• CN:11-2187/TH
  • ISSN:0577-6686

›› 1998, Vol. 34 ›› Issue (5): 106-110.

• 论文 • 上一篇    

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基于润湿识别的SMT激光软钎焊焊点质量控制研究

梁旭文;王春青;姜伟雁;钱乙余   

  1. 中国科学院上海冶金研究所传感技术国家重点实验室;哈尔滨工业大学
  • 发布日期:1998-09-01

SOLDER JOINT QUALIFICATION BASED ON THE WETTING RECOGNITION IN SMT LASER SOLDERING

Liang Xuwen;Wang Chunqing;Jiang Weiyan;Qian Yiyu   

  1. Shanghai Institute of Metallurgy, Chinese Academy of Sciences Harbin Institute of Technology
  • Published:1998-09-01

摘要: 采用高速摄影试验方法研究表面组装激光软钎焊焊点动态形成过程及焊点红外辐射信号与焊点形成过程的关系,发现钎料的润湿过程造成红处辐射信号及其动态微分信号的突变,提出基于润湿识别的焊点质量控制方法及算法。结果表明,该控制算法能保证形成良好的激光软钎焊焊点并严格避免烧毁。根据信号的特征还可以识别出多种工艺缺陷并可进行预测控制。

关键词: 红外辐射, 激光软钎焊, 润湿识别, 质量控制

Abstract: The joint dynamic formation process and the relationship between the infrared radiation signal and the joint formation are studied by high speed photography in SMT laser soldering. The kinks of the infrared and its differential signal curves appeared in the wetting process of the solder, therefore the joint qualification method and algorithm based on wetting recognition are put forward. Good joint can be formed and destroy can be averted during laser soldering due to the solder joint qualification. Some defects are recognized and avoided in advance as well according to the analysis of the characteristics of the infrared signals.

Key words: Infrared radiation, Laser soldering, Quality control, Wetting recognition

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