Bi和Ni元素对Cu/SAC/Cu微焊点体钎料蠕变性能的影响*
孔祥霞, 孙凤莲, 杨淼森, 刘洋
Effect of Bi and Ni Concentration on the Creep Behavior of the Bulks of Cu/SAC/Cu Micro Solder Joints
KONG Xiangxia, SUN Fenglian, YANG Miaosen, LIU Yang
机械工程学报
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2017, (2): 53
-60
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DOI: 10.3901/JME.2017.02.053
