• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2022, Vol. 58 ›› Issue (10): 265-279.doi: 10.3901/JME.2022.10.265

• 可再生能源与工程热物理 • 上一篇    下一篇

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柔性热管的研究现状与发展趋势

汤勇1,2,3, 孙亚隆1,3, 唐恒2, 万珍平1,3, 袁伟1,3   

  1. 1. 华南理工大学机械与汽车工程学院 广州 510640;
    2. 深圳大学机电与控制工程学院 深圳 518000;
    3. 广东省功能结构与器件智能制造工程实验室 广州 510640
  • 收稿日期:2021-03-15 修回日期:2021-10-15 出版日期:2022-05-20 发布日期:2022-07-07
  • 通讯作者: 孙亚隆(通信作者),男,1995年出生,博士研究生。主要研究方向为微制造、柔性热管制造。E-mail:meylsun@mail.scut.edu.cn
  • 作者简介:汤勇,男,1962年出生,博士,教授,博士研究生导师。主要研究方向为微制造、表面功能结构制造。E-mail:ytang@scut.edu.cn
  • 基金资助:
    国家自然科学基金(51735004,51905352)和广东省重点领域研发计划(2019B090910001)资助项目。

Development Status and Perspective Trend of Flexible Heat Pipe

TANG Yong1,2,3, SUN Yalong1,3, TANG Heng2, WAN Zhenping1,3, YUAN Wei1,3   

  1. 1. School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640;
    2. College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen 518000;
    3. Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong, Guangzhou 510640
  • Received:2021-03-15 Revised:2021-10-15 Online:2022-05-20 Published:2022-07-07

摘要: 热管凭借高传热效率、高稳定性、长寿命和低成本等优势已经成为解决高性能微电子器件散热难题的主要方案。然而,日益兴起的柔性可穿戴式电子设备对高热流密度电子器件的散热系统提出柔性化需求,传统铜、铝基热管已经难以满足轻薄型柔性电子设备的散热需求。可弯曲、高性能、轻薄化的柔性热管逐渐成为热管技术的研究热点和发展方向。详细介绍柔性热管的结构类型、封装工艺和应用领域,重点综述目前国内外关于柔性热管在吸液芯结构和封装工艺等方面的研究进展,分析讨论其在柔性微电子器件散热领域应用中存在的不足,并对柔性热管的发展趋势进行科学预测与展望。

关键词: 柔性热管, 吸液芯结构, 微结构制造, 封装工艺, 散热

Abstract: Heat pipes, with the advantages of high heat transfer efficiency, high stability, long life and low cost, have become the main solution to the heat dissipation problem of high-performance microelectronic devices. However, the increasing popularity of flexible and wearable electronic devices raises the flexible demand for the heat dissipation system, while the traditional copper and aluminum heat pipes are unable to meet the heat dissipation demand of light and thin flexible electronic devices. The flexible heat pipe with the characteristics of flexible, high performance and lightweight has been proposed and has become the research focus of modern heat pipe technology. The structure types, encapsulation technology and application field of the flexible heat pipe are introduced, as well as the wicking structure and encapsulation technology at home and abroad are summarized. Furthermore, the shortcomings that existed on flexible heat pipe technology are pointed out and it is also suggested that more efforts should be made to what in the future.

Key words: flexible heat pipe, wick structure, microstructure manufacture, encapsulation technology, heat dissipation

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