Solder Joint Inspection Using SAM Image through Sparse Reconstruction

doi:10.3901/JME.2023.06.095

Abstract

Abstract: An algorithm based on sparse representation was proposed to reconstruct high-resolution (HR) SAM images. Scanning acoustic microscope (SAM) is always used for defect detection of electronic packages, but the spatial resolution is limited by the frequency and penetration depth of ultrasound. The original SAM image with low resolution is adverse to defect recognition. The HR SAM image is obtained through dictionary training and sparse coefficient α solving. The Levenberg-Marquardt modified BP neural network (LM-BP) was used to classify the solder joints. Compared with the original image and the bicubic interpolation image, the peak signal-to-noise ratio of the sparsely reconstructed image is significantly increased, the quality of the SAM image is improved, the number of misidentified solder joints is reduced, and the error rate is reduced to 2.76%. The experimental results demonstrated that the sparse representation algorithm and the LM-BP neural network are effective and accurate for defect inspection of high-density packages.

Key words: flip chip, defects inspection, SAM, sparse representation, neural network method

CLC Number:

TG156

LU Xiangning, LIU Fan, HE Zhenzhi, LIAO Guanglan, SHI Tielin. Solder Joint Inspection Using SAM Image through Sparse Reconstruction[J]. Journal of Mechanical Engineering, 2023, 59(6): 95-102.

References

[1] HUANG J F,HE Z Z,LI C X,et al. Heat dissipation optimization and prediction for three-dimensional fan-out package[J]. International Journal of Thermal Sciences,2021(8):166.
[2] 关晓丹,梁万雷. 微电子封装技术及发展趋势综述[J]. 北华航天工业学院学报,2013(1):34-37. GUAN Xiaodan,LIANG Wanlei. Overview of microelectronic packaging technology and development trends[J]. Journal of Beihua Institute of Aeronautics and Astronautics,2013(1):34-37.
[3] 陈志文,梅云辉,刘胜,等. 电子封装可靠性:过去,现在及未来[J]. 机械工程学报,2021,57(16):248-268. CHEN Zhiwen,MEI Yunhui,LIU Sheng,et al. Reliability in electronic packaging:Past,now and future[J]. Journal of Mechanical Engineering,2021,57(16):248-268.
[4] 刘培生,杨龙龙,卢颖,等. 倒装芯片封装技术的发展[J]. 电子元件与材料,2014,33(2):1-5. LIU Peisheng,YANG Longlong,LU Ying,et al. The development of flip chip packaging technology[J]. Electronic Components and Materials,2014,33(2):1-5.
[5] SU L,Wang L Y,LI K,et al. Automated X-ray recognition of solder bump defects based on ensemble-ELM[J]. Science China Technological Sciences,2019,62(9):1512-1519.
[6] 李跃,田艳红,丛森,等. PCB组装板多器件焊点疲劳寿命跨尺度有限元计算[J]. 机械工程学报,2019,55(6):54-60. LI Yue,TIAN Yanhong,CONG Sen,et al. Multi-scale finite element analysis into fatigue lives of various component solder joints on printed circuit board[J]. Journal of Mechanical Engineering,2019,55(6):54-60.
[7] NOURANI A,AKBARI S,SPELT J K. Fracture load prediction of BGA solder joints:Cohesive zone modeling and experimental verification[J]. International Journal of Solids and Structures,2016,90(4):30-44.
[8] Sha Y,HE Z,DU J,et al. Intelligent detection technology of flip chip based on H-SVM algorithm[J]. Engineering Failure Analysis,2022,134:106032.
[9] 徐寒. 面向集成电路封装检测的X射线图像滤波与增强方法研究[D]. 广州:华南理工大学,2013. XU Han. Research on X-ray image filtering and enhancement methods for integrated circuit package inspection[D]. Guangzhou:South China University of Technology,2013.
[10] Liao G,Chen P,DU L,et al. Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration[J]. Microelectronics Reliability,2015,55(12):2826-2832.
[11] 高明阳. 电路板元件贴装缺陷视觉检测系统[D]. 武汉:华中科技大学,2007. GAO Mingyang. Circuit board component placement defect visual inspection system[D]. Wuhan:Huazhong University of Science and Technology,2007.
[12] 杨英豪,柳青,崔洁. 机器视觉在焊点检测中的应用[J]. 电子工业专用设备,2014(11):29-32. YANG Yinghao,LIU Qing,CUI Jie. Application of machine vision in solder joint inspection[J]. Special Equipment for Electronics Industry,2014(11):29-32.
[13] 班兆伟. 基于红外热成像技术的电子封装缺陷检测方法研究[D]. 北京:北京工业大学,2012. BAN Zhaowei. Research on defect detection method of electronic packaging based on infrared thermal imaging technology[D]. Beijing:Beijing University of Technology,2012.
[14] 陆向宁,何贞志,胡宁宁,等. 主动红外热成像焊球缺陷检测方法研究[J]. 机械工程学报,2016,52(10):17-24. LU Xiangning,HE Zhenzhi,HU Ningning,et al. Research on defects inspection of solder bumps using active infrared thermography technology[J]. Journal of Mechanical Engineering,2016,52(10):17-24.
[15] LU X,HE Z,SU L,et al. Detection of micro solder balls using active thermography technology and K-means algorithm[J]. IEEE Transactions on Industrial Informatics,2018,14(12):5620-5628.
[16] ZHAO L,HE Z,WANG Z,et al. Simulation and experimental investigation on active thermography test of the solder balls[J]. IEEE Transactions on Industrial Informatics,2020,16(3):1617-1624.
[17] VOGG G,HEIDMANN T,BRAND S. Scanning acoustic GHz-microscopy versus conventional SAM for advanced assessment of ball bond and metal interfaces in microelectronic devices[J]. Microelectronics Reliability,2015,55(9-10):1554-1558.
[18] 蒋洁. 基于分类字典稀疏表示的超分辨率重建算法的研究[D]. 广州:华南理工大学,2017. JIANG Jie. Research on super-resolution reconstruction algorithm based on sparse representation of classification dictionary[D]. Guangzhou:South China University of Technology,2017.