SiP器件组装焊点形态预测及其随机振动可靠性仿真研究

doi:10.3901/JME.2022.02.276

机械工程学报 ›› 2022, Vol. 58 ›› Issue (2): 276-283.doi: 10.3901/JME.2022.02.276

• 微纳连接界面与可靠性 • 上一篇下一篇

扫码分享

SiP器件组装焊点形态预测及其随机振动可靠性仿真研究

撒子成¹, 王尚¹, 冯佳运¹, 马竟轩¹, 张宁², 于广良², 梁洁玫², 田艳红¹

1. 哈尔滨工业大学先进焊接与连接国家重点实验室哈尔滨 150001;
2. 北京控制工程研究所星载计算机及电子产品研制中心北京 100089

收稿日期:2021-09-30 修回日期:2021-11-30 出版日期:2022-01-20 发布日期:2022-03-19
通讯作者: 田艳红(通信作者),女,1975年出生,博士,教授,博士研究生导师。主要研究方向为微连接与电子封装,纳米材料与器件。E-mail:tianyh@hit.edu.cn
作者简介:撒子成,男,1997年出生,博士研究生。主要研究方向为微连接与电子封装。E-mail:sazc@hit.edu.cn
基金资助:
黑龙江省“头雁”团队经费资助项目。

Simulation of SiP Solder Joint Geometry and Random Vibration Reliability Prediction

SA Zicheng¹, WANG Shang¹, FENG Jiayun¹, MA Jingxuan¹, ZHANG Ning², YU Guangliang², LIANG Jiemei², TIAN Yanhong¹

1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001;
2. Development Center of On-Board Computer and Electronics, Beijing Institute of Control Engineering, Beijing 100089

Received:2021-09-30 Revised:2021-11-30 Online:2022-01-20 Published:2022-03-19

摘要/Abstract

摘要： 针对振动条件下系统级封装（System in Package，SiP）器件的振动可靠性问题，利用ANSYS软件进行随机振动仿真，并对模型进行参数校正从而获得器件的随机振动疲劳寿命。首先，采用Surface Evolver软件对鸥翼形引脚焊点形态进行预测，并将模型数据导入ANSYS中完成模型建立；进行不同载荷量级的正弦振动试验，对SiP器件模型进行材料参数校正，并对校正后模型进行振动仿真，获得危险点应力数据，结合试验所得的疲劳寿命数据拟合得到材料的S-N曲线；最后，通过随机振动仿真分析确定器件危险薄弱点，通过S-N曲线和Dirlik寿命预测模型，得到SiP器件的随机振动可靠性寿命。本文介绍了针对SiP器件的随机振动可靠性试验及模拟结果，提出了针对器件寿命的评价通用方法，为器件在整机应用条件下的寿命评价提供理论依据。

关键词: 焊点形态预测, 随机振动, 可靠性, 有限元分析

Abstract: On the issue of the reliability of System in Package (SiP) devices under vibration, ANSYS is used to simulate the process of random vibration. The material parameters of the model are corrected to obtain the random vibration fatigue life of the device. Firstly, the solder joint geometry of the gull wing lead is simulated by Surface Evolver, and the calculation result is imported into ANSYS. Sinusoidal vibration experiments are carried out under different load levels to correct material parameter. The stress at dangerous points is calculated by vibration simulation. The S-N curve is obtained by fitting the sinusoidal vibration experimental data and the simulation data. Finally, the weak points of the device are obtained through random vibration simulation. The S-N curve obtained above is utilized in the random vibration fatigue life prediction model to get the fatigue life of the SiP device. The random vibration reliability experiment and simulation results for SiP devices are introduced. A general method for fatigue life prediction is established, which provides reference for the whole machine fatigue life prediction.

Key words: solder joint geometry prediction, random vibration, reliability, finite element analysis

中图分类号:

TG156

撒子成, 王尚, 冯佳运, 马竟轩, 张宁, 于广良, 梁洁玫, 田艳红. SiP器件组装焊点形态预测及其随机振动可靠性仿真研究[J]. 机械工程学报, 2022, 58(2): 276-283.

SA Zicheng, WANG Shang, FENG Jiayun, MA Jingxuan, ZHANG Ning, YU Guangliang, LIANG Jiemei, TIAN Yanhong. Simulation of SiP Solder Joint Geometry and Random Vibration Reliability Prediction[J]. Journal of Mechanical Engineering, 2022, 58(2): 276-283.

参考文献

[1] ERNST M,HABTOUR E,DASGUPTA A,et al. Comparison of electronic component durability under uniaxial and multiaxial random vibrations[J]. Journal of Electronic Packaging,2015,137(1):0110091-0110098.
[2] STEINBERG D S. Vibration analysis for electronic equipment[M]. New York:Wiley,2000.
[3] CHE F X,PANG J H L. Vibration reliability test and finite element analysis for flip chip solder joints[J]. Microelectronics Reliability,2015,49(7):754-760.
[4] CHE F X,PANG J H L. Study on reliability of PQFP assembly with lead free solder joints under random vibration test[J]. Microelectronics Reliability,2015,55(12):2769-2776.
[5] PERKINS A,SITARAMAN S K. Vibration-induced solder joint failure of a ceramic column grid array (CCGA) package[C]//54th Electronic Components & Technology Conference. Las Vegas,2004,1271-1278.
[6] LU T,ZHOU B,PAN K,et al. Harmonic vibration analysis and S-N curve estimate of PBGA mixed solder joints[C]//15th International Conference on Electronic Packaging Technology. Chengdu,2014:778-782.
[7] ZHANG H W,LIU Y,WANG J,et al. Failure study of solder joints subjected to random vibration loading at different temperatures[J]. Journal of Materials Science,2015,26(4):2374-2379.
[8] LIU F,MENG G. Random vibration reliability of BGA lead-free solder joint[J]. Microelectronics Reliability,2014,54(1):226-232.
[9] 潘骏,张雯,张利彬,等. 电连接器接触件振动可靠性试验评估[J]. 机械工程学报,2021,57(10):257-266. PAN Jun,ZHANG Wen,ZHANG Libin,et al. Vibration reliability test assessment of electrical connector contacts[J]. Journal of Mechanical Engineering,2021,57(10):257-266.
[10] KIM Y K,HWANG D S. PBGA packaging reliability assessments under random vibrations for space applications[J]. Microelectronics Reliability,2015,55(1):172-179.
[11] ZHOU Y,AL-BASSYIOUNI M,DASGUPTA A. Harmonic and random vibration durability of SAC305 and Sn37Pb solder alloys[J]. Components and Packaging Technologies,2010,33(2):319-328.
[12] SAMAVATIAN M,ILYASHENKO L K,SURENDAR A,et al. Effects of system design on fatigue life of solder joints in BGA packages under vibration at random frequencies[J]. Journal of Electronic Materials,2018,44(11):6781-6790.
[13] COFFIN L F. A study of the effects of cyclic thermal stresses on a ductile metal[J]. Transactions American Society of Mechanical Engineers,1954,76:931-950.
[14] MANSON S S. Fatigue:A complex subject-some simple approximation[J]. Experimental Mechanics,1965,5:193-226.
[15] BASQUIN O H. The exponential law of endurance tests[J]. American Society of Mechanical Engineers Proceedings,1910:625-630.
[16] MATSUISHI M,ENDO T. Fatigue of metals subjected to varying stress-fatigue lives under random loading[C]//Kyushu District Meeting. Japan,1968:37-40.
[17] AKAY H U,PAYDAR N H,BILGIC A. Fatigue life predictions for thermally loaded solder joints using a volume-weighted averaging technique[J]. Journal of Electronic Packaging,1997,119(4):228-235.
[18] DIRLIK T. Application of computers in fatigue analysis[M]. Coventry:University of Warwick,1985.

SiP器件组装焊点形态预测及其随机振动可靠性仿真研究

Simulation of SiP Solder Joint Geometry and Random Vibration Reliability Prediction

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 15

编辑推荐

Metrics

本文评价

[1]	赵承伟, 张文豪, 龚天诚, 张逸云, 王长涛, 罗先刚. 平面光学元件超平整吸附装载的优化设计与分析[J]. 机械工程学报, 2024, 60(5): 241-248.
[2]	俞水, 吴晓, 郭鹏, 王志华. 基于首次穿越PDF自适应估计的时变可靠性分析方法[J]. 机械工程学报, 2024, 60(5): 264-275.
[3]	李莹, 张嘉方, 张钊墉, 王鑫丞, 张晋, 孔祥东. 斜盘式轴向柱塞泵柱塞颈部最小直径设计[J]. 机械工程学报, 2024, 60(4): 430-437.
[4]	曾少昔, 赵春田, 李红梅. 铁磁材料漏磁信号对拉伸应力的响应研究[J]. 机械工程学报, 2024, 60(20): 68-76.
[5]	钱萍, 刘鑫雨, 陈文华, 王哲, 郭明达. 电连接器用聚氨酯胶密封件贮存可靠性建模[J]. 机械工程学报, 2024, 60(20): 361-371.
[6]	张玄, 刘源, 侯耀东, 张承双, 尹维龙, 邓清扬. 考虑几何非线性的正交各向异性层合板随机振动响应数值解[J]. 机械工程学报, 2024, 60(2): 224-233.
[7]	韦新鹏, 姚中洋, 宝文礼, 张哲, 姜潮. 一种基于主动学习克里金模型的证据理论可靠性分析方法[J]. 机械工程学报, 2024, 60(2): 356-368.
[8]	赵欣, 黄金杰. 基于RSM-RVEA的FDM增材制造工艺参数优化方法[J]. 机械工程学报, 2024, 60(19): 277-297.
[9]	王文林, 张子波, 李英子, 吴永明, 王起新, 梁若霜. 液压缸可靠性试验与数据分析研究平台[J]. 机械工程学报, 2024, 60(18): 385-393.
[10]	杨旭锋, 程鑫, 刘泽清. 一种融合交叉熵自适应抽样与ALK模型的可靠性分析方法[J]. 机械工程学报, 2024, 60(16): 73-82.
[11]	李怡然, 尧军平, 梁超群, 肖鹏, 陈国鑫, 李步炜. 基于三维微观结构的SiC/AZ91D复合材料单轴拉伸过程中裂纹萌生扩展机制[J]. 机械工程学报, 2024, 60(16): 160-170.
[12]	胡俊宇, 韩旭, 陶友瑞, 李珊瑚, 张建宁. 一种考虑跟随误差的S形轨迹残余振动抑制可靠性分析方法[J]. 机械工程学报, 2024, 60(16): 390-399.
[13]	胡伟飞, 廖家乐, 郭云飞, 鄢继铨, 李光, 岳海峰, 谭建荣. 基于物理信息神经网络的时变可靠性分析方法[J]. 机械工程学报, 2024, 60(13): 141-153.
[14]	张显程, 谷行行, 刘宇, 王润梓, 宋鲁凯, 谢里阳, 赵丙峰, 夏侯唐凡, 李勇, 孙莉, 温建锋, 涂善东. 基于工程损伤理论的高温装备可靠性评估与运维管理[J]. 机械工程学报, 2024, 60(13): 154-172.
[15]	邓智铭, 黄土地, 黄洪钟, 尉询楷, 王浩. 变工况条件下角接触球轴承疲劳剥落故障演化加速试验载荷谱研究[J]. 机械工程学报, 2024, 60(13): 193-204.