• CN:11-2187/TH
  • ISSN:0577-6686

›› 2007, Vol. 43 ›› Issue (10): 98-102.

• 论文 • 上一篇    下一篇

数字光盘玻璃基片的三步抛光技术

雷红;雒建斌;路新春   

  1. 上海大学纳米科学与技术研究中心;清华大学摩擦学国家重点实验室
  • 发布日期:2007-10-15

THREE STEPS CHEMICAL MECHANICAL POLISHING TECHNOLOGY OF DIGITAL COMPACT DISC GLASS SUBSTRATE

LEI Hong;LUO Jianbin;LU Xinchun   

  1. Research Center of Nano-science and Nano-technology, Shanghai University State Key Laboratory of Tribology, Tsinghua University
  • Published:2007-10-15

摘要: 为得到超光滑的数字光盘母盘玻璃基片表面,研究玻璃基片的亚纳米级抛光技术。分别采用2 m、0.3 m超细氧化铈抛光液以及纳米氧化硅抛光液进行三步化学机械抛光(Chemical mechanical polishing, CMP),抛光后最终表面粗糙度Ra达到0.44 nm,为目前报道的数字光盘母盘玻璃基片抛光的最低值。原子力显微镜分析表明,抛光后的表面超光滑且无微观缺陷。通过对玻璃基片CMP中机械作用及化学作用进行分析,对抛光机理进行了探讨。

关键词: 玻璃基片, 化学机械抛光, 抛光液, 亚纳米级平整

Abstract: In order to get ultra-smooth glass substrate of digital compact disc (CD), 2 µm and 0.3 µm cerium dioxide slurries as well as 50 nm silica slurry are prepared respectively, and three steps chemical-mechanical polishing (CMP) of sodium-calcium glass substrate in the three slurries has been studied. Results show that during the first step polishing with 2 µm cerium dioxide slurry, a high material removal rate is reached and the average roughness Ra value of the polished surfaces can be decreased from previous 537.9 nm to 1.63 nm. In the second step CMP with 0.3 µm cerium dioxide slurry, the Ra value can be decreased to 0.73 nm. By using 50 nm silica slurry in the final CMP, the Ra value of the glass substrate surfaces can be further reduced to 0.44 nm, which is the lowest value reported to date for CD glass substrate polishing. Atom force microscopy (AFM) analysis shows that the polished surfaces are ultra-smooth without micro-defects. Based on the analyses of the mechanical and chemical effects during the glass substrate CMP, the CMP mechanism is deduced preliminarily.

Key words: Chemical mechanical polishing(CMP), Glass substrate, Slurry, Sub-nanometer scale planarization

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