Defect Inspection Method of Flip Chip Based on VMD-resonance Band-energy Entropy

doi:10.3901/JME.2025.10.250

Abstract

Abstract: The defect detection method for flip-chips based on the resonance band energy entropy is proposed to address the issue of limited defect feature information obtained from single-frequency ultrasonic excitation, which makes it challenging to detect typical defects. Firstly, the analytical values of the chip’s inherent frequencies are obtained by solving the theoretical model of flip-chip and analyzing the structural characteristics of the chip. Secondly, an improved variational mode decomposition(VMD) algorithm is proposed, which utilizes the Teager energy operator and multiple extreme value segmentation fusion algorithm to partition the vibration signal spectrum and determine the number of modes. The penalty factors and initial center frequencies of each intrinsic mode function(IMF) are estimated based on the frequency band boundaries and local maximum peak points. The effectiveness of the improved VMD algorithm in extracting the resonance band of the signal is validated through simulation signal analysis. Finally, the vibration signals of the flip-chip are analyzed using the improved VMD algorithm and compared with empirical mode decomposition and other methods. The results demonstrate that the improved VMD algorithm can accurately obtain the resonance band and energy entropy, further verifying the effectiveness of the resonance band energy entropy-based method for defect detection in flip-chip.

Key words: improved variational mode decomposition, resonance frequency band, energy entropy, flip chip, defect detection

CLC Number:

TN407

LI Ke, YU Chenghao, MING Xuefei, GU Jiefei, SU Lei, MICHAEL Pecht. Defect Inspection Method of Flip Chip Based on VMD-resonance Band-energy Entropy[J]. Journal of Mechanical Engineering, 2025, 61(10): 250-262.

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