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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Defect Inspection Method of Flip Chip Based on VMD-resonance Band-energy Entropy
LI Ke, YU Chenghao, MING Xuefei, GU Jiefei, SU Lei, MICHAEL Pecht
Journal of Mechanical Engineering . 2025, (
10
): 250 -262 . DOI: 10.3901/JME.2025.10.250
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