论高性能电子装备机电耦合技术现状与发展

doi:10.3901/JME.2023.20.338

摘要/Abstract

摘要： 高性能电子装备被广泛应用于陆、海、空、天等领域中的雷达、深空探测、射电天文、通信、导航、遥感等方面，其设计与制造水平是国家整体科技水平与实力的重要体现。系统回顾了高性能电子装备机电一体化技术的发展历程，论述机电分离、机电综合、机电耦合等三个不同发展阶段的特征与内涵，进而明确机电一体化技术鲜明的代际演进，并揭示电子装备机电耦合技术的内涵与特征。在此基础上，结合反射面天线、平面裂缝天线、有源相控阵天线等典型实例，建立电子装备电磁场-位移场-温度场的场耦合理论模型，揭示非线性机械结构因素对平板裂缝天线、有源相控阵天线等电子装备电性能的影响机理。最后，面向未来高性能电子装备的发展趋势，探讨机电耦合理论与技术需应对的新挑战。

关键词: 电子装备, 机电分离, 机电综合, 机电耦合

Abstract: High-performance electronic equipment(HPEE) is extensively applied in the areas of radar, deep-space detection, radio astronomy, communication, navigation, remote sensing and so on. Its design and manufacturing capabilities are the important sign of national scientific and technological level and strength. The development of mechatronics of HPEE is reviewed in term of design, and the three phases, i.e., Independent/Syntheses/Coupling between mechanical and electronic technologies (IMET/SMET/CMET), are described. The distinct evolution progress in mechatronic is shown, and the connotation and advantage of CMET of electronic equipment are revealed. On this basis, with typical cases such as reflector antenna, planar slot antenna(PSA) and active phased array antenna(APAA), the electromagnetic field-displacement field-temperature field coupling model of HPEE is mathematically deduced. The influence mechanism(IM) of nonlinear mechanical & structural factors on the electromagnetic performance of HPEE of PSA and APAA is revealed. Finally, aiming at the future development, the new challenges in electromechanical coupling theories and technologies are proposed.

Key words: electronic equipment, independent between mechanical and electronic technologies(IMET), syntheses between mechanical and electronic technologies(SMET), coupling between mechanical and electronic technologies(CMET)

中图分类号:

TH39

许万业, 段宝岩. 论高性能电子装备机电耦合技术现状与发展[J]. 机械工程学报, 2023, 59(20): 338-356.

XU Wanye, DUAN Baoyan. Review of Electromechanical Coupling Technologies of High-performance Electronic Equipment[J]. Journal of Mechanical Engineering, 2023, 59(20): 338-356.

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