冷却水进出方式对芯片散热器换热性能影响

doi:10.3901/JME.2018.10.188

机械工程学报 ›› 2018, Vol. 54 ›› Issue (10): 188-194.doi: 10.3901/JME.2018.10.188

• 可再生能源与工程热物理 • 上一篇下一篇

冷却水进出方式对芯片散热器换热性能影响

王雅博, 诸凯, 崔卓, 魏杰

天津商业大学天津市制冷技术重点实验室天津 300134

收稿日期:2017-07-24 修回日期:2018-01-05 出版日期:2018-05-20 发布日期:2018-05-20
通讯作者: 王雅博(通信作者),女,1984年出生,讲师。主要研究方向为电子芯片冷却。E-mail:wang_yabo@tjcu.edu.cn
基金资助:
国家自然科学基金（51376137）和天津市自然科学基金重点（13JCZDJC27300）资助项目。

Influence of the Location of the Inlet and Outlet on the Chip Heat Sink

WANG Yabo, ZHU Kai, CUI Zhuo, WEI Jie

Tianjin Key Laboratory of Refrigeration Technology, Tianjin University of Commerce, Tianjin 300134

Received:2017-07-24 Revised:2018-01-05 Online:2018-05-20 Published:2018-05-20

摘要/Abstract

摘要： 为了提高水冷散热器的散热能力、控制其温度均匀性，研究四种不同水冷散热器的进出水方式对芯片散热效果的影响。A型散热器采用传统的散热器形式，进出口位于散热器两端。B-D型散热器采用中间垂直射流，在散热器四角分别设置1个、2个、4个出水口。通过数值模拟分析不同冷却水流量下散热器的换热效果。数值模拟结果经过试验验证。通过Nu数、速度分布、压力损失、综合效应四个方面对散热器的换热性能进行分析。结果显示四出口散热器的Nu数低于单出口散热器，但流动阻力小，散热器综合系数较高，不会造成局部热点。中间射流四出口散热器具有较好的换热和流动效果。

关键词: 垂直射流, 进出水方式, 水冷散热器

Abstract: In order to enhance the heat-transfer capability and control the temperature uniformity of the water-cooled heat sink, four heat sinks with different layout of the inlet and outlet are numerically analyzed. Heat sink A is the traditional one whose inlet and outlet located at the two opposite corners. For B-D heat sink, the coolant vertically flows into the heat sink from the centre of the topwall. There are 1, 2, 4 outlets in the corners of the topwall for B-D heat sinks. The heat performance is evaluated by numerical simulation. The numerical results is validated by experimental results. The analysis depends on four parameters Nu number, velocity distribution, pressure loss and comprehensive effect. The numerical results indicated that the Nu number of the heat sink with four outlets is lower than that of the heat sink with one outlet. But the flow resistance is lower and the comprehensive coefficient is higher. There is no local heat spot in the four outlets heat sink. The heat sink with four outlets has better heat and flow effect.

Key words: the layout of inlet and outlet, vertical jet flow, water-cooled heat sink

中图分类号:

TK172

王雅博, 诸凯, 崔卓, 魏杰. 冷却水进出方式对芯片散热器换热性能影响[J]. 机械工程学报, 2018, 54(10): 188-194.

WANG Yabo, ZHU Kai, CUI Zhuo, WEI Jie. Influence of the Location of the Inlet and Outlet on the Chip Heat Sink[J]. Journal of Mechanical Engineering, 2018, 54(10): 188-194.

参考文献

[1] 宋思洪, 廖强, 沈卫东. 采用低熔点液态金属工质散热的热沉传热数值模拟[J].机械工程学报, 2011, 47(14):146-150. SONG Sihong, LIAO Qiang, SHEN Weidong. Numerical simulation on heat transfer of heat sink using liquid metal with low melting point as coolant[J]. Journal of Mechanical Engineering, 2011, 47(14):146-150.
[2] 鲁祥友,华泽钊,刘美静, 等. 基于热管散热的大功率LED热特性测量与分析[J]. 光电子·激光,2009(1):5-8. LU Xiangyou, HUA Zezhao, LIU Meijing, et al. Measurement and analysis on thermal characteristics of high power LED based on heat pipe[J]. Journal of Optoelectronics·Laser 2009(1):5-8.
[3] YEOM T, SIMON T, ZHANG T, et al. Enhanced heat transfer of heat sink channels with micro pin fin roughened walls[J]. International Journal of Heat and Mass Transfer,2016,92:617-627.
[4] PANDIT J, THOMPSON M, EKKAD S V, et al. Effect of pin fin to channel height ratio and pin fin geometry on heat transfer performance of flow in rectangular channels[J]. International Journal of Heat and Mass Transfer, 2014, 77:359-368.
[5] SAJEDI R, OSANLOO B, TALATI F, et al. Splitter plate application on the circular and square pin fin heat sink[J]. Microelectronics Reliability,2016,62:91-101.
[6] YOAV P, Ali K, CHANDAN M, et al. Forced convective heat transfer across a pin fin micro heat sink[J]. International Journal of Heat and Mass Transfer, 2005(48):3615-3627.
[7] 贾玉婷,夏国栋,马丹丹,等. 水滴型凹穴微通道流动与传热的熵产分析[J]. 机械工程学报,2017,53(4):141-148. JIA Yuting, XIA Guodong, MA Dandan, et al. Entropy generation analysis of flow and heat thansfer in microchannel with droplet reentrant cavities[J]. Journal of Mechanical Engineering,2017,53(4):141-148.
[8] ABDOLI A, JIMENEZ G, GEORGE S D. Thermo-fuid analysis of micro pin-fin array cooling configurations for high heat fluxes with a hot spot[J]. International Journal of Thermal Sciences, 2015(90):290-297.
[9] YANG D, WANG Y, DING G, et al. Numerical and experimental analysis of cooling performance of single-phase array microchannel heat sinks with different pin-fin configurations[J]. Applied Thermal Engineering, 2017(112):1547-1556.
[10] HUANG C, CHEN Y. An impingement heat sink module design problem in determining simultaneously the optimal non-uniform fin widths and heights[J]. International Journal of Heat and Mass Transfer, 2014, 73:627-633.
[11] NDAO S, HEE J, YOAV P, et al. Heat transfer enhancement from micro pin fins subjected to an impinging jet[J]. International Journal of Heat and Mass Transfer, 2012(55):413-421.
[12] NAPHON P, KLANGCHART S. Effects of outlet port positions on the jet impingement heat transfer characteristics in the mini-fin heat sink[J]. International Communications in Heat and Mass Transfer,2011,38(10):1400-1405.
[13] NAPHON P, KLANGCHART S. Investigation on the jet liquid impingement heat transfer for the central processing unit of personal computers[J]. International Communications in Heat and Mass Transfer, 2010, 37:822-826.
[14] 马鹏程,唐志国,刘轻轻,等. 新型单圆锥体热沉单孔射流散热数值模拟[J]. 机械工程学报, 2016, 52(24):136-141. MA Pengcheng, TANG Zhiguo, LIU Qingqing, et al. Numerical simulation of characteristic of heat transfer for jet impingement with new single cone heat sink through single spray nozzle[J]. Journal of Mechanical Engineering,2016, 52(24):136-141.
[15] MONOKROUSOS A, BRANDT, SCHLATTER P, et al. DNS and LES of estimation and control of transition in boundary layers subject to free-stream turbulence[J]. International Journal of Heat and Fluid Flow, 2008, 29(3):841-855.
[16] 高小明,李惟毅,汪建生. 一种低流阻表面的流动与传热特性[J]. 机械工程学报,2012,48(8):128-134. GAO Xiaoming, LI Weiyi, WANG Jiansheng. Flow and heat transfer characteristics of low flow resistance surface[J]. Journal of Mechanical Engineering, 2012, 48(8):128-134.
[17] BLADIMIR R, LI P, LIU H, et al. CFD study of liquid-cooled heat sinks with microchannel flow field configurations for electronics, fuel cells, and concentrated solar cells[J]. Applied Thermal Enginnering, 2011, 31(14-15):2494-2507.
[18] 崔卓, 诸凯, 王雅博, 等. 高热流密度器件水冷散热器结构性能的实验研究[J]. 化工进展, 2016, 35(5):1338-1343. CUI Zhuo, ZHU Kai, WANG Yabo, et al. Experimental study on water-cooled radiator structure performance of high heat flux device[J]. Chemical Industry and Engineering Progress, 2016, 35(5):1338-1343.

冷却水进出方式对芯片散热器换热性能影响

Influence of the Location of the Inlet and Outlet on the Chip Heat Sink

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