关键词: 倒杯, 封装, 梁膜, 微机电系统, 微型, 压力传感器

Abstract: Researcher focused on the study of design, package, and fabrication for MEMS pressure sensor. For the request of different applying environment, relative mechanics structures have been come up, including micro pressure, beam-membrane, and flush structure. All structures are established and simulated; the parameters of dimensions are confirmed after optimized design. The process of fabrication and package are set up for minimize sensor size, bearing high temperature shock and performing high frequency response. Among those researches, a new beam-membrane structure is proposed for micro pressure measurement and this structure could decrease the contradiction between sensitivity and nonlinearity through adopting appropriate dimensions; the flush structure is designed for high frequency pressure measurement, especially for aerodynamics, aviation, and exploding test, which need 10 kHz to 1 MHz; the reliability would be improved by beam-membrane package structure for ultra-high temperature shock application, which has been simulated and confirmed through structure simulating. The performances have been tested, confirmed and compared, including simulations, statics testament and dynamic response experiments; the results show the corrections for each sensor design, setting model and fabrication process previous.

Key words: Beam-membrane, Flush structure, Micro pressure, Micro-electro-mechanical systems, Package, Pressure senor