Phosphorus） and Electro-plated Nickel Metallization

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