Ag-GNSs/SnAgCu钎料纳米压痕变形行为研究

doi:10.3901/JME.2018.08.151

机械工程学报 ›› 2018, Vol. 54 ›› Issue (8): 151-156.doi: 10.3901/JME.2018.08.151

Ag-GNSs/SnAgCu钎料纳米压痕变形行为研究

徐连勇^1,2, 张舒婷^1,2, 荆洪阳^1,2, 韩永典^1,2

1. 天津大学材料科学与工程学院天津 300350;
2. 天津大学天津市现代连接技术重点实验室天津 300350

收稿日期:2017-06-12 修回日期:2017-09-20 出版日期:2018-04-20 发布日期:2018-04-20
通讯作者: 韩永典(通信作者),男,1983年出生,博士,副教授。主要研究方向为微连接材料设计、开发与可靠性。E-mail:hanyongdian@tju.edu.cn
作者简介:徐连勇,男,1975年出生,教授,博士研究生导师。主要研究方向为温结构完整性。E-mail:xulianyong@tju.edu.cn

Research on the Deformation Behavior of Ag-GNSs/SnAgCu Solders during Nanoindentation Tests

XU Lianyong^1,2, ZHANG Shuting^1,2, JING Hongyang^1,2, HAN Yongdian^1,2

1. School of Materials Science and Engineering, Tianjin University, Tianjin 300350;
2. Tianjin Key Laboratory of Advanced Joining Technology, Tianjin University, Tianjin 300350

Received:2017-06-12 Revised:2017-09-20 Online:2018-04-20 Published:2018-04-20

摘要/Abstract

摘要： 为了研究Ag-GNSs/SnAgCu钎料在微纳米尺度下的变形行为，采用恒加载速率/载荷法在室温下对复合钎料进行纳米压痕试验，通过载荷-压痕深度曲线分析，并结合压痕形貌，研究载荷-压痕深度曲线中出现屈服台阶（pop-in）现象的机制，以及复合钎料在纳米压痕试验中的变形情况。结果表明，载荷-深度曲线中存在的"pop-in"是由于纳米压痕过程发生了弹塑性变形的转变。弹塑性转变与位错的形核与生成有关，并且通过透射电子显微镜在压痕点附近观察到交错的位错网络。通过观察复合钎料的压痕形貌，发现了压痕附近存在明显的凸起现象，这与材料的屈服应力与弹性模量之比有关。凸起现象将导致通过Oliver-Pharr方法计算的接触面积比实际值小，而引起纳米压痕试验方法测量的硬度和弹性模量数值偏大。应用"半椭圆模型"对产生凸起现象的接触面积进行修正，再基于Oliver-Pharr方法求得硬度和弹性模量，修正后的结果与修正前相比，硬度降低了18.3%，弹性模量降低了9.5%。

关键词: SnAgCu钎料, 纳米压痕, 塑性变形, 微观组织

Abstract: The nanoindentation test is performed using constant loading methods on composite solders at room temperature to study the deformation behaviors at micro and nano scales. Through the analysis of the load-indentation depth curves and the indentation morphologies, the "pop-in" and the deformation mechanism is studied. The "pop-in" occurred in the load-depth curves and it is attributed to the elastic-plastic transitions. The transition is relevant to the nucleation of the dislocations. Many dislocation networks are observed around the indentation via TEM. The "pile-up" is found while observing the indentation morphologies, relevant to the ratio of Young's modulus and the yield stress. It results in a smaller result of the contact area and the values of the hardness and modulus is lager than reality. A semi-ellipse model is used to revise the result with "pile-up" and a new result of the hardness and Young's modulus is obtained based on the Oliver-Pharr method. The hardness is 18.3% lower that that before revising and the Young's modulus is 9.5% lower.

Key words: elastic deformation, microstructure, nanoindentation, SnAgCu solder alloys

中图分类号:

TB333

徐连勇, 张舒婷, 荆洪阳, 韩永典. Ag-GNSs/SnAgCu钎料纳米压痕变形行为研究[J]. 机械工程学报, 2018, 54(8): 151-156.

XU Lianyong, ZHANG Shuting, JING Hongyang, HAN Yongdian. Research on the Deformation Behavior of Ag-GNSs/SnAgCu Solders during Nanoindentation Tests[J]. Journal of Mechanical Engineering, 2018, 54(8): 151-156.

参考文献

[1] XU S, HU X, YANG Y, et al. Effect of carbon nanotubes and their dispersion on electroless Ni-P under bump metallization for lead-free solder interconnection[J]. Journal of Materials Science:Materials in Electronics. 2014, 25(6):2682-2691.
[2] HUA L, CHAN Y, WU Y, et al. The determination of hexavalent chromium (Cr6+) in electronic and electrical components and products to comply with RoHS regulations[J]. Journal of Hazardous Materials. 2009, 163(2-3):1360-1368.
[3] GUO F, LUCAS J, SUBRAMANIAN K. Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints[J]. Journal of Materials Science:Materials in Electronics, 2001, 12(1):27-35.
[4] XU L, CHEN X, JING H, et al. Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders[J]. Materials Science & Engineering A, 2016, 667:87-96.
[5] JING H, GUO H, WANG L, et al. Influence of Ag-modified graphene nanosheets addition into Sn-Ag-Cu solders on the formation and growth of intermetallic compound layers[J]. Journal of Alloys and Compounds, 2017, 702:669-678.
[6] 张国尚, 荆洪阳, 徐连勇, 等. 纳米压痕法测量80Au/20Sn焊料热力性能[J]. 焊接学报, 2009(9):53-56. ZHANG Guoshang, JING Hongyang, XU Lianyong, et al. Measurement on thermal performance of 80Au/20Sn solder by nanoindentation[J]. Journal of Welding, 2009(9):53-56.
[7] ROSHANGHIAS A, KOKABI A H, MIYASHITA Y, et al. Nanoindentation creep behavior of nanocomposite Sn-Ag-Cu solders[J]. Journal of Electronic Materials, 2012, 41(8):2057-2064.
[8] 孔祥霞,孙凤莲,杨淼森,等. Bi和Ni元素对Cu/SAC/Cu微焊点体钎料蠕变性能的影响[J]. 机械工程学报, 2017, 53(2):53-60. KONG Xiangxia, SUN Fenglian, YANG Miaosen, et al. Effect of Bi and Ni concentration on the creep behavior of the bulks of Cu/SAC/Cu micro solder joints[J]. Journal of Mechanical Engineering, 2017, 53(2):53-60.
[9] KIELY J, HWANG R, HOUSTON J. Effect of surface steps on the plastic threshold in nanoindentation[J]. Physical Review Letters, 1998, 81(20):4424-4427.
[10] 罗勇,葛世荣. Ti6Al4V合金的纳米硬度载荷依赖性实验研究[J]. 清华大学学报, 2007(11):1976-1979. LUO Yong, GE Shirong. Study on nano-hardness load dependence of Ti6Al4V composite alloys[J]. Journal of Tsinghua University, 2007(11):1976-1979.
[11] OLIVER W, PHARR G. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation[J]. Journal of Materials Research, 1992, 7(6):1564-1583.
[12] 蔡晶琦. 单晶铜纳米压痕初始塑性变形行为实验研究[D]. 哈尔滨:哈尔滨工业大学, 2006. CAI Jingqi. Experimental investigations on initial deformation behaviors of single crystal copper in nanoindentation[D]. Harbin:Harbin Institute of Technology, 2006.
[13] HAN Y, JING H, NAI S, et al. Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes[J]. Journal of Materials Science:Materials in Electronics, 2012, 23(5):1108-1115.
[14] OLIVER W, PHARR G. Measurement of hardness and elastic modulus by instrumented indentation:Advances in understanding and refinements to methodology[J]. Journal of Materials Research, 2004, 19(1):3-20.
[15] 王露萌. 双晶材料纳米压痕初始塑性变形行为的跨尺度模拟与实验研究[D]. 哈尔滨:哈尔滨工业大学, 2013. WANG Lumeng. Multiscale simulation and experimental research of initial plastic deformation behavior during nanoindentation of bicrystal material[D]. Harbin:Harbin Institute of Technology, 2013.
[16] MARQUES V, JOHNSTON C, GRANT P. Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 1:Young's modulus, hardness and deformation mechanisms as a function of temperature[J]. Acta Materialia, 2013, 61(7):2460-2470.
[17] CORCORAN, COLTON R, LILLEODDEN E, et al. Anomalous plastic deformation at surfaces:Nanoindentation of gold single crystals[J]. Physical Review B, 1997, 551(24):16057-16060.
[18] LORENZ D, ZECKER A, HILPERT U, et al. Pop-in effect as homogeneous nucleation of dislocations during nanoindentation[J]. Physical Review B, 2003, 67(17):386-393.
[19] MASON J, LUND A, SCHUH C. Determining the activation energy and volume for the onset of plasticity during nanoindentation[J]. Physical Review B Condensed Matter, 2006, 73(5):1-14.
[20] 张丽军, 单相高熵合金Al0.3CoCrFeNi纳米压痕蠕变和塑性变形行为研究[D]. 秦皇岛:燕山大学, 2015. ZHANG Lijun, Research on the nanoindentation creep and plastic deformation behavior of the single-phase Al0.3CoCrFeNi high-entropy alloy[D]. Qinhuangdao:Yanshan University, 2015.
[21] SCHUH C A, ARGON A S, NIEH T G, et al. The transition from localized to homogeneous plasticity during nanoindentation of an amorphous metal[J]. Philosophical Magazine, 2003, 83(22):2585-2597.
[22] BOLSHAKOV A, PHARR G. Influences of pileup on the measurement of mechanical properties by load and depth sensing indentation techniques[J]. Journal of Materials Research, 1998, 13(4):1049-1058.
[23] KEESE K, LI Z. Semi-ellipse method for accounting for the pile-up contact area during nanoindentation with the Berkovich indenter[J]. Scripta Materialia, 2006, 55(8):699-702.

Ag-GNSs/SnAgCu钎料纳米压痕变形行为研究

Research on the Deformation Behavior of Ag-GNSs/SnAgCu Solders during Nanoindentation Tests

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