多线切割中线网可靠度评价方法研究

doi:10.3901/JME.2017.23.174

机械工程学报 ›› 2017, Vol. 53 ›› Issue (23): 174-181.doi: 10.3901/JME.2017.23.174

多线切割中线网可靠度评价方法研究

黎振^1,2, 王敏杰¹, 蔡玉俊², 李国和², 潘鑫²

1. 大连理工大学机械工程学院大连 116024;
2. 天津职业技术师范大学天津市高速切削与精密加工重点实验室天津 300222

收稿日期:2017-04-11 修回日期:2017-10-19 发布日期:2017-12-05
作者简介:黎振,男,1978年出生,博士研究生,工程师。主要研究方向为难加工材料高精加工。E-mail:lzcy430121@163.com;王敏杰,男,1958年出生,教授,博士研究生导师。主要研究方向为高速切削与先进制造技术。E-mail:mjwang@dlut.edu.cn;蔡玉俊,男,1970年出生,教授。主要研究方向为模具先进制造技术。E-mail:cyjal@126.com;李国和,男,1979年出生,副教授,主要研究方向为高速切削;潘鑫,男,1981年出生,讲师。主要研究方向为数理统计理论。E-mail:panxin1943@sina.com。
基金资助:
天津科技创新体系及平台建设计划（14TXGCCX00011）、天津市高等学校创新团队培养计划（TD12-5043）、天津市高校“学科领军人才培养计划”（RC14-02）和天津职业技术师范大学科研发展基金（KJ15-03）资助项目。

Research on Wire Net Reliability Assessing Method in Multi-wire Sawing

LI Zhen^1,2, WANG Minjie¹, CAI Yujun², LI Guohe², PAN Xin²

1. School of Mechanical Engineering, Dalian University of Technology, Dalian 116024;
2. Tianjin Key Lab of High Speed Machining & Precision Machining, Tianjin University of Technology and Education, Tianjin 300222

Received:2017-04-11 Revised:2017-10-19 Published:2017-12-05

摘要/Abstract

摘要： 在多线切割加工过程中，断线是最严重的质量事故往往导致昂贵晶体材料的报废。如何选择合理的工艺参数保证钢线可靠性成为实际生产中亟待解决的问题。提出一种多线切割线网可靠度的评价方法。假设不同磨损量下钢线的断裂强度符合威布尔分布，采用线性回归法求取不同磨损量下钢线断裂强度的威布尔参数，推导出磨损钢线可靠度与张力及磨损量函数关系，建立线网串联离散模型，结合可靠性理论评价线网可靠度。为了验证该方法的实际效果，进行加工实验对该方法进行验证。试验结果表明：威布尔分布能较好地描述磨损钢线的断裂强度分布；线网可靠度与钢线张力及线网磨损量存在复杂的非线性关系；当线网最大磨损量取4 μm，7 μm，10 μm不同值条件下，当张力小于25 N，线网可靠度差别小，随着张力进一步增大，线网可靠度呈现抛物线降低，线网最大磨损量越大，线网可靠度下降速度越快；在张力为20 N、25 N、30 N条件下，线网最大磨损量从2 μm到10 μm时，线网可靠度分别呈现接近直线、平稳下降、断崖式下降后趋于平稳下降三种完全不同的现象。线网可靠度评价方法为合理选择张力控制最大磨损量防止断线事故的发生提供了理论依据。

关键词: 断线, 多线切割, 威布尔分布, 线网可靠度

Abstract: Wire breakage is the most serious quality accident which leads to the expensive materials scrapped in multi-wire sawing. How to select reasonable process parameters assuring wire reliability is an urgent problem. In this paper a method for assessing wire net reliability is presented. Assuming the fracture strength distribution of the worn wire is accordance with Weibull distribution, Weibull parameters of the samples is obtained using linear regression method and function relation of the wire reliability between wire tension and wire wear loss is derived. Then the wire web series discrete model is built. Furthermore wire web reliability is evaluated combining reliability theory. In order to verify the actual effect of this method, the experiments are conducted to verify the method. The experimental results show that the Weibull distribution can better describe the fracture strength distribution of the worn wire samples. There is a complicated nonlinear relationship between the wire net reliability, the wire tension and the wire net maximum wear loss. When wire net maximum wear loss is 4 μm, 7 μm, 10 μm, if the tension is less than 25 N, the difference of wire net reliability is small. Otherwise the wire net reliability decrease as parabola type with the increasing tension. Wire net reliability drops faster as more wire net wear loss. When wire tension is 20 N, 25 N, 30 N and wire wear maximum loss from 2 μm to 10 μm, wire net reliability drops with different types. The curves like horizontal line, steady slope line and plunge dropping line respectively. This method provide the theoretical rule for determining the reasonable slicing process reducing the risk of wire breakage.

Key words: multi-wire sawing, Weibull distribution, wire breakage, wire net reliability

中图分类号:

TH162

黎振, 王敏杰, 蔡玉俊, 李国和, 潘鑫. 多线切割中线网可靠度评价方法研究[J]. 机械工程学报, 2017, 53(23): 174-181.

LI Zhen, WANG Minjie, CAI Yujun, LI Guohe, PAN Xin. Research on Wire Net Reliability Assessing Method in Multi-wire Sawing[J]. Journal of Mechanical Engineering, 2017, 53(23): 174-181.

参考文献

[1] BHAGAVAT M, PRASAD V, KAO I. Elasto-hydrodynamic interaction in the free abrasive wafer slicing using a wire saw[J]. Journal of Tribology, 2000, 22(3):394-404.
[2] WANG Z, MIAO J, TAN C W. Acoustic transducers with a perforated damping backplate based on PZT/silicon wafer bonding technique[J]. Sensor Actuat A Phys., 2009, 149(2):277-283.
[3] WEI S B, KAO I. Vibration analysis of wire and frequency response in modern wiresaw manufacturing process[J]. J. Sound Vib., 2000, 231(5):1383-1395.
[4] LEE S, KIM H, KIM D, et al. Investigation on diamond wire break-in and its effects on cutting performance in multi-wire sawing[J]. International Journal of Advanced Manufacturing Technology, 2015, 87(1-4):1-8
[5] CLARK W I, SHIH A J, HARDIN C W, et al. Fixed abrasive diamond wire machining part I:precess monitoring and wire tension force[J]. Int. J. Mach. Tool. Manu., 2003, 43:523-532.
[6] MOLLER H J. Basic mechanisms and models of multi-wire sawing[J]. Advanced Engineering Material, 2004, 6(7):501-513.
[7] NG T W, NALLATHAMBY R. Optical evaluation of ingot fixity in semiconductor wafer slicing[J]. Optics and Laser Technology, 2004:36:641-645.
[8] PEI Z J, XIN X J, LIU W. Finite element analysis for grinding of wire-sawn silicon wafers:A design experiment[J]. Machine Tools and Manufacturing, 2003, 43:7-16.
[9] 邱明波. 半导体晶体材料放电加工技术研究[D]. 南京:南京航空航天大学, 2010. QIU Mingbo. Research on electrical discharged machining of semiconductor crystal materials[D]. Nanjing:Nanjing University of Aeronautics and Astronautics, 2010.
[10] GOODRICH A, HACKE P, WANG Qi. A wafer-based monocrystalline silicon photovoltaics road map:Utilizing known technology improvement opportunities for further reductions in manufacturing costs[J]. Solar Energy Materials&Solar Cells, 2013, 114:110-135.
[11] ZHU Liqun, KAO I. Galerkin-based modal analysis on the vibration of wire-slurry system in wafer slicing using a wiresaw[J]. Journal of Sound and Vibration, 2005, 283:589-620.
[12] 苗广志马玉通赵文华. 多线切割工艺断线问题的分析[J]. 电子工业专用设备, 2014(235):14-17. MIAO Guangzhi, MA Yutong, ZHAO Wenhua. Research on wire breakage problem in multi-wire cutting technology[J]. Equipment for Electronic Products Manufacturing, 2014(235):14-17.
[13] SCHWINDE S, BERG M, KYBERT M. New potential for reduction of kerf loss and wire[J]. Solar Energy Materials&Solar Cells, 2015, 136:44-47.
[14] DANIEL M, SCHOENFELDER S, HURKA B. Loss of wire tension in the wire web during the slurry based multi-wire sawing process[J]. Solar Energy Materials&Solar Cells, 2014, 120:346-355.
[15] LI Zhen, WANG Minjie, PAN Xin, et al. Slicing parameters optimizing based on constant wire wear loss model and experiments in multi-wire saw[J]. International Journal of Advanced Manufacturing Technology, 2015, 81(1):329-334
[16] HWANG Bin, PARK Kijung, KIMA H B, et al. Effect of tensile properties on the abrasive wear of steel saw wires used for silicon ingot slicing[J]. Wear, 2012, 290-291:94-98.
[17] GOODRICH A, HACKE P, WANG Qi. A wafer-based monocrystalline silicon photovoltaics road map:Utilizing known technology improvement opportunities for further reductions in Manufacturing costs[J]. Solar Energy Materials&Solar Cells, 2013, 114:110-135
[18] 茆诗松,汤银才,王玲玲. 可靠性设计[M]. 北京:高等教育出版社, 2008. MAO Shisong, TANG Yincai, WANG Lingling. Reliability design[M]. Beijing:Higher Education Press, 2008.
[19] YU Xuegong, WANG Peng, LI Xiaoqiang, et al. Thin Czochralski silicon solar cells based on diamond wire sawing technology[J]. Solar Energy Materials&Solar Cells, 2012, 98:337-342.
[20] HINES W W, MONTGOMERY D C. Probability and statistics in engineering and management science[M]. New York:John Wiley& Sons, 1990.
[21] 曾天翔, 杨先振, 王维翰. 可靠性及维修性工程手册[M]. 北京:国防工业出版社, 1994. ZENG Tianxiang, YANG Xianzhen, WANG Weihan. Handbook of reliability and maintainability engineering[M]. Beijing:National Defense Industry Press, 1994.
[22] 赵永翔. 低周疲劳短裂纹行为和可靠性分析[M]. 西安:西安交通大学出版社, 1998. ZHAO Yongxiang. Study on low cycle fatigue short crack behavior and reliability[M]. Xi'an:Xi'an Jiaotong University Press, 1998.
[23] LOFTUS G R, LOFTUS E F. Essence of statistics[M]. New York:Alfred A. Knopf, Inc., 1988
[24] KAPLAN S. On the method of discrete probability distributions in risk and reliability calculations application to seismic risk assessment[J]. Risk Analysis, 1981, 1:189-196.
[25] ROY D, DASGUPTA T. A discretizing approach for evaluating reliability of complex systems under stress-strength model[J]. IEEE Transactions on Reliability, 2001, 50(2):145-150.
[26] LI Zhen, CAI Yujun. Experiment on saw mark at the wafer's entrance of machining monocrystalline silicon by wire saw[C]//2010 International Conference on Mechanic Automation and Control Engineering, 2010:5749-5751
[27] KAO I. Technology and research of slurry wiresaw manufacturing systems in wafer slicing with free abrasive machining[J]. International Journal of Advanced Manufacturing Systems, 2004, 7(2):7-20.

多线切割中线网可靠度评价方法研究

Research on Wire Net Reliability Assessing Method in Multi-wire Sawing

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 11

编辑推荐

Metrics

本文评价

[1]	李海洋, 谢里阳, 刘杰, 袁延凯, 姚常辉, 姜春龙. 无失效数据场合智能换刀机器人中轴承的可靠性评估[J]. 机械工程学报, 2019, 55(2): 186-194.
[2]	南东雷, 贾志新, 李威. 基于似然比检验的双截尾威布尔分布区间估计^*[J]. 机械工程学报, 2017, 53(6): 203-212.
[3]	贾祥, 王小林, 郭波. 极少失效数据和无失效数据的可靠性评估[J]. 机械工程学报, 2016, 52(2): 182-188.
[4]	鲍官培, 周翟和, 章恺, 张霞, 赵明才, 汪炜. 太阳能硅片游离磨料电解磨削多线切割表面完整性研究[J]. 机械工程学报, 2016, 52(11): 201-206.
[5]	李玲玲, 马东娟, 李志刚. 基于状态监测数据的电器电接触性能评估[J]. 机械工程学报, 2015, 51(18): 198-203.
[6]	薛广进;李强;王斌杰;潘妩;李凯. 轨道车辆结构动应力谱分布的估计[J]. , 2013, 49(4): 102-105.
[7]	蒋近;戴瑜兴;郜克存;彭思齐. 多线切割机走线系统的张力控制[J]. , 2011, 47(5): 183-187.
[8]	彭思齐;戴瑜兴;蒋近. 带摆动机构的多线切割机控制系统研制[J]. , 2011, 47(19): 181-186.
[9]	曹军;丁雨田;曹文辉. 单晶铜键合丝制备过程中的断线研究[J]. , 2010, 46(22): 84-89.
[10]	张义兵;戴瑜兴;袁巨龙;熊万里. 多线切割机线张力控制系统设计实现[J]. , 2009, 45(5): 295-300.
[11]	崔卫民;薛红军;喻天翔;宋笔锋. 试验数据服从Weibull分布时可靠性试验最少试件数的确定[J]. , 2008, 44(1): 51-55.