• CN:11-2187/TH
  • ISSN:0577-6686

›› 2011, Vol. 47 ›› Issue (14): 70-75.

• 论文 • 上一篇    下一篇

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不同壳厚聚苯乙烯/氧化铈复合磨料的合成及其抛光特性

陈杨;隆仁伟;陈志刚;陆锦霞   

  1. 常州大学材料科学与工程学院;常州大学先进金属材料常州重点实验室;苏州科技学院化学与生物工程学院
  • 发布日期:2011-07-20

Synthesis and Polishing Behavior of Polystyrene/Ceria Composite Abrasives with Different Shell Thickness

CHEN Yang;LONG Renwei;CHEN Zhigang;LU Jinxia   

  1. School of Materials Science and Engineering, Changzhou University Key Laboratory of Advanced Metallic Materials of Changzhou City, Changzhou University Department of Chemistry and Bioengineering, Suzhou University of Science and Technology
  • Published:2011-07-20

摘要: 以表面带负电荷的聚苯乙烯(Polystyrene, PS)微球为内核,采用液相工艺合成不同壳厚的聚苯乙烯/氧化铈(PS/CeO2)核壳包覆结构复合磨料,并用透射电子显微镜、场发射扫描电子显微镜、激光拉曼(Raman)光谱仪、热重示差扫描量热仪和动态光散射仪等手段对样品进行表征。用原子力显微镜观察和测量抛光表面的微观形貌、轮廓及粗糙度,考察复合磨料壳厚对硅晶片热氧化层抛光性能的影响。结果表明,所制备的PS/CeO2复合磨料呈规则球形,粒径在200~250 nm,壳厚在10~30 nm。化学机械抛光结果显示,PS/CeO2复合磨料对硅晶片热氧化层表现出良好的抛光特性,且复合磨料壳厚对抛光表面粗糙度和材料去除率具有较大影响。经壳厚为20 nm的复合磨料抛光后晶片表面在5 μm×5 μm范围内粗糙度平均值和方均根值分别为0.196 nm和0.254 nm,材料去除率为568.2 nm/min。

关键词: 复合磨料, 核壳结构, 壳厚, 抛光, 氧化铈

Abstract: Composite polystyrene-core ceria-shell abrasives are synthesized by direct chemical deposition reaction of Ce(NO3)3 and C6H12N4 on the surface of negative-charged polystyrene (PS) microsphere. The CeO2 shell thickness of composite abrasives can be tuned by changing the concentration of Ce(NO3)3 in the reaction solution. The as-synthesized samples are characterized by techniques of transmission electron microscope (TEM), field emission scanning electron microscope (FESEM), Raman spectroscope (RS), thermogravimetric analysis(TGA)and dynamic light scattering (DLS) measurements. Effects of the CeO2 shell thickness of PS/CeO2 composite abrasives on oxide chemical mechanical polishing (CMP) performance are also investigated by using atomic force microscope (AFM). The results indicate that the core-shell structured PS/CeO2 composite abrasives are in regular spherical shape with a diameter of 200~250 nm, and the shell thickness is about 10~30 nm. The CMP test results confirm that there is an obvious effect of the shell thickness of composite abrasives on oxide CMP behavior. The CMP performance is better and then worse with the increase of shell thickness from 10 to 30 nm. When the CeO2 shell thickness is 20 nm, Ra and root-mean-square roughness within 5 μm×5 μm area of thermal oxide film surface after polishing is 0.196 and 0.254 nm respectively. Moreover, the material removal rate can reach to 568.2 nm/min.

Key words: Ceria, Composite abrasive, Core-shell structure, Polishing, Shell thickness

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