• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2026, Vol. 62 ›› Issue (11): 430-444.doi: 10.3901/JME.260605

• 数字化设计与制造 • 上一篇    

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非理想表面胶接装配的位姿偏差计算方法及其应用

张健1, 张福礼1, 张国锐1, 夏焕雄1,2, 沈宏达1, 张秀敏1, 刘检华1,2   

  1. 1. 北京理工大学机械与车辆学院 北京 100081;
    2. 北京理工大学唐山研究院 唐山 063015
  • 收稿日期:2025-07-01 修回日期:2025-12-15 发布日期:2026-07-29
  • 作者简介:张健,男,1988年出生,博士,助理研究员。主要研究方向为装配预测技术、公差分析。E-mail:zhang_jian_2008@yeah.net;夏焕雄(通信作者),男,1987年出生,博士,副教授,博士研究生导师。主要研究方向为精密装配、胶接装配、多场耦合建模仿真。E-mail:hxia@bit.edu.cn

An Approach for Computation of Position and Orientation Deviations in Adhesive Assemblies with Non-ideal Surfaces and Its Applications

ZHANG jian1, ZHANG Fuli1, ZHANG Guorui1, XIA Huanxiong1,2, SHEN Hongda1, ZHANG Xiumin1, LIU Jianhua1,2   

  1. 1. School of Mechanical Engineering, Beijing Institute of Technology, Beijing 100081;
    2. Tangshan Research Institute, Beijing Institute of Technology, Tangshan 063015
  • Received:2025-07-01 Revised:2025-12-15 Published:2026-07-29

摘要: 位姿偏差计算是装配精度预测的核心问题。已有的位姿偏差计算方法多针对配合面初始定位引起的位姿偏差,但鲜有关注定位后的胶接紧固工艺对位姿偏差的影响,导致精密结构的装配精度预测结果难以准确反应实际情况。为此,提出了一种考虑非理想表面定位和胶接紧固两阶段的位姿偏差计算方法。首先,在初始定位阶段,利用位姿试探调整使装配自由度逐个被约束的策略确定了初始定位位姿偏差;然后,在胶接紧固阶段,建立热-力-固化度耦合的胶接紧固有限元分析模型,获得了胶粘剂固化收缩对结构变形的影响,并进一步利用最小二乘拟合获得了胶接紧固后的位姿偏差。通过实验验证了方法计算的有效性,又进一步将方法应用于某石英加速度计关键装配组件的同轴位姿精度预测,预测结果验证了胶粘紧固工艺对位姿偏差的影响不容忽视。研究工作丰富了装配精度预测技术内涵,可被借鉴于具有多阶段装配特征的零件位姿精准计算。

关键词: 非理想表面, 胶接装配, 位姿偏差, 装配精度预测, 石英加速度计

Abstract: Computation of position and orientation deviations(PODs) is a core issue in assembly accuracy prediction. Existing approaches primarily address PODs caused by initial surface positioning but seldom consider the effects of adhesive bonding processes. This limitation leads to predictions of assembly accuracy in precision structures failing to accurately align with actual assembly results. To address this, a novel two-stage approach is proposed, accounting for PODs from non-ideal surface positioning and adhesive bonding. In the initial positioning stage, a pose probing adjustment strategy is employed to sequentially constrain assembly degrees of freedom, thereby determining the initial positioning PODs. In the bonding stage, a coupled thermal-mechanical-curing finite element model is established to analyze the deformation induced by adhesive shrinkage during curing. The final PODs are determined using least-squares fitting. The effectiveness of the proposed approach is experimentally validated. Besides, this approach is implemented in predicting the coaxial assembly pose accuracy of a key quartz accelerometer component. Results revealed that the adhesive bonding process significantly affects PODs, highlighting its non-negligible impact. This study enhances the framework for assembly accuracy prediction and offers a reference for multi-stage assembly processes.

Key words: non-ideal surface, adhesive assembly, position and orientation deviations, assembly accuracy prediction, quartz accelerometer

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