磁流变变间隙动压平坦化加工力特性研究

doi:10.3901/JME.2023.01.231

机械工程学报 ›› 2023, Vol. 59 ›› Issue (1): 231-241.doi: 10.3901/JME.2023.01.231

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磁流变变间隙动压平坦化加工力特性研究

阎秋生, 蔡志航, 潘继生

广东工业大学机电工程学院广州 510006

收稿日期:2022-02-03 修回日期:2022-11-15 出版日期:2023-01-05 发布日期:2023-03-30
通讯作者: 潘继生(通信作者),男,1980年出生,博士,教授。主要研究方向为超精密加工与制造技术、光电晶片平坦化加工工艺、磁流变抛光技术、智能材料开发与应用。E-mail:panjisheng@gdut.edu.cn
作者简介:阎秋生,男,1962年出生,博士,教授,博士研究生导师。主要研究方向为光电子/微电子硬脆材料超精密加工理论与技术、材料节能节材加工技术等。E-mail:qsyan@gdut.edu.cn
基金资助:
国家自然科学基金（U1801259、52075102）和广东省自然科学基金（2019A1515010720）资助项目。

Study on the Polishing Forces Characteristics of Magnetorheological Variable Gap Dynamic Pressure Polishing

YAN Qiusheng, CAI Zhihang, PAN Jisheng

School of Electromechanical and Engineering, Guangdong University of Technology, Guangzhou 510006

Received:2022-02-03 Revised:2022-11-15 Online:2023-01-05 Published:2023-03-30

摘要/Abstract

摘要： 磁流变变间隙动压平坦化加工利用工件的轴向低频振动使磁流变液产生挤压强化效应，可以有效提高加工效果并使光电晶片快速获得纳米级表面粗糙度。通过旋转式测力仪试验研究不同变间隙参数对磁流变变间隙动压平坦化加工过程中抛光正压力的影响规律，结果表明，在工件轴向低频振动作用下，抛光正压力形成脉冲正值和负值周期性的动态变化过程；将工件轴向低频振动过程分解为下压过程与拉升过程，下压速度和拉升速度对动态抛光力有不同的响应特性；随着最小加工间隙的减小抛光正压力会急剧增大；设置最小加工间隙停留时间观察抛光正压力变化，可以发现在工件最小加工间隙停留期间抛光力从峰值逐渐衰减并趋于平稳；挤压振动幅值对抛光正压力影响较小。建立了磁流变变间隙动压平坦化加工材料去除模型，弄清了在动态压力作用下，磨料更新及其附加运动机制，研究了磁流变变间隙动压平坦化加工过程中磨料颗粒对工件表面柔性划擦和微量去除的作用机理，为磁流变变间隙动压平坦化加工的工艺优化提供了理论依据。

关键词: 光电晶片, 磁流变抛光, 变间隙动压, 抛光力, 平坦化加工

Abstract: Magnetorheological variable gap dynamic pressure polishing uses the axial low-frequency vibration of the workpiece to produce the extrusion strengthening effect of magnetorheological fluid, which can effectively improve the processing effect and make the photoelectric wafer quickly obtain nano surface roughness. The influence of different variable gap parameters on polishing pressure in magnetorheological variable gap dynamic pressure polishing process is studied by rotating dynamometer test. The results show that the polishing pressure changes periodically under the axial low-frequency vibration of the workpiece; The axial low-frequency vibration process of the workpiece can be divided into pressing process and pulling process. The pressing speed and the pulling speed have different response characteristics to the dynamic polishing force. The polishing pressure increases sharply with the decrease of the minimum machining clearance. When the minimum clearance residence time was set to observe the change of polishing pressure, it was found that the polishing force gradually weakened from the peak value and stabilized during the minimum clearance residence. The vibration amplitude has little effect on the pressure of polishing. A material removal model is established for magnetorheological variable gap dynamic pressure polishing, and the mechanism of abrasive regeneration and additional movement under the action of dynamic pressure was clarified. The mechanism of flexible scratching and micro removal of abrasive particles on workpiece surface during magnetorheological gap dynamic pressure polishing is studied, which provides a theoretical basis for the process optimization of magnetorheological variable gap dynamic pressure polishing.

Key words: photoelectric chip, magnetorheological polishing, variable gap dynamic pressure, polishing force, flattening

中图分类号:

TH161

阎秋生, 蔡志航, 潘继生. 磁流变变间隙动压平坦化加工力特性研究[J]. 机械工程学报, 2023, 59(1): 231-241.

YAN Qiusheng, CAI Zhihang, PAN Jisheng. Study on the Polishing Forces Characteristics of Magnetorheological Variable Gap Dynamic Pressure Polishing[J]. Journal of Mechanical Engineering, 2023, 59(1): 231-241.

参考文献

[1] 吉建伟, 山村和也, 邓辉. 面向单晶SiC原子级表面制造的等离子体辅助抛光技术[J]. 物理学报, 2021, 70(6):74-86. JI Jianwei, KAZUYA Y, DENG Hui. Plasma-assisted polishing for atomic surface fabrication of single crystal SiC[J]. Acta Physica Sinica, 2021, 70(6):74-86.
[2] 杨超, 李福坤, 任婷, 等. 碳化硅晶圆的快速高质量复合加工方法[J]. 光学学报, 2020, 40(13):147-152. YANG Chao, LI Fukun, REN Ting, et al. Fast and high quality composite processing method for silicon carbide wafers[J]. Acta Optica Sinica, 2020, 40(13):147-152.
[3] 徐嘉慧, 康仁科, 董志刚, 等. 硅片化学机械抛光技术的研究进展[J]. 金刚石与磨料磨具工程, 2020, 40(4):28-37. XU Jiahui, KANG Renke, DONG Zhigang, et al. Review on chemical mechanical polishing of silicon wafers[J]. Diamond & Abrasives Engineering, 2020, 40(4):28-37.
[4] 邓家云, 潘继生, 张棋翔, 等. 单晶SiC基片的化学机械抛光技术研究进展[J]. 金刚石与磨料磨具工程, 2020, 40(1):79-91. DENG Jiayun, PAN Jisheng, ZHANG Qixiang, et al. Research progress in chemical mechanical polishing of single crystal SiC substrates[J]. Diamond & Abrasives Engineering, 2020, 40(1):79-91.
[5] KORDONSKI W, JACOBS S. Model of Magnetorheological Finishing[J]. Journal of Intelligent Material Systems and Structures, 2016, 7(2):131-137.
[6] JACOBS S D, GOLINI D, HSU Y, et al. Magnetorheological finishing:A deterministic process for optics manufacturing[C]//International Conference on Optical Fabrication and Testing. SPIE, 1995, 2576:372-382.
[7] KORDONSKI W, GORODKIN S. Material removal in magnetorheological finishing of optics[J]. Applied Optics, 2011, 50(14):1984-1994.
[8] WANG Y Q, YIN S H, HUANG H, et al. Magnetorheological polishing using a permanent magnetic yoke with straight air gap for ultra-smooth surface planarization[J]. Precision Engineering, 2015, 40:309-317.
[9] BARMAN A, DAS M. Nano-finishing of bio-titanium alloy to generate different surface morphologies by changing magnetorheological polishing fluid compositions[J]. Precision Engineering, 2018, 51:145-152.
[10] KIM D W, CHO M W, SEO T I, et al. Experimental study on the effects of alumina abrasive particle behavior in MR polishing for MEMS applications[J]. Sensors, 2008, 8(1):222-235.
[11] MIAO C, SHAFRIR S, LAMBROPOULOS J, et al. Shear stress in magnetorheological finishing for glasses[J]. Applied Optics, 2009, 48(13):2585-2594.
[12] CHEN M, LIU H, CHENG J, et al. Model of the material removal function and an experimental study on a magnetorheological finishing process using a small ball-end permanent-magnet polishing head[J]. Applied Optics, 2017, 56(19):5573-5582.
[13] GUO H, WU Y, LU D, et al. Effects of pressure and shear stress on material removal rate in ultra-fine polishing of optical glass with magnetic compound fluid slurry[J]. Journal of Materials Processing Technology, 2014, 214(11):2759-2769.
[14] LIU J, LI X, ZHANG Y, et al. Predicting the material removal rate (MRR) in surface magnetorheological finishing (MRF) based on the synergistic effect of pressure and shear stress[J]. Applied Surface Science, 2019, 504:144492.
[15] 白振伟, 阎秋生, 徐西鹏. 集群磁流变效应平面抛光力特性试验研究[J]. 机械工程学报, 2015, 51(15):190-197. BAI Zhenwei, YAN Qiusheng, XU Xipeng. Experimental investigations into forces acting between cluster MR effect pad and workpiece surface[J]. Journal of Mechanical Engineering, 2015, 51(15):190-197.
[16] CHEN K, TIAN Y, SHAN L, et al. Squeeze behaviors of magnetic powders between two parallel plates[J]. Smart Materials and Structures, 2014, 23(11):117004.
[17] HEGGER C, MAAS J. Investigation of the squeeze strengthening effect in shear mode[J]. Journal of Intelligent Material Systems and Structures, 2016, 27(14):1895-1907.
[18] FARJOUD A, CAVEY R, AHMADIAN M, et al. Magneto-rheological fluid behavior in squeeze mode[J]. Smart Materials and Structures, 2009, 18(9):095001.
[19] HORAK W. Modeling of magnetorheological fluid in quasi-static squeeze flow mode[J]. Smart Materials and Structures, 2018, 27(6):065022.
[20] TAO R. Super-strong magnetorheological fluids[J]. Journal of Physics Condensed Matter, 2001, 13(50):R979-R999.
[21] 潘继生, 于鹏, 阎秋生. 动磁场磁流变效应抛光垫抛光力特性试验研究[J]. 机械工程学报, 2018, 54(6):10-17. PAN Jisheng, YU Peng, YAN Qiusheng. Experimental investigations on the polishing forces characteristics of dynamic magnetic field magnetorheological effect polishing pad[J]. Journal of Mechanical Engineering, 2018, 54(6):10-17.
[22] 阎秋生, 廖博涛, 路家斌, 等. 集群磁流变变间隙动压平坦化加工试验研究[J]. 机械工程学报, 2021, 57(19):230-238. YAN Qiusheng, LIAO Botao, LU Jiabin, et al. Experimental study on cluster magnetorheological variable gap dynamic pressure planarization finishing[J]. Journal of Mechanical Engineering, 2021, 57(19):230-238.
[23] LIU Z Y, LI F, LI X W, et al. Characteristic analysis and squeezing force mathematical model for magnetorheological fluid in squeeze mode[J]. Journal of Magnetism and Magnetic Materials, 2021, 529(2):167736.

磁流变变间隙动压平坦化加工力特性研究

Study on the Polishing Forces Characteristics of Magnetorheological Variable Gap Dynamic Pressure Polishing

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