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  • ISSN：0577-6686
机械工程学报

机械工程学报 ›› 2017, Vol. 53 ›› Issue (2): 53-60.doi: 10.3901/JME.2017.02.053

• 材料科学与工程 • 上一篇    下一篇

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Bi和Ni元素对Cu/SAC/Cu微焊点体钎料蠕变性能的影响*

孔祥霞, 孙凤莲, 杨淼森, 刘洋   

  1. 哈尔滨理工大学材料科学与工程学院 哈尔滨 150040
  • 出版日期:2017-01-20 发布日期:2017-01-20
  • 作者简介:

    孔祥霞，女，1989年出生，博士研究生。主要研究方向为微电子封装焊点可靠性。

    E-mail：xiangxia0502@163.com

    孙凤莲(通信作者)，女，1957年出生，博士，教授，博士研究生导师。主要研究方向为绿色电子组装技术及可靠性。

    E-mail：sunfengl@hrbust.edu.cn

  • 基金资助:
    * 国家自然科学基金资助项目(51174069); 20160411收到初稿，20160907收到修改稿;

Effect of Bi and Ni Concentration on the Creep Behavior of the Bulks of Cu/SAC/Cu Micro Solder Joints

KONG Xiangxia, SUN Fenglian, YANG Miaosen, LIU Yang   

  1. School of Material Science and Engineering， Harbin University of Science and Technology， Harbin 150040
  • Online:2017-01-20 Published:2017-01-20

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496

摘要：

借助纳米压痕试验方法，对Cu/SAC305/Cu，Cu/SAC0705/Cu和Cu/SAC0705BiNi/Cu微焊点体钎料在不同最大载荷下的压入蠕变性能进行比较，并分析和讨论Bi、Ni元素的添加对低银Cu/SAC0705/Cu微焊点体钎料蠕变性能的影响。试验采用一次加载-卸载方式，加载时最大载荷分别为20 mN、30 mN、40 mN和50 mN，保载时间均为180 s。采用FEI SIRION扫描电子显微镜对微焊点体钎料在不同最大载荷下的压痕形貌进行观察。结果表明：在相同最大载荷和保载时间条件下，3种微焊点中Cu/SAC0705BiNi/Cu的蠕变深度和压痕尺寸均小于Cu/SAC305/Cu和Cu/SAC0705/Cu。在4种不同最大载荷下，与Cu/SAC0705/Cu微焊点体钎料相比，Cu/SAC0705BiNi/Cu微焊点体钎料的压入蠕变率分别降低了11.883%、16.059%、 8.815 7%和12.891%。Bi、Ni元素的添加，使Cu/SAC0705/Cu微焊点体钎料的蠕变应力指数提高了32.175%，有效提高了低银Cu/SAC0705/Cu微焊点体钎料的抗蠕变性能。

关键词: 抗蠕变性能, 纳米压痕, 蠕变应力指数, 微焊点

Abstract: The indentation creep behavior of the bulks of Cu/SAC305/Cu, Cu/SAC0705/Cu and Cu/SAC0705BiNi/Cu lead-free micro solder joints are comparatively investigated at different maximum load by nanoindentation method. And the Bi, Ni concentration on the creep behavior of the bulks of Cu/SAC0705/Cu micro solder joints are analyzed and discussed. The mode of loading-unloading is adopted. Here the holding time is 180 s and the maximum load is 20 mN, 30 mN, 40 mN, and 50 mN, respectively. The indentation morphologies of the bulks of the micro solder joints at different maximum load are observed by FEI SIRION scanning electron microscopy (SEM). The results indicate that the creep depth and indentation size of the bulks of Cu/SAC0705BiNi/Cu are smaller than that of Cu/SAC305/Cu and Cu/SAC0705/Cu at the same maximum load and holding time. Compared with the bulks of Cu/SAC0705/Cu micro solder joints, at four different maximum loads, the indentation creep rate (CIT) of the bulks of Cu/SAC0705BiNi/Cu micro solder joints are declined 11.883%, 16.059%, 8.815 7%, and 12.891%, respectively. The creep stress exponent of the bulks of Cu/SAC0705/Cu micro solder joints increases 32.175 % by adding Bi and Ni elements. The addition of Bi and Ni elements can effectively improve the creep resistance of the bulks of low-Ag Cu/SAC0705/Cu micro solder joints.

Key words: creep resistance, creep stress exponent, nanoindentation, micro solder joint

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