半导体基片超精密磨削技术的研究现状与发展趋势

doi:10.3901/JME.2023.19.299

摘要/Abstract

摘要： 单晶硅、碳化硅、氧化镓、氮化镓等半导体基片广泛应用于集成电路、功率器件和微传感器等半导体器件的制造。超精密磨削是半导体基片平整化加工和背面减薄加工的核心工艺技术，对半导体器件的加工效率及加工质量具有重要的影响。为了满足半导体器件的使用性能，半导体材料的种类逐渐增多，半导体基片的加工要求不断提高，对半导体基片超精密磨削技术不断提出新的挑战。为了实现半导体基片的高效率高质量磨削加工，需要对半导体基片超精密磨削理论、工艺、工具和装备全面深入的理解。围绕半导体基片超精密磨削加工的表面材料去除机理、表面质量及控制方法、高效低损伤磨削工艺和超精密磨削装备的国内外研究现状进行了系统的论述与总结，分析了目前半导体基片超精密磨削技术面临的难题及未来的发展趋势，为后续半导体基片超精密磨削技术的研究提供指导。

关键词: 半导体基片, 磨削, 机理, 工艺, 工具, 磨床

Abstract: Semiconductor substrates such as monocrystalline silicon, silicon carbide, gallium oxide, and gallium nitride are widely used in the manufacture of semiconductor devices, including integrated circuits, power devices, and microsensors. Ultra-precision grinding is the critical technology for flattening and thinning semiconductor substrates, exerting a significant influence on the machining efficiency and quality of semiconductor devices. To fulfill the requirements of semiconductor devices, there is an increasing variety of semiconductor materials, and the machining demands for semiconductor substrates are continuously advancing. As a result, it consistently present new challenges to the ultra-precision grinding technology utilized in semiconductor substrate manufacturing. In order to realize high-efficiency and high-quality in the grinding of semiconductor substrates, it is imperative to acquire a comprehensive and in-depth understanding of ultra-precision grinding theory, machining process, grinding wheel and equipment. A comprehensive discussion and summarization of the research status of material removal mechanism, surface quality and its control methods are presented, which delves into the realm of high-efficiency low-damage grinding process and ultra-precision grinding equipment used for semiconductor substrates. Offering insights into upcoming research directions for semiconductor substrate ultra-precision grinding technology is made possible through a comprehensive examination of present obstacles and prospective development patterns.

Key words: semiconductor substrate, grinding, mechanism, machining process, grinding wheel, grinding equipment

中图分类号:

TG156

郭东明, 康仁科. 半导体基片超精密磨削技术的研究现状与发展趋势[J]. 机械工程学报, 2023, 59(19): 299-329.

GUO Dongming, KANG Renke. State-of-the-art and Prospectives of Ultra-precision Grinding Technology for Semiconductor Substrates[J]. Journal of Mechanical Engineering, 2023, 59(19): 299-329.

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